JP4911980B2 - 減圧処理装置 - Google Patents

減圧処理装置 Download PDF

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Publication number
JP4911980B2
JP4911980B2 JP2006025660A JP2006025660A JP4911980B2 JP 4911980 B2 JP4911980 B2 JP 4911980B2 JP 2006025660 A JP2006025660 A JP 2006025660A JP 2006025660 A JP2006025660 A JP 2006025660A JP 4911980 B2 JP4911980 B2 JP 4911980B2
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Japan
Prior art keywords
exhaust
processing
processing apparatus
gas
chamber
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Expired - Fee Related
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JP2006025660A
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English (en)
Japanese (ja)
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JP2007208042A (ja
JP2007208042A5 (enExample
Inventor
茂樹 戸澤
雄介 村木
正 飯野
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2006025660A priority Critical patent/JP4911980B2/ja
Priority to PCT/JP2007/051722 priority patent/WO2007088940A1/ja
Priority to TW096103733A priority patent/TW200737289A/zh
Publication of JP2007208042A publication Critical patent/JP2007208042A/ja
Publication of JP2007208042A5 publication Critical patent/JP2007208042A5/ja
Application granted granted Critical
Publication of JP4911980B2 publication Critical patent/JP4911980B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
JP2006025660A 2006-02-02 2006-02-02 減圧処理装置 Expired - Fee Related JP4911980B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006025660A JP4911980B2 (ja) 2006-02-02 2006-02-02 減圧処理装置
PCT/JP2007/051722 WO2007088940A1 (ja) 2006-02-02 2007-02-01 減圧処理装置
TW096103733A TW200737289A (en) 2006-02-02 2007-02-01 Pressure reducing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006025660A JP4911980B2 (ja) 2006-02-02 2006-02-02 減圧処理装置

Publications (3)

Publication Number Publication Date
JP2007208042A JP2007208042A (ja) 2007-08-16
JP2007208042A5 JP2007208042A5 (enExample) 2009-03-12
JP4911980B2 true JP4911980B2 (ja) 2012-04-04

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JP2006025660A Expired - Fee Related JP4911980B2 (ja) 2006-02-02 2006-02-02 減圧処理装置

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JP (1) JP4911980B2 (enExample)
TW (1) TW200737289A (enExample)
WO (1) WO2007088940A1 (enExample)

Families Citing this family (236)

* Cited by examiner, † Cited by third party
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