JP5150050B2 - Cmosイメージセンサ及びその製造方法 - Google Patents
Cmosイメージセンサ及びその製造方法 Download PDFInfo
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- JP5150050B2 JP5150050B2 JP2005367846A JP2005367846A JP5150050B2 JP 5150050 B2 JP5150050 B2 JP 5150050B2 JP 2005367846 A JP2005367846 A JP 2005367846A JP 2005367846 A JP2005367846 A JP 2005367846A JP 5150050 B2 JP5150050 B2 JP 5150050B2
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- photodiode
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- transfer gate
- channel stop
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- 238000004519 manufacturing process Methods 0.000 title description 13
- 239000000758 substrate Substances 0.000 claims description 59
- 238000009792 diffusion process Methods 0.000 claims description 24
- 238000005468 ion implantation Methods 0.000 claims description 11
- 125000006850 spacer group Chemical group 0.000 claims description 8
- 239000012535 impurity Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 18
- 238000002955 isolation Methods 0.000 description 17
- 150000004767 nitrides Chemical class 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- WQJQOUPTWCFRMM-UHFFFAOYSA-N tungsten disilicide Chemical compound [Si]#[W]#[Si] WQJQOUPTWCFRMM-UHFFFAOYSA-N 0.000 description 1
- 229910021342 tungsten silicide Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14689—MOS based technologies
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Element Separation (AREA)
Description
図2は、本発明の第1の実施の形態に係るCMOSイメージセンサの単位画素の一部を示す断面図である。
図4は、本発明の第2の実施の形態に係るCMOSイメージセンサの単位画素の一部を示す断面図である。
111、211 パッド酸化膜
112、212 パッド窒化膜
113 ディープトレンチ
115、215 チャネルストップ層
117、217 ゲート絶縁膜
119、219 ゲート導電膜
120、220 ゲート電極
122、222 スペーサ
123、223 トランスファゲート
124、224 N−型フォトダイオード
126、226 フローティング拡散領域
130 素子分離膜
Claims (2)
- トレンチが形成された第1導電型の基板と、
エピタキシャル成長によって形成されて前記トレンチを埋め込む第1導電型のチャネルストップ層と、
前記基板の表面下に形成され、前記チャネルストップ層の一側に隣接する第2導電型のフォトダイオードと、
前記フォトダイオードに隣接する前記基板の上部表面に形成されて、前記フォトダイオードによって生成される光電荷を伝送するためのトランスファゲートと、
前記フォトダイオードと対向し、前記トランスファゲートに隣接する前記基板の表面下に形成され、前記トランスファゲートによって前記光電荷を受け取るフローティング拡散領域と
を備えてなり、
前記チャネルストップ層の底部は、前記基板の前記表面から、前記フォトダイオードの底部よりも深い位置にあることを特徴とするCMOSイメージセンサ。 - トレンチが形成された第1導電型の基板を提供するステップと、
エピタキシャル成長を実施して、前記第1導電型のチャネルストップ層を形成して前記トレンチを埋め込むステップと、
前記チャネルストップ層の一側の前記基板の表面上に、両側面にスペーサを備えるトランスファゲートを形成するステップと、
イオン注入を実施して、前記トレンチと前記トランスファゲートとの間の前記基板の表面下に第2導電型のフォトダイオードを形成するステップと、
前記フォトダイオードを形成する前記ステップの後に、イオン注入を実施して、前記フォトダイオードと対向し、前記トランスファゲートに隣接する前記基板の表面下に、前記トランスファゲートによって光電荷を受け取るフローティング拡散領域を形成するステップと
を含んでなり、
前記チャネルストップ層の底部は、前記基板の前記表面から、前記フォトダイオードの底部よりも深い位置にあることを特徴とするCMOSイメージセンサの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050085676A KR100748342B1 (ko) | 2005-09-14 | 2005-09-14 | 씨모스 이미지 센서의 제조방법 |
KR10-2005-0085676 | 2005-09-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007081358A JP2007081358A (ja) | 2007-03-29 |
JP5150050B2 true JP5150050B2 (ja) | 2013-02-20 |
Family
ID=37854124
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005367846A Active JP5150050B2 (ja) | 2005-09-14 | 2005-12-21 | Cmosイメージセンサ及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (4) | US7608872B2 (ja) |
JP (1) | JP5150050B2 (ja) |
KR (1) | KR100748342B1 (ja) |
CN (1) | CN100485947C (ja) |
TW (1) | TWI288476B (ja) |
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KR100748342B1 (ko) | 2005-09-14 | 2007-08-09 | 매그나칩 반도체 유한회사 | 씨모스 이미지 센서의 제조방법 |
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KR100748342B1 (ko) | 2007-08-09 |
CN100485947C (zh) | 2009-05-06 |
US20100044764A1 (en) | 2010-02-25 |
TWI288476B (en) | 2007-10-11 |
US7608872B2 (en) | 2009-10-27 |
US8815628B2 (en) | 2014-08-26 |
CN1933167A (zh) | 2007-03-21 |
US20100047950A1 (en) | 2010-02-25 |
JP2007081358A (ja) | 2007-03-29 |
US20070057147A1 (en) | 2007-03-15 |
US20120083066A1 (en) | 2012-04-05 |
US8084284B2 (en) | 2011-12-27 |
KR20070031046A (ko) | 2007-03-19 |
US8120062B2 (en) | 2012-02-21 |
TW200713571A (en) | 2007-04-01 |
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