TW200737289A - Pressure reducing apparatus - Google Patents

Pressure reducing apparatus

Info

Publication number
TW200737289A
TW200737289A TW096103733A TW96103733A TW200737289A TW 200737289 A TW200737289 A TW 200737289A TW 096103733 A TW096103733 A TW 096103733A TW 96103733 A TW96103733 A TW 96103733A TW 200737289 A TW200737289 A TW 200737289A
Authority
TW
Taiwan
Prior art keywords
pressure reducing
reducing apparatus
exhaust gas
dry pump
trap apparatus
Prior art date
Application number
TW096103733A
Other languages
Chinese (zh)
Inventor
Shigeki Tozawa
Yusuke Muraki
Tadashi Iino
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200737289A publication Critical patent/TW200737289A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

In an exhaust gas treatment mechanism (44), a dry pump (83) and a trap apparatus (87) are arranged in this order from the upstream to the downstream on an exhaust path (85) connected to a chamber (40) of COR treatment equipment (5). Exhaust gas heated to a temperature of, for instance, 60 DEG C ~ 100 DEG C by an electrothermal heater (93) passes through the dry pump (83), and reaction products are deposited and captured at the trap apparatus (87) under an atmospheric pressure.
TW096103733A 2006-02-02 2007-02-01 Pressure reducing apparatus TW200737289A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006025660A JP4911980B2 (en) 2006-02-02 2006-02-02 Decompression processing equipment

Publications (1)

Publication Number Publication Date
TW200737289A true TW200737289A (en) 2007-10-01

Family

ID=38327509

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096103733A TW200737289A (en) 2006-02-02 2007-02-01 Pressure reducing apparatus

Country Status (3)

Country Link
JP (1) JP4911980B2 (en)
TW (1) TW200737289A (en)
WO (1) WO2007088940A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107808838A (en) * 2017-11-13 2018-03-16 武汉华星光电半导体显示技术有限公司 Drycorrosion apparatus and dry etching method
US11542932B2 (en) 2017-11-13 2023-01-03 Edwards Limited Vacuum system pipe couplings

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