JP4998985B2 - 熱放出型テープパッケージ - Google Patents

熱放出型テープパッケージ Download PDF

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Publication number
JP4998985B2
JP4998985B2 JP2006291738A JP2006291738A JP4998985B2 JP 4998985 B2 JP4998985 B2 JP 4998985B2 JP 2006291738 A JP2006291738 A JP 2006291738A JP 2006291738 A JP2006291738 A JP 2006291738A JP 4998985 B2 JP4998985 B2 JP 4998985B2
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JP
Japan
Prior art keywords
pad
wiring pattern
input
pads
ground
Prior art date
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Application number
JP2006291738A
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English (en)
Japanese (ja)
Other versions
JP2007184544A (ja
JP2007184544A5 (enExample
Inventor
暎 相 趙
東 漢 金
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of JP2007184544A publication Critical patent/JP2007184544A/ja
Publication of JP2007184544A5 publication Critical patent/JP2007184544A5/ja
Application granted granted Critical
Publication of JP4998985B2 publication Critical patent/JP4998985B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H10W74/012—
    • H10W70/688—
    • H10W74/15—
    • H10W72/29—
    • H10W72/856—
    • H10W72/926—
    • H10W72/932—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2006291738A 2005-12-29 2006-10-26 熱放出型テープパッケージ Active JP4998985B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2005-0133623 2005-12-29
KR1020050133623A KR100681398B1 (ko) 2005-12-29 2005-12-29 열방출형 반도체 칩과 테이프 배선기판 및 그를 이용한테이프 패키지

Publications (3)

Publication Number Publication Date
JP2007184544A JP2007184544A (ja) 2007-07-19
JP2007184544A5 JP2007184544A5 (enExample) 2009-12-03
JP4998985B2 true JP4998985B2 (ja) 2012-08-15

Family

ID=38106092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006291738A Active JP4998985B2 (ja) 2005-12-29 2006-10-26 熱放出型テープパッケージ

Country Status (4)

Country Link
US (1) US7589421B2 (enExample)
JP (1) JP4998985B2 (enExample)
KR (1) KR100681398B1 (enExample)
CN (1) CN1992247B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100763549B1 (ko) * 2006-10-12 2007-10-04 삼성전자주식회사 반도체 패키지
JP2009019743A (ja) 2007-07-13 2009-01-29 Ｇｋｎ ドライブライン トルクテクノロジー株式会社 動力伝達装置
KR101535223B1 (ko) * 2008-08-18 2015-07-09 삼성전자주식회사 테이프 배선 기판, 칩-온-필름 패키지 및 장치 어셈블리
JP5325684B2 (ja) * 2009-07-15 2013-10-23 ルネサスエレクトロニクス株式会社 半導体装置
KR101450950B1 (ko) 2011-10-04 2014-10-16 엘지디스플레이 주식회사 드라이버 패키지
US8665407B2 (en) 2011-11-16 2014-03-04 Shenzhen China Star Optoelectronics Technology Co., Ltd. Chip-on-film structure for liquid crystal panel
CN102508369B (zh) * 2011-11-16 2014-06-25 深圳市华星光电技术有限公司 用于液晶面板的软板上芯片构造
KR101633373B1 (ko) * 2012-01-09 2016-06-24 삼성전자 주식회사 Ｃｏｆ 패키지 및 이를 포함하는 반도체 장치
KR101900738B1 (ko) * 2012-08-23 2018-09-20 삼성전자주식회사 칩 온 필름
KR20140038823A (ko) * 2012-09-21 2014-03-31 삼성디스플레이 주식회사 표시 패널 및 이의 제조 방법
KR102466918B1 (ko) * 2017-12-27 2022-11-15 삼성디스플레이 주식회사 칩 온 필름 패키지 및 칩 온 필름 패키지를 포함하는 표시 장치
KR102582066B1 (ko) * 2018-04-17 2023-09-25 삼성디스플레이 주식회사 칩 온 필름 패키지 및 칩 온 필름 패키지를 포함하는 표시 장치

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01191433A (ja) * 1988-01-26 1989-08-01 Fujitsu Ltd 集積回路素子
JPH03218062A (ja) * 1990-01-23 1991-09-25 Mitsubishi Electric Corp 半導体装置
US5291043A (en) 1990-02-07 1994-03-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor integrated circuit device having gate array
JP2518569B2 (ja) * 1991-09-19 1996-07-24 三菱電機株式会社 半導体装置
JP2520225B2 (ja) * 1994-01-26 1996-07-31 富士通株式会社 半導体集積回路装置
JPH07253591A (ja) 1995-03-22 1995-10-03 Seiko Epson Corp 液晶パネル駆動用ｉｃ
JP3294490B2 (ja) * 1995-11-29 2002-06-24 株式会社日立製作所 Ｂｇａ型半導体装置
JP3207743B2 (ja) 1996-03-22 2001-09-10 シャープ株式会社 フレキシブル配線基板の端子構造およびそれを用いたｉｃチップの実装構造
JPH09258249A (ja) 1996-03-26 1997-10-03 Citizen Watch Co Ltd 半導体集積回路
JPH1092857A (ja) * 1996-09-10 1998-04-10 Mitsubishi Electric Corp 半導体パッケージ
JPH1098068A (ja) 1996-09-24 1998-04-14 Fujitsu Ltd 半導体集積回路装置
US6057596A (en) * 1998-10-19 2000-05-02 Silicon Integrated Systems Corp. Chip carrier having a specific power join distribution structure
US6403896B1 (en) * 2000-09-27 2002-06-11 Advanced Semiconductor Engineering, Inc. Substrate having specific pad distribution
JP4746770B2 (ja) * 2001-06-19 2011-08-10 ルネサスエレクトロニクス株式会社 半導体装置
JP3803050B2 (ja) * 2001-10-29 2006-08-02 株式会社ルネサステクノロジ 半導体記憶装置、ダイナミックランダムアクセスメモリおよび半導体装置
TW511193B (en) * 2001-12-13 2002-11-21 Acer Labs Inc Inner circuit structure of array type bonding pad chip and its manufacturing method
KR100654338B1 (ko) * 2003-10-04 2006-12-07 삼성전자주식회사 테이프 배선 기판과 그를 이용한 반도체 칩 패키지

Also Published As

Publication number Publication date
CN1992247A (zh) 2007-07-04
CN1992247B (zh) 2012-03-14
US7589421B2 (en) 2009-09-15
JP2007184544A (ja) 2007-07-19
US20070152329A1 (en) 2007-07-05
KR100681398B1 (ko) 2007-02-15

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