CN1992247B - 热辐射半导体芯片和条带引线衬底及使用其的条带封装 - Google Patents

热辐射半导体芯片和条带引线衬底及使用其的条带封装 Download PDF

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Publication number
CN1992247B
CN1992247B CN2006101359939A CN200610135993A CN1992247B CN 1992247 B CN1992247 B CN 1992247B CN 2006101359939 A CN2006101359939 A CN 2006101359939A CN 200610135993 A CN200610135993 A CN 200610135993A CN 1992247 B CN1992247 B CN 1992247B
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pad
pads
power
input
ground
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Chinese (zh)
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CN1992247A (zh
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赵暎相
金东汉
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Publication of CN1992247A publication Critical patent/CN1992247A/zh
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    • H10W74/012—
    • H10W70/688—
    • H10W74/15—
    • H10W72/29—
    • H10W72/856—
    • H10W72/926—
    • H10W72/932—
    • H10W90/724—
    • H10W90/734—

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  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
CN2006101359939A 2005-12-29 2006-10-16 热辐射半导体芯片和条带引线衬底及使用其的条带封装 Active CN1992247B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR133623/05 2005-12-29
KR1020050133623A KR100681398B1 (ko) 2005-12-29 2005-12-29 열방출형 반도체 칩과 테이프 배선기판 및 그를 이용한테이프 패키지

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CN1992247A CN1992247A (zh) 2007-07-04
CN1992247B true CN1992247B (zh) 2012-03-14

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CN2006101359939A Active CN1992247B (zh) 2005-12-29 2006-10-16 热辐射半导体芯片和条带引线衬底及使用其的条带封装

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US (1) US7589421B2 (enExample)
JP (1) JP4998985B2 (enExample)
KR (1) KR100681398B1 (enExample)
CN (1) CN1992247B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100763549B1 (ko) * 2006-10-12 2007-10-04 삼성전자주식회사 반도체 패키지
JP2009019743A (ja) 2007-07-13 2009-01-29 Ｇｋｎ ドライブライン トルクテクノロジー株式会社 動力伝達装置
KR101535223B1 (ko) * 2008-08-18 2015-07-09 삼성전자주식회사 테이프 배선 기판, 칩-온-필름 패키지 및 장치 어셈블리
JP5325684B2 (ja) * 2009-07-15 2013-10-23 ルネサスエレクトロニクス株式会社 半導体装置
KR101450950B1 (ko) 2011-10-04 2014-10-16 엘지디스플레이 주식회사 드라이버 패키지
US8665407B2 (en) 2011-11-16 2014-03-04 Shenzhen China Star Optoelectronics Technology Co., Ltd. Chip-on-film structure for liquid crystal panel
CN102508369B (zh) * 2011-11-16 2014-06-25 深圳市华星光电技术有限公司 用于液晶面板的软板上芯片构造
KR101633373B1 (ko) * 2012-01-09 2016-06-24 삼성전자 주식회사 Ｃｏｆ 패키지 및 이를 포함하는 반도체 장치
KR101900738B1 (ko) * 2012-08-23 2018-09-20 삼성전자주식회사 칩 온 필름
KR20140038823A (ko) * 2012-09-21 2014-03-31 삼성디스플레이 주식회사 표시 패널 및 이의 제조 방법
KR102466918B1 (ko) * 2017-12-27 2022-11-15 삼성디스플레이 주식회사 칩 온 필름 패키지 및 칩 온 필름 패키지를 포함하는 표시 장치
KR102582066B1 (ko) * 2018-04-17 2023-09-25 삼성디스플레이 주식회사 칩 온 필름 패키지 및 칩 온 필름 패키지를 포함하는 표시 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6057596A (en) * 1998-10-19 2000-05-02 Silicon Integrated Systems Corp. Chip carrier having a specific power join distribution structure
US6163071A (en) * 1995-11-29 2000-12-19 Hitachi, Ltd. BGA type semiconductor device and electronic equipment using the same
US6403896B1 (en) * 2000-09-27 2002-06-11 Advanced Semiconductor Engineering, Inc. Substrate having specific pad distribution
US6650014B2 (en) * 2001-06-19 2003-11-18 Nec Electronics Corporation Semiconductor device
CN1607663A (zh) * 2003-10-04 2005-04-20 三星电子株式会社 带式电路衬底及使用该衬底的半导体芯片封装

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JPH01191433A (ja) * 1988-01-26 1989-08-01 Fujitsu Ltd 集積回路素子
JPH03218062A (ja) * 1990-01-23 1991-09-25 Mitsubishi Electric Corp 半導体装置
US5291043A (en) 1990-02-07 1994-03-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor integrated circuit device having gate array
JP2518569B2 (ja) * 1991-09-19 1996-07-24 三菱電機株式会社 半導体装置
JP2520225B2 (ja) * 1994-01-26 1996-07-31 富士通株式会社 半導体集積回路装置
JPH07253591A (ja) 1995-03-22 1995-10-03 Seiko Epson Corp 液晶パネル駆動用ｉｃ
JP3207743B2 (ja) 1996-03-22 2001-09-10 シャープ株式会社 フレキシブル配線基板の端子構造およびそれを用いたｉｃチップの実装構造
JPH09258249A (ja) 1996-03-26 1997-10-03 Citizen Watch Co Ltd 半導体集積回路
JPH1092857A (ja) * 1996-09-10 1998-04-10 Mitsubishi Electric Corp 半導体パッケージ
JPH1098068A (ja) 1996-09-24 1998-04-14 Fujitsu Ltd 半導体集積回路装置
JP3803050B2 (ja) * 2001-10-29 2006-08-02 株式会社ルネサステクノロジ 半導体記憶装置、ダイナミックランダムアクセスメモリおよび半導体装置
TW511193B (en) * 2001-12-13 2002-11-21 Acer Labs Inc Inner circuit structure of array type bonding pad chip and its manufacturing method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6163071A (en) * 1995-11-29 2000-12-19 Hitachi, Ltd. BGA type semiconductor device and electronic equipment using the same
US6057596A (en) * 1998-10-19 2000-05-02 Silicon Integrated Systems Corp. Chip carrier having a specific power join distribution structure
US6403896B1 (en) * 2000-09-27 2002-06-11 Advanced Semiconductor Engineering, Inc. Substrate having specific pad distribution
US6650014B2 (en) * 2001-06-19 2003-11-18 Nec Electronics Corporation Semiconductor device
CN1607663A (zh) * 2003-10-04 2005-04-20 三星电子株式会社 带式电路衬底及使用该衬底的半导体芯片封装

Also Published As

Publication number Publication date
CN1992247A (zh) 2007-07-04
JP4998985B2 (ja) 2012-08-15
US7589421B2 (en) 2009-09-15
JP2007184544A (ja) 2007-07-19
US20070152329A1 (en) 2007-07-05
KR100681398B1 (ko) 2007-02-15

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