JP4811533B2 - 感光性導電フィルム、導電膜の形成方法、導電パターンの形成方法及び導電膜基板 - Google Patents
感光性導電フィルム、導電膜の形成方法、導電パターンの形成方法及び導電膜基板 Download PDFInfo
- Publication number
- JP4811533B2 JP4811533B2 JP2010525646A JP2010525646A JP4811533B2 JP 4811533 B2 JP4811533 B2 JP 4811533B2 JP 2010525646 A JP2010525646 A JP 2010525646A JP 2010525646 A JP2010525646 A JP 2010525646A JP 4811533 B2 JP4811533 B2 JP 4811533B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- substrate
- film
- conductive film
- photosensitive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims description 97
- 238000000034 method Methods 0.000 title claims description 77
- 239000011347 resin Substances 0.000 claims description 91
- 229920005989 resin Polymers 0.000 claims description 91
- 239000000835 fiber Substances 0.000 claims description 51
- 150000001875 compounds Chemical class 0.000 claims description 24
- 229920000642 polymer Polymers 0.000 claims description 21
- 239000011230 binding agent Substances 0.000 claims description 20
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 16
- 229910052709 silver Inorganic materials 0.000 claims description 16
- 239000004332 silver Substances 0.000 claims description 16
- 238000002834 transmittance Methods 0.000 claims description 15
- 238000010030 laminating Methods 0.000 claims description 13
- 238000011161 development Methods 0.000 claims description 12
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 239000003999 initiator Substances 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 130
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 42
- -1 acryl Chemical group 0.000 description 36
- 239000000243 solution Substances 0.000 description 25
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 22
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 22
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 22
- 239000001294 propane Substances 0.000 description 21
- 230000001681 protective effect Effects 0.000 description 19
- 239000006185 dispersion Substances 0.000 description 16
- 230000008569 process Effects 0.000 description 16
- 239000000178 monomer Substances 0.000 description 15
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 14
- 238000001035 drying Methods 0.000 description 13
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 13
- 238000000576 coating method Methods 0.000 description 12
- 239000007864 aqueous solution Substances 0.000 description 11
- 230000018109 developmental process Effects 0.000 description 11
- 239000003960 organic solvent Substances 0.000 description 11
- 239000004417 polycarbonate Substances 0.000 description 10
- 229920000515 polycarbonate Polymers 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 239000003513 alkali Substances 0.000 description 9
- 238000003475 lamination Methods 0.000 description 9
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 9
- 239000004925 Acrylic resin Substances 0.000 description 8
- 229920000178 Acrylic resin Polymers 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 8
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 7
- 229910052753 mercury Inorganic materials 0.000 description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 description 7
- 239000005020 polyethylene terephthalate Substances 0.000 description 7
- 239000011342 resin composition Substances 0.000 description 7
- 229920002799 BoPET Polymers 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 239000002041 carbon nanotube Substances 0.000 description 6
- 229910021393 carbon nanotube Inorganic materials 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L sodium carbonate Substances [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 5
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920006254 polymer film Polymers 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 150000003673 urethanes Chemical class 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 239000002518 antifoaming agent Substances 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910003437 indium oxide Inorganic materials 0.000 description 3
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000000016 photochemical curing Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Substances [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 3
- 229910001887 tin oxide Inorganic materials 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 3
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 2
- LBERJMJGFNHPJA-UHFFFAOYSA-N 1-[2-[2-[2-(2-hydroxyethoxy)ethoxy]ethoxy]ethoxy]tetradecan-2-ol Chemical compound CCCCCCCCCCCCC(O)COCCOCCOCCOCCO LBERJMJGFNHPJA-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- MJVAVZPDRWSRRC-UHFFFAOYSA-N Menadione Chemical compound C1=CC=C2C(=O)C(C)=CC(=O)C2=C1 MJVAVZPDRWSRRC-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- NPKSPKHJBVJUKB-UHFFFAOYSA-N N-phenylglycine Chemical compound OC(=O)CNC1=CC=CC=C1 NPKSPKHJBVJUKB-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007754 air knife coating Methods 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 238000007611 bar coating method Methods 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229910021538 borax Inorganic materials 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000007607 die coating method Methods 0.000 description 2
- 239000000539 dimer Substances 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- WMFOQBRAJBCJND-UHFFFAOYSA-M lithium hydroxide Inorganic materials [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 238000004917 polyol method Methods 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000002109 single walled nanotube Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 239000004328 sodium tetraborate Substances 0.000 description 2
- 235000010339 sodium tetraborate Nutrition 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- WNILQWYHQCFQDH-UHFFFAOYSA-N (2-oxooctylideneamino) 1-(4-phenylsulfanylphenyl)cyclohexa-2,4-diene-1-carboxylate Chemical compound C=1C=C(SC=2C=CC=CC=2)C=CC=1C1(C(=O)ON=CC(=O)CCCCCC)CC=CC=C1 WNILQWYHQCFQDH-UHFFFAOYSA-N 0.000 description 1
- CDUQMGQIHYISOP-RMKNXTFCSA-N (e)-2-cyano-3-phenylprop-2-enoic acid Chemical compound OC(=O)C(\C#N)=C\C1=CC=CC=C1 CDUQMGQIHYISOP-RMKNXTFCSA-N 0.000 description 1
- VVSGSQMLYOTNIE-UHFFFAOYSA-N (ethylideneamino) acetate Chemical compound CC=NOC(C)=O VVSGSQMLYOTNIE-UHFFFAOYSA-N 0.000 description 1
- FWUIHQFQLSWYED-ARJAWSKDSA-N (z)-4-oxo-4-propan-2-yloxybut-2-enoic acid Chemical compound CC(C)OC(=O)\C=C/C(O)=O FWUIHQFQLSWYED-ARJAWSKDSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- XHXSXTIIDBZEKB-UHFFFAOYSA-N 1,2,3,4,5,6,7,8-octamethylanthracene-9,10-dione Chemical compound CC1=C(C)C(C)=C2C(=O)C3=C(C)C(C)=C(C)C(C)=C3C(=O)C2=C1C XHXSXTIIDBZEKB-UHFFFAOYSA-N 0.000 description 1
- GJZFGDYLJLCGHT-UHFFFAOYSA-N 1,2-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=C(CC)C(CC)=CC=C3SC2=C1 GJZFGDYLJLCGHT-UHFFFAOYSA-N 0.000 description 1
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- LMGYOBQJBQAZKC-UHFFFAOYSA-N 1-(2-ethylphenyl)-2-hydroxy-2-phenylethanone Chemical compound CCC1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 LMGYOBQJBQAZKC-UHFFFAOYSA-N 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N 1-ethenoxybutane Chemical compound CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- INUMMPHTUPBOEU-UHFFFAOYSA-N 1-phenylacridine Chemical compound C1=CC=CC=C1C1=CC=CC2=NC3=CC=CC=C3C=C12 INUMMPHTUPBOEU-UHFFFAOYSA-N 0.000 description 1
- 125000004206 2,2,2-trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- KIJPZYXCIHZVGP-UHFFFAOYSA-N 2,3-dimethylanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=C(C)C(C)=C2 KIJPZYXCIHZVGP-UHFFFAOYSA-N 0.000 description 1
- UCSGWEMRGIONEW-UHFFFAOYSA-N 2-(2-chlorophenyl)-4,5-bis(2-methoxyphenyl)-1h-imidazole Chemical class COC1=CC=CC=C1C1=C(C=2C(=CC=CC=2)OC)NC(C=2C(=CC=CC=2)Cl)=N1 UCSGWEMRGIONEW-UHFFFAOYSA-N 0.000 description 1
- UIHRWPYOTGCOJP-UHFFFAOYSA-N 2-(2-fluorophenyl)-4,5-diphenyl-1h-imidazole Chemical class FC1=CC=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 UIHRWPYOTGCOJP-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- XIOGJAPOAUEYJO-UHFFFAOYSA-N 2-(2-methoxyphenyl)-4,5-diphenyl-1h-imidazole Chemical class COC1=CC=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 XIOGJAPOAUEYJO-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- SNFCQJAJPFWBDJ-UHFFFAOYSA-N 2-(4-methoxyphenyl)-4,5-diphenyl-1h-imidazole Chemical class C1=CC(OC)=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 SNFCQJAJPFWBDJ-UHFFFAOYSA-N 0.000 description 1
- DVVXXHVHGGWWPE-UHFFFAOYSA-N 2-(dimethylamino)benzoic acid Chemical compound CN(C)C1=CC=CC=C1C(O)=O DVVXXHVHGGWWPE-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- 239000004808 2-ethylhexylester Substances 0.000 description 1
- VZMLJEYQUZKERO-UHFFFAOYSA-N 2-hydroxy-1-(2-methylphenyl)-2-phenylethanone Chemical compound CC1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 VZMLJEYQUZKERO-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- NTZCFGZBDDCNHI-UHFFFAOYSA-N 2-phenylanthracene-9,10-dione Chemical compound C=1C=C2C(=O)C3=CC=CC=C3C(=O)C2=CC=1C1=CC=CC=C1 NTZCFGZBDDCNHI-UHFFFAOYSA-N 0.000 description 1
- YTPSFXZMJKMUJE-UHFFFAOYSA-N 2-tert-butylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)(C)C)=CC=C3C(=O)C2=C1 YTPSFXZMJKMUJE-UHFFFAOYSA-N 0.000 description 1
- YYVYAPXYZVYDHN-UHFFFAOYSA-N 9,10-phenanthroquinone Chemical compound C1=CC=C2C(=O)C(=O)C3=CC=CC=C3C2=C1 YYVYAPXYZVYDHN-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 241000251468 Actinopterygii Species 0.000 description 1
- 101710134784 Agnoprotein Proteins 0.000 description 1
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 1
- NBESUYWLQBSMLH-UHFFFAOYSA-N C1(=CC=CC=C1)C(=O)C(O)C1=CC=CC=C1.C1(=CC=CC=C1)OC(C(C1=CC=CC=C1)=O)C1=CC=CC=C1 Chemical compound C1(=CC=CC=C1)C(=O)C(O)C1=CC=CC=C1.C1(=CC=CC=C1)OC(C(C1=CC=CC=C1)=O)C1=CC=CC=C1 NBESUYWLQBSMLH-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- XLYMOEINVGRTEX-ARJAWSKDSA-N Ethyl hydrogen fumarate Chemical compound CCOC(=O)\C=C/C(O)=O XLYMOEINVGRTEX-ARJAWSKDSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001251 acridines Chemical class 0.000 description 1
- BAPJBEWLBFYGME-UHFFFAOYSA-N acrylic acid methyl ester Natural products COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910001854 alkali hydroxide Inorganic materials 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 229910000318 alkali metal phosphate Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 235000012538 ammonium bicarbonate Nutrition 0.000 description 1
- 239000001099 ammonium carbonate Substances 0.000 description 1
- 235000012501 ammonium carbonate Nutrition 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 229940027998 antiseptic and disinfectant acridine derivative Drugs 0.000 description 1
- 150000008365 aromatic ketones Chemical class 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- LHMRXAIRPKSGDE-UHFFFAOYSA-N benzo[a]anthracene-7,12-dione Chemical compound C1=CC2=CC=CC=C2C2=C1C(=O)C1=CC=CC=C1C2=O LHMRXAIRPKSGDE-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 125000000332 coumarinyl group Chemical class O1C(=O)C(=CC2=CC=CC=C12)* 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000007857 degradation product Substances 0.000 description 1
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Natural products CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 235000011180 diphosphates Nutrition 0.000 description 1
- UQGFMSUEHSUPRD-UHFFFAOYSA-N disodium;3,7-dioxido-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane Chemical compound [Na+].[Na+].O1B([O-])OB2OB([O-])OB1O2 UQGFMSUEHSUPRD-UHFFFAOYSA-N 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- XLYMOEINVGRTEX-UHFFFAOYSA-N fumaric acid monoethyl ester Natural products CCOC(=O)C=CC(O)=O XLYMOEINVGRTEX-UHFFFAOYSA-N 0.000 description 1
- NKHAVTQWNUWKEO-UHFFFAOYSA-N fumaric acid monomethyl ester Natural products COC(=O)C=CC(O)=O NKHAVTQWNUWKEO-UHFFFAOYSA-N 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- XLSMFKSTNGKWQX-UHFFFAOYSA-N hydroxyacetone Chemical compound CC(=O)CO XLSMFKSTNGKWQX-UHFFFAOYSA-N 0.000 description 1
- 239000012216 imaging agent Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 229940086559 methyl benzoin Drugs 0.000 description 1
- NKHAVTQWNUWKEO-IHWYPQMZSA-N methyl hydrogen fumarate Chemical compound COC(=O)\C=C/C(O)=O NKHAVTQWNUWKEO-IHWYPQMZSA-N 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- MDYPDLBFDATSCF-UHFFFAOYSA-N nonyl prop-2-enoate Chemical compound CCCCCCCCCOC(=O)C=C MDYPDLBFDATSCF-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000002916 oxazoles Chemical class 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- ULDDEWDFUNBUCM-UHFFFAOYSA-N pentyl prop-2-enoate Chemical compound CCCCCOC(=O)C=C ULDDEWDFUNBUCM-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 235000011007 phosphoric acid Nutrition 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 235000007686 potassium Nutrition 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 229910000160 potassium phosphate Inorganic materials 0.000 description 1
- 235000011009 potassium phosphates Nutrition 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 235000015424 sodium Nutrition 0.000 description 1
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- 229940048086 sodium pyrophosphate Drugs 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 1
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- LMYRWZFENFIFIT-UHFFFAOYSA-N toluene-4-sulfonamide Chemical compound CC1=CC=C(S(N)(=O)=O)C=C1 LMYRWZFENFIFIT-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/02—Materials and properties organic material
- G02F2202/022—Materials and properties organic material polymeric
- G02F2202/023—Materials and properties organic material polymeric curable
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/36—Micro- or nanomaterials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
- Y10T29/4916—Simultaneous circuit manufacturing
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dispersion Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Nanotechnology (AREA)
- Materials For Photolithography (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Electric Cables (AREA)
- Conductive Materials (AREA)
- Position Input By Displaying (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010525646A JP4811533B2 (ja) | 2008-08-22 | 2009-07-23 | 感光性導電フィルム、導電膜の形成方法、導電パターンの形成方法及び導電膜基板 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008214113 | 2008-08-22 | ||
| JP2008214113 | 2008-08-22 | ||
| PCT/JP2009/063187 WO2010021224A1 (ja) | 2008-08-22 | 2009-07-23 | 感光性導電フィルム、導電膜の形成方法、導電パターンの形成方法及び導電膜基板 |
| JP2010525646A JP4811533B2 (ja) | 2008-08-22 | 2009-07-23 | 感光性導電フィルム、導電膜の形成方法、導電パターンの形成方法及び導電膜基板 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011053486A Division JP5418523B2 (ja) | 2008-08-22 | 2011-03-10 | 感光性導電フィルム、導電膜の形成方法、導電パターンの形成方法及び導電膜基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP4811533B2 true JP4811533B2 (ja) | 2011-11-09 |
| JPWO2010021224A1 JPWO2010021224A1 (ja) | 2012-01-26 |
Family
ID=41707102
Family Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010525646A Expired - Fee Related JP4811533B2 (ja) | 2008-08-22 | 2009-07-23 | 感光性導電フィルム、導電膜の形成方法、導電パターンの形成方法及び導電膜基板 |
| JP2011053486A Expired - Fee Related JP5418523B2 (ja) | 2008-08-22 | 2011-03-10 | 感光性導電フィルム、導電膜の形成方法、導電パターンの形成方法及び導電膜基板 |
| JP2013185283A Expired - Fee Related JP6026376B2 (ja) | 2008-08-22 | 2013-09-06 | 感光性導電フィルム、導電膜の形成方法、導電パターンの形成方法及び導電膜基板 |
| JP2015103844A Expired - Fee Related JP6290134B2 (ja) | 2008-08-22 | 2015-05-21 | 導電膜基板 |
| JP2017027072A Expired - Fee Related JP6402791B2 (ja) | 2008-08-22 | 2017-02-16 | 導電膜基板及びその使用方法 |
Family Applications After (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011053486A Expired - Fee Related JP5418523B2 (ja) | 2008-08-22 | 2011-03-10 | 感光性導電フィルム、導電膜の形成方法、導電パターンの形成方法及び導電膜基板 |
| JP2013185283A Expired - Fee Related JP6026376B2 (ja) | 2008-08-22 | 2013-09-06 | 感光性導電フィルム、導電膜の形成方法、導電パターンの形成方法及び導電膜基板 |
| JP2015103844A Expired - Fee Related JP6290134B2 (ja) | 2008-08-22 | 2015-05-21 | 導電膜基板 |
| JP2017027072A Expired - Fee Related JP6402791B2 (ja) | 2008-08-22 | 2017-02-16 | 導電膜基板及びその使用方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (4) | US8171628B2 (enExample) |
| EP (2) | EP2320433B1 (enExample) |
| JP (5) | JP4811533B2 (enExample) |
| KR (7) | KR101316977B1 (enExample) |
| CN (5) | CN102124529B (enExample) |
| TW (4) | TWI549142B (enExample) |
| WO (1) | WO2010021224A1 (enExample) |
Families Citing this family (57)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101943963A (zh) * | 2009-07-08 | 2011-01-12 | 群康科技(深圳)有限公司 | 导电板及应用其的触摸屏 |
| JP5606769B2 (ja) * | 2010-04-09 | 2014-10-15 | 富士フイルム株式会社 | 導電膜及びその製造方法、並びにタッチパネル及び集積型太陽電池 |
| KR20150061006A (ko) * | 2010-05-13 | 2015-06-03 | 히타치가세이가부시끼가이샤 | 감광성 도전 필름, 도전막의 형성 방법 및 도전 패턴의 형성 방법 |
| CN102645989B (zh) * | 2011-02-16 | 2015-11-25 | 群康科技(深圳)有限公司 | 触摸屏面板的制备方法 |
| CN102819340B (zh) * | 2011-06-09 | 2016-03-02 | 天津富纳源创科技有限公司 | 触摸屏面板的制备方法 |
| CN102902425B (zh) * | 2011-07-28 | 2016-06-08 | 宸鸿科技(厦门)有限公司 | 电容式触控面板结构及制造方法 |
| JP5303069B2 (ja) * | 2011-08-03 | 2013-10-02 | 東レ株式会社 | 導電積層体、パターン化導電積層体およびそれを用いてなるタッチパネル |
| JP5763492B2 (ja) * | 2011-09-30 | 2015-08-12 | 富士フイルム株式会社 | 静電容量型入力装置の製造方法および静電容量型入力装置、並びに、これを備えた画像表示装置 |
| WO2013051516A1 (ja) * | 2011-10-03 | 2013-04-11 | 日立化成株式会社 | 導電パターンの形成方法、導電パターン基板及びタッチパネルセンサ |
| WO2013084283A1 (ja) * | 2011-12-05 | 2013-06-13 | 日立化成株式会社 | タッチパネル用電極の保護膜の形成方法、感光性樹脂組成物及び感光性エレメント |
| WO2013084282A1 (ja) | 2011-12-05 | 2013-06-13 | 日立化成株式会社 | 樹脂硬化膜パターンの形成方法、感光性樹脂組成物及び感光性エレメント |
| JP5714526B2 (ja) | 2012-03-08 | 2015-05-07 | 日本写真印刷株式会社 | フレキシブルタッチパネル |
| KR20170072956A (ko) | 2012-04-04 | 2017-06-27 | 히타치가세이가부시끼가이샤 | 도전 패턴의 형성 방법 및 도전 패턴 기판 |
| CN102637486A (zh) * | 2012-05-14 | 2012-08-15 | 南昌欧菲光科技有限公司 | 一种用于电容式触摸屏双层透明导电薄膜的制备方法 |
| WO2013176155A1 (ja) * | 2012-05-24 | 2013-11-28 | 東レ株式会社 | パターニングされた導電基材の製造方法、これによってパターニングされた導電基材およびタッチパネル |
| TWI588691B (zh) * | 2012-09-27 | 2017-06-21 | 未來奈米科技股份有限公司 | 製造電極膜裝置與其方法 |
| KR20140063302A (ko) * | 2012-11-16 | 2014-05-27 | 삼성디스플레이 주식회사 | 캐리어 기판 제거 장치, 표시장치 제조 시스템, 및 표시장치 제조 방법 |
| WO2014098157A1 (ja) * | 2012-12-19 | 2014-06-26 | 株式会社クラレ | 膜形成方法、導電膜、及び絶縁膜 |
| WO2014196154A1 (ja) * | 2013-06-04 | 2014-12-11 | 日立化成株式会社 | 感光性導電フィルム、並びにこれを用いた導電パターンの形成方法及び導電パターン基板 |
| JP5686445B2 (ja) * | 2013-07-01 | 2015-03-18 | 日本写真印刷株式会社 | 相互静電容量方式タッチパネル |
| US20160179234A1 (en) * | 2013-07-03 | 2016-06-23 | Amosense Co., Ltd. | Touch sensor for touch screen panel, manufacturing method thereof, and touch screen panel including same |
| JP6205925B2 (ja) * | 2013-07-12 | 2017-10-04 | 日立化成株式会社 | 感光性導電フィルム、並びにこれを用いた導電パターンの形成方法及び導電パターン基板 |
| JP2015052774A (ja) * | 2013-08-07 | 2015-03-19 | 日立化成株式会社 | 加飾基板上におけるレジストパターン又は導電パターンの製造方法、及び転写形感光性導電フィルム |
| JP6206028B2 (ja) * | 2013-09-19 | 2017-10-04 | 日立化成株式会社 | 導電パターンの製造方法、その方法により製造された導電パターンを備える導電パターン基板、その導電パターン基板を含むタッチパネルセンサ、及び感光性導電フィルム |
| WO2015049939A1 (ja) * | 2013-10-03 | 2015-04-09 | 日立化成株式会社 | 感光性導電フィルム、これを用いた導電パターンの形成方法及び導電パターン基板 |
| KR20150112924A (ko) * | 2013-10-16 | 2015-10-07 | 히타치가세이가부시끼가이샤 | 도전성 섬유를 포함하는 적층체, 감광성 도전 필름, 도전 패턴의 제조 방법, 도전 패턴 기판, 및 터치 패널 |
| CN105637130B (zh) * | 2013-10-17 | 2019-07-19 | 日产化学工业株式会社 | 感光性纤维及其制造方法 |
| TWI567600B (zh) * | 2013-11-26 | 2017-01-21 | 恆顥科技股份有限公司 | 觸控裝置 |
| WO2015137278A1 (ja) | 2014-03-14 | 2015-09-17 | 日立化成株式会社 | 感光性導電フィルム |
| CN103886934B (zh) * | 2014-04-04 | 2016-08-24 | 纳诺电子化学(苏州)有限公司 | 一种透明导电膜 |
| JP2015219308A (ja) * | 2014-05-15 | 2015-12-07 | 日立化成株式会社 | 感光性導電フィルム、感光性導電積層体、導電膜の形成方法及び導電積層体 |
| JP2016066590A (ja) * | 2014-06-09 | 2016-04-28 | 日立化成株式会社 | 導電フィルム、感光性導電フィルム、導電膜の形成方法、導電パターンの形成方法及び導電膜基材 |
| KR102287289B1 (ko) * | 2014-07-08 | 2021-08-06 | 주식회사 동진쎄미켐 | 투명 전극 복합체 |
| US10201082B2 (en) * | 2014-09-22 | 2019-02-05 | Basf Se | Transparent conductive layer, a film comprising the layer, and a process for its production |
| CN104575701B (zh) * | 2014-12-17 | 2017-01-11 | 张家港康得新光电材料有限公司 | 高分子透明导电膜及其制备方法 |
| JP6027633B2 (ja) * | 2015-01-13 | 2016-11-16 | 日本写真印刷株式会社 | タッチ入力センサの製造方法及び感光性導電フィルム |
| KR102297878B1 (ko) | 2015-01-16 | 2021-09-03 | 삼성디스플레이 주식회사 | 터치 패널 및 그 제조 방법 |
| TWI548587B (zh) * | 2015-01-26 | 2016-09-11 | 國立臺灣大學 | 奈米金屬線圖案化之方法,使用該方法製備而成之圖案化奈米金屬線電極以及包含該圖案化奈米金屬線電極做為材料之電晶體元件 |
| WO2016167228A1 (ja) * | 2015-04-15 | 2016-10-20 | 日立化成株式会社 | 感光性導電フィルム、導電パターンの形成方法、導電パターン付き基材、及びタッチパネルセンサ |
| JP2016206463A (ja) * | 2015-04-24 | 2016-12-08 | 株式会社トクヤマ | フォトクロミック積層体 |
| WO2016181496A1 (ja) * | 2015-05-12 | 2016-11-17 | 日立化成株式会社 | 導電膜作製液セット、導電パターンの形成方法、及びタッチパネル |
| JP6042486B1 (ja) | 2015-05-29 | 2016-12-14 | 日本写真印刷株式会社 | タッチセンサの製造方法及びタッチセンサ |
| JP2017045687A (ja) * | 2015-08-28 | 2017-03-02 | 日立化成株式会社 | 感光性導電フィルム、感光性導電フィルムロール、及びそれを用いた導電膜・導電パターンの形成方法 |
| CN105139924B (zh) * | 2015-10-09 | 2017-09-05 | 重庆文理学院 | 一种双保护膜的银纳米线透明导电薄膜的制备方法 |
| US9801284B2 (en) * | 2015-11-18 | 2017-10-24 | Dow Global Technologies Llc | Method of manufacturing a patterned conductor |
| JP2017201350A (ja) * | 2016-05-02 | 2017-11-09 | 日立化成株式会社 | 感光性導電フィルム、導電パターンの形成方法及び導電パターン基板の製造方法 |
| CN114395293B (zh) | 2016-10-14 | 2023-07-04 | C3内诺公司 | 经稳定化的稀疏金属导电膜及用于稳定化合物的递送的溶液 |
| CN106773235A (zh) * | 2016-12-27 | 2017-05-31 | 广州汇驰实业发展有限公司 | 一种调光膜及其制备方法 |
| CN107093494B (zh) * | 2017-03-22 | 2021-07-13 | 中山大学 | 一种可转移图案化的导电薄膜及其制备与图案化的方法 |
| CN107015705A (zh) * | 2017-05-19 | 2017-08-04 | 信利光电股份有限公司 | 一种触控显示装置、触控面板及其制作方法 |
| JP2017228312A (ja) * | 2017-09-07 | 2017-12-28 | 日立化成株式会社 | 感光性導電フィルム、並びにこれを用いた導電パターンの形成方法及び導電パターン基板 |
| JP6399175B2 (ja) * | 2017-09-07 | 2018-10-03 | 日立化成株式会社 | 導電パターンの製造方法、その方法により製造された導電パターンを備える導電パターン基板、その導電パターン基板を含むタッチパネルセンサ、及び感光性導電フィルム |
| US20190364665A1 (en) * | 2018-05-22 | 2019-11-28 | C3Nano Inc. | Silver-based transparent conductive layers interfaced with copper traces and methods for forming the structures |
| JP6573017B2 (ja) * | 2018-10-02 | 2019-09-11 | 日立化成株式会社 | 静電容量方式タッチパネル |
| CN114364532A (zh) * | 2019-09-30 | 2022-04-15 | 富士胶片株式会社 | 转印膜、层叠体的制造方法、层叠体、触摸面板传感器、触摸面板 |
| KR102711341B1 (ko) * | 2022-05-23 | 2024-09-27 | 한국광기술원 | 투명 전극 필름, 전극을 선택적으로 전사하여 투명 전극 필름을 제조하는 장치 및 그 방법 |
| CN115734459B (zh) * | 2022-11-07 | 2024-03-12 | 湖北通格微电路科技有限公司 | 玻璃基线路板及其制备方法 |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2975921B2 (ja) * | 1998-02-25 | 1999-11-10 | 大塚化学株式会社 | 微細な導電性繊維、該導電性繊維を配合した樹脂組成物及び導電性糸 |
| US6871396B2 (en) * | 2000-02-09 | 2005-03-29 | Matsushita Electric Industrial Co., Ltd. | Transfer material for wiring substrate |
| JP3948217B2 (ja) * | 2000-06-05 | 2007-07-25 | 昭和電工株式会社 | 導電性硬化性樹脂組成物、その硬化体、及びその成形体 |
| JP2001356209A (ja) * | 2000-06-14 | 2001-12-26 | Toppan Printing Co Ltd | カラーフィルタの製造方法 |
| JPWO2002025377A1 (ja) * | 2000-09-20 | 2004-01-29 | 日立化成工業株式会社 | 感光性エレメント、レジストパターンの形成法及びプリント配線板の製造法 |
| JP4779244B2 (ja) * | 2001-06-28 | 2011-09-28 | Tdk株式会社 | 機能性層パターンの形成方法 |
| TW560017B (en) * | 2001-07-12 | 2003-11-01 | Hitachi Ltd | Semiconductor connection substrate |
| CN1195793C (zh) * | 2001-08-06 | 2005-04-06 | 昭和电工株式会社 | 导电的可固化树脂组合物和燃料电池用的隔板 |
| CN100358056C (zh) * | 2002-06-24 | 2007-12-26 | 三菱树脂株式会社 | 导电树脂薄膜、集电器及其制备方法 |
| AU2003281404A1 (en) | 2002-07-05 | 2004-01-23 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition and photosensitive element using the same |
| JP2004230690A (ja) | 2003-01-30 | 2004-08-19 | Takiron Co Ltd | 制電性透明樹脂板 |
| JP4471346B2 (ja) * | 2003-01-31 | 2010-06-02 | タキロン株式会社 | 電磁波シールド体 |
| JP2004253326A (ja) * | 2003-02-21 | 2004-09-09 | Toyobo Co Ltd | 導電性フイルム |
| TWI226115B (en) * | 2003-04-09 | 2005-01-01 | Phoenix Prec Technology Corp | Substrate with enhanced supporting structure and method for fabricating the same |
| US7585907B2 (en) * | 2003-07-24 | 2009-09-08 | Nitto Denko Corporation | Inorganic powder-containing resin composition, a film-forming material layer, a transfer sheet, method of producing a substrate having a dielectric layer formed thereon, and a substrate having a dielectric layer formed thereon |
| TWI266568B (en) * | 2004-03-08 | 2006-11-11 | Brain Power Co | Method for manufacturing embedded thin film resistor on printed circuit board |
| CN100587858C (zh) * | 2004-04-20 | 2010-02-03 | 他喜龙株式会社 | 用于触摸面板的透明导电成形物和触摸面板 |
| JP4666961B2 (ja) * | 2004-06-29 | 2011-04-06 | Tdk株式会社 | 透明導電層が付与された物体、及び転写用導電性フィルム |
| JP2006069848A (ja) | 2004-09-02 | 2006-03-16 | Fuji Xerox Co Ltd | カーボンナノチューブパターンの形成方法 |
| JP2008515654A (ja) * | 2004-10-12 | 2008-05-15 | ナノシス・インク. | 導電性ポリマー及び半導体ナノワイヤに基づいてプラスチック電子部品を製造するための完全に集積化された有機層プロセス |
| JP4657685B2 (ja) * | 2004-11-11 | 2011-03-23 | 日立エーアイシー株式会社 | 電磁波シールドフィルムの製造方法およびそのフィルム |
| JP4805587B2 (ja) * | 2005-02-24 | 2011-11-02 | エーユー オプトロニクス コーポレイション | 液晶表示装置とその製造方法 |
| TWI260189B (en) * | 2005-03-30 | 2006-08-11 | Advanced Semiconductor Eng | Method of fabricating a device-containing substrate |
| JP2006310154A (ja) * | 2005-04-28 | 2006-11-09 | Bussan Nanotech Research Institute Inc | 透明導電膜および透明導電膜用コーティング組成物 |
| KR101196342B1 (ko) * | 2005-05-26 | 2012-11-01 | 군제 가부시키가이샤 | 투명 평면체 및 투명 터치스위치 |
| JP2006344479A (ja) | 2005-06-08 | 2006-12-21 | Sumitomo Metal Mining Co Ltd | 透明導電膜形成用感光性塗布液及び透明導電パターン膜とその製造方法 |
| EP1965438A3 (en) * | 2005-08-12 | 2009-05-13 | Cambrios Technologies Corporation | Nanowires-based transparent conductors |
| CN102554261B (zh) * | 2005-11-10 | 2014-08-13 | 住友金属矿山株式会社 | 铟类纳米线、氧化物纳米线与导电性氧化物纳米线以及它们的制造方法 |
| KR20070074316A (ko) | 2006-01-09 | 2007-07-12 | 주식회사 팬택 | 이동통신단말기에서의 brew 실행시 ui 이벤트 처리방법 |
| JP4635925B2 (ja) | 2006-03-22 | 2011-02-23 | Tdk株式会社 | 転写用導電性フィルム及びそれを用いた透明導電層が付与された物体 |
| JP4582033B2 (ja) | 2006-03-22 | 2010-11-17 | Tdk株式会社 | 転写用導電性フィルム及びそれを用いた透明導電層が付与された物体 |
| WO2007114014A1 (ja) * | 2006-03-31 | 2007-10-11 | Hitachi Chemical Company, Ltd. | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
| JP5126654B2 (ja) * | 2006-04-20 | 2013-01-23 | 住友金属鉱山株式会社 | 透明導電膜形成用ネガ型感光性塗布液及び透明導電パターン膜とその製造方法 |
| CN102324462B (zh) * | 2006-10-12 | 2015-07-01 | 凯博瑞奥斯技术公司 | 基于纳米线的透明导体及其应用 |
| JP2008159581A (ja) * | 2006-11-30 | 2008-07-10 | Hitachi Chem Co Ltd | 導電膜形成用材料、導電膜及びその形成方法 |
-
2009
- 2009-07-23 KR KR1020127019642A patent/KR101316977B1/ko not_active Expired - Fee Related
- 2009-07-23 KR KR1020117002155A patent/KR101255433B1/ko not_active Expired - Fee Related
- 2009-07-23 CN CN200980132369.5A patent/CN102124529B/zh not_active Expired - Fee Related
- 2009-07-23 WO PCT/JP2009/063187 patent/WO2010021224A1/ja not_active Ceased
- 2009-07-23 CN CN201210088511.4A patent/CN102645840B/zh not_active Expired - Fee Related
- 2009-07-23 CN CN201410519874.8A patent/CN104282360B/zh not_active Expired - Fee Related
- 2009-07-23 KR KR1020127004508A patent/KR101333906B1/ko not_active Expired - Fee Related
- 2009-07-23 US US13/060,114 patent/US8171628B2/en not_active Expired - Fee Related
- 2009-07-23 EP EP09808160.7A patent/EP2320433B1/en not_active Not-in-force
- 2009-07-23 KR KR1020177024327A patent/KR101855056B1/ko not_active Expired - Fee Related
- 2009-07-23 KR KR1020157012672A patent/KR20150061016A/ko not_active Ceased
- 2009-07-23 CN CN2012102742308A patent/CN102789131A/zh active Pending
- 2009-07-23 KR KR1020167022117A patent/KR101774885B1/ko not_active Expired - Fee Related
- 2009-07-23 EP EP11157859.7A patent/EP2357521B1/en not_active Not-in-force
- 2009-07-23 KR KR1020137022959A patent/KR20130114265A/ko not_active Ceased
- 2009-07-23 CN CN201310692470.4A patent/CN103728794B/zh not_active Expired - Fee Related
- 2009-07-23 JP JP2010525646A patent/JP4811533B2/ja not_active Expired - Fee Related
- 2009-08-06 TW TW102101643A patent/TWI549142B/zh not_active IP Right Cessation
- 2009-08-06 TW TW101118641A patent/TWI405221B/zh not_active IP Right Cessation
- 2009-08-06 TW TW098126580A patent/TWI393153B/zh not_active IP Right Cessation
- 2009-08-06 TW TW102141911A patent/TWI460744B/zh not_active IP Right Cessation
-
2011
- 2011-03-10 JP JP2011053486A patent/JP5418523B2/ja not_active Expired - Fee Related
- 2011-03-11 US US13/046,544 patent/US8426741B2/en not_active Expired - Fee Related
-
2012
- 2012-02-07 US US13/368,057 patent/US8674233B2/en active Active
-
2013
- 2013-09-06 JP JP2013185283A patent/JP6026376B2/ja not_active Expired - Fee Related
-
2014
- 2014-01-13 US US14/153,887 patent/US9161442B2/en not_active Expired - Fee Related
-
2015
- 2015-05-21 JP JP2015103844A patent/JP6290134B2/ja not_active Expired - Fee Related
-
2017
- 2017-02-16 JP JP2017027072A patent/JP6402791B2/ja not_active Expired - Fee Related
Also Published As
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6402791B2 (ja) | 導電膜基板及びその使用方法 | |
| JP5257558B1 (ja) | 導電パターンの形成方法、導電パターン基板及びタッチパネルセンサ | |
| JP5569144B2 (ja) | 感光性導電フィルム、導電膜の形成方法及び導電パターンの形成方法 | |
| JP2012162601A (ja) | オーバーコート用光硬化性樹脂組成物、オーバーコート用光硬化性エレメント、導電膜基板の製造方法及び導電膜基板 | |
| JP2017156510A (ja) | 感光性導電フィルム、導電パターンの形成方法及び導電パターン基板、並びにタッチパネル | |
| JP2018049054A (ja) | 感光性導電フィルム、導電膜の形成方法、導電パターンの形成方法及び導電膜基板の形成方法 | |
| JP2017045687A (ja) | 感光性導電フィルム、感光性導電フィルムロール、及びそれを用いた導電膜・導電パターンの形成方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110726 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110808 |
|
| R151 | Written notification of patent or utility model registration |
Ref document number: 4811533 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140902 Year of fee payment: 3 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140902 Year of fee payment: 3 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| LAPS | Cancellation because of no payment of annual fees |