JP5121901B2 - 発光装置およびその作製方法 - Google Patents
発光装置およびその作製方法 Download PDFInfo
- Publication number
- JP5121901B2 JP5121901B2 JP2010196492A JP2010196492A JP5121901B2 JP 5121901 B2 JP5121901 B2 JP 5121901B2 JP 2010196492 A JP2010196492 A JP 2010196492A JP 2010196492 A JP2010196492 A JP 2010196492A JP 5121901 B2 JP5121901 B2 JP 5121901B2
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- JP
- Japan
- Prior art keywords
- layer
- electrode layer
- oxide
- light
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/471—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having different architectures, e.g. having both top-gate and bottom-gate TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
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- Physics & Mathematics (AREA)
- Geometry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thin Film Transistor (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010196492A JP5121901B2 (ja) | 2009-09-04 | 2010-09-02 | 発光装置およびその作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009205075 | 2009-09-04 | ||
| JP2009205075 | 2009-09-04 | ||
| JP2010196492A JP5121901B2 (ja) | 2009-09-04 | 2010-09-02 | 発光装置およびその作製方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012232672A Division JP5584747B2 (ja) | 2009-09-04 | 2012-10-22 | 発光装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011076080A JP2011076080A (ja) | 2011-04-14 |
| JP2011076080A5 JP2011076080A5 (enExample) | 2012-09-13 |
| JP5121901B2 true JP5121901B2 (ja) | 2013-01-16 |
Family
ID=43647004
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010196492A Expired - Fee Related JP5121901B2 (ja) | 2009-09-04 | 2010-09-02 | 発光装置およびその作製方法 |
| JP2012232672A Expired - Fee Related JP5584747B2 (ja) | 2009-09-04 | 2012-10-22 | 発光装置 |
| JP2014147611A Withdrawn JP2015004978A (ja) | 2009-09-04 | 2014-07-18 | 半導体装置 |
| JP2015138580A Expired - Fee Related JP6028072B2 (ja) | 2009-09-04 | 2015-07-10 | 半導体装置 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012232672A Expired - Fee Related JP5584747B2 (ja) | 2009-09-04 | 2012-10-22 | 発光装置 |
| JP2014147611A Withdrawn JP2015004978A (ja) | 2009-09-04 | 2014-07-18 | 半導体装置 |
| JP2015138580A Expired - Fee Related JP6028072B2 (ja) | 2009-09-04 | 2015-07-10 | 半導体装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8890166B2 (enExample) |
| JP (4) | JP5121901B2 (enExample) |
| TW (1) | TWI539588B (enExample) |
| WO (1) | WO2011027702A1 (enExample) |
Families Citing this family (50)
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| KR101968855B1 (ko) * | 2009-06-30 | 2019-04-12 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 제조 방법 |
| WO2011027676A1 (en) | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| WO2011027701A1 (en) * | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and method for manufacturing the same |
| WO2011034068A1 (en) | 2009-09-16 | 2011-03-24 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and manufacturing method thereof |
| JP5490138B2 (ja) * | 2009-11-27 | 2014-05-14 | シャープ株式会社 | 薄膜トランジスタとその製造方法、半導体装置とその製造方法、並びに表示装置 |
| KR101731047B1 (ko) * | 2010-12-01 | 2017-05-12 | 삼성디스플레이 주식회사 | 적외선 감지 트랜지스터, 이를 포함하는 표시 장치의 제조 방법 |
| US9219159B2 (en) * | 2011-03-25 | 2015-12-22 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming oxide semiconductor film and method for manufacturing semiconductor device |
| US9960278B2 (en) * | 2011-04-06 | 2018-05-01 | Yuhei Sato | Manufacturing method of semiconductor device |
| TWI573277B (zh) | 2011-05-05 | 2017-03-01 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| JP6099336B2 (ja) | 2011-09-14 | 2017-03-22 | 株式会社半導体エネルギー研究所 | 発光装置 |
| JP5832399B2 (ja) | 2011-09-16 | 2015-12-16 | 株式会社半導体エネルギー研究所 | 発光装置 |
| KR20130061543A (ko) * | 2011-12-01 | 2013-06-11 | 삼성디스플레이 주식회사 | 픽셀간의 누설전류를 방지하는 유기발광소자 |
| TWI584383B (zh) * | 2011-12-27 | 2017-05-21 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| KR101879831B1 (ko) * | 2012-03-21 | 2018-07-20 | 삼성디스플레이 주식회사 | 플렉시블 표시 장치, 유기 발광 표시 장치 및 플렉시블 표시 장치용 원장 기판 |
| US8927869B2 (en) * | 2012-04-11 | 2015-01-06 | International Business Machines Corporation | Semiconductor structures and methods of manufacture |
| CN111477634B (zh) * | 2012-09-13 | 2023-11-14 | 株式会社半导体能源研究所 | 半导体装置 |
| US9129578B2 (en) * | 2012-09-28 | 2015-09-08 | Innocom Technology (Shenzhen) Co., Ltd. | Shift register circuit and display device using the same |
| DE112013006214B4 (de) * | 2012-12-25 | 2025-05-15 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung |
| KR102113149B1 (ko) * | 2012-12-28 | 2020-05-20 | 엘지디스플레이 주식회사 | 유기 발광 소자, 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법 |
| TWI624936B (zh) * | 2013-06-05 | 2018-05-21 | 半導體能源研究所股份有限公司 | 顯示裝置 |
| JP6410496B2 (ja) * | 2013-07-31 | 2018-10-24 | 株式会社半導体エネルギー研究所 | マルチゲート構造のトランジスタ |
| KR102197416B1 (ko) * | 2013-09-13 | 2020-12-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
| CN104460143B (zh) * | 2013-09-17 | 2017-12-15 | 瀚宇彩晶股份有限公司 | 像素结构及其制造方法 |
| US9269915B2 (en) * | 2013-09-18 | 2016-02-23 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| JP6570825B2 (ja) | 2013-12-12 | 2019-09-04 | 株式会社半導体エネルギー研究所 | 電子機器 |
| US20150177311A1 (en) * | 2013-12-19 | 2015-06-25 | Intermolecular, Inc. | Methods and Systems for Evaluating IGZO with Respect to NBIS |
| US9202690B2 (en) * | 2013-12-20 | 2015-12-01 | Intermolecular, Inc. | Methods for forming crystalline IGZO through annealing |
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| JP6506545B2 (ja) | 2013-12-27 | 2019-04-24 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP6523695B2 (ja) * | 2014-02-05 | 2019-06-05 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| KR102196335B1 (ko) * | 2014-08-13 | 2020-12-30 | 엘지디스플레이 주식회사 | 표시장치와 그 제조 방법 |
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| CN108878443B (zh) * | 2017-05-12 | 2020-06-09 | 京东方科技集团股份有限公司 | 显示面板、显示面板的制造方法和显示面板的绑定方法 |
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-
2010
- 2010-08-19 WO PCT/JP2010/064431 patent/WO2011027702A1/en not_active Ceased
- 2010-08-30 US US12/871,184 patent/US8890166B2/en not_active Expired - Fee Related
- 2010-09-01 TW TW099129492A patent/TWI539588B/zh not_active IP Right Cessation
- 2010-09-02 JP JP2010196492A patent/JP5121901B2/ja not_active Expired - Fee Related
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2012
- 2012-10-22 JP JP2012232672A patent/JP5584747B2/ja not_active Expired - Fee Related
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2014
- 2014-07-18 JP JP2014147611A patent/JP2015004978A/ja not_active Withdrawn
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2015228032A (ja) | 2015-12-17 |
| WO2011027702A1 (en) | 2011-03-10 |
| US20110057187A1 (en) | 2011-03-10 |
| JP2013033998A (ja) | 2013-02-14 |
| US8890166B2 (en) | 2014-11-18 |
| TWI539588B (zh) | 2016-06-21 |
| JP5584747B2 (ja) | 2014-09-03 |
| JP2015004978A (ja) | 2015-01-08 |
| JP2011076080A (ja) | 2011-04-14 |
| TW201125116A (en) | 2011-07-16 |
| JP6028072B2 (ja) | 2016-11-16 |
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