CN102124529B - 感光性导电膜、导电膜的形成方法、导电图形的形成方法以及导电膜基板 - Google Patents

感光性导电膜、导电膜的形成方法、导电图形的形成方法以及导电膜基板 Download PDF

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Publication number
CN102124529B
CN102124529B CN200980132369.5A CN200980132369A CN102124529B CN 102124529 B CN102124529 B CN 102124529B CN 200980132369 A CN200980132369 A CN 200980132369A CN 102124529 B CN102124529 B CN 102124529B
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conductive
substrate
conductive film
conductive pattern
film
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Expired - Fee Related
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CN200980132369.5A
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English (en)
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CN102124529A (zh
Inventor
山崎宏
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Resonac Corp
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Hitachi Chemical Co Ltd
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Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN201310692470.4A priority Critical patent/CN103728794B/zh
Priority to CN201410519874.8A priority patent/CN104282360B/zh
Publication of CN102124529A publication Critical patent/CN102124529A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/02—Materials and properties organic material
    • G02F2202/022—Materials and properties organic material polymeric
    • G02F2202/023—Materials and properties organic material polymeric curable
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/36—Micro- or nanomaterials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y10T29/4916—Simultaneous circuit manufacturing

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Optics & Photonics (AREA)
  • Nanotechnology (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Conductive Materials (AREA)
  • Position Input By Displaying (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN200980132369.5A 2008-08-22 2009-07-23 感光性导电膜、导电膜的形成方法、导电图形的形成方法以及导电膜基板 Expired - Fee Related CN102124529B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201310692470.4A CN103728794B (zh) 2008-08-22 2009-07-23 感光性导电膜、导电膜的形成方法、导电图形的形成方法以及导电膜基板
CN201410519874.8A CN104282360B (zh) 2008-08-22 2009-07-23 感光性导电膜、导电膜的形成方法、导电图形的形成方法以及导电膜基板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008-214113 2008-08-22
JP2008214113 2008-08-22
PCT/JP2009/063187 WO2010021224A1 (ja) 2008-08-22 2009-07-23 感光性導電フィルム、導電膜の形成方法、導電パターンの形成方法及び導電膜基板

Related Child Applications (4)

Application Number Title Priority Date Filing Date
CN201410519874.8A Division CN104282360B (zh) 2008-08-22 2009-07-23 感光性导电膜、导电膜的形成方法、导电图形的形成方法以及导电膜基板
CN2012102742308A Division CN102789131A (zh) 2008-08-22 2009-07-23 感光性导电膜、导电膜的形成方法、导电图形的形成方法以及导电膜基板
CN201210088511.4A Division CN102645840B (zh) 2008-08-22 2009-07-23 导电图形的形成方法以及导电膜基板
CN201310692470.4A Division CN103728794B (zh) 2008-08-22 2009-07-23 感光性导电膜、导电膜的形成方法、导电图形的形成方法以及导电膜基板

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CN102124529A CN102124529A (zh) 2011-07-13
CN102124529B true CN102124529B (zh) 2014-11-05

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Application Number Title Priority Date Filing Date
CN200980132369.5A Expired - Fee Related CN102124529B (zh) 2008-08-22 2009-07-23 感光性导电膜、导电膜的形成方法、导电图形的形成方法以及导电膜基板
CN201210088511.4A Expired - Fee Related CN102645840B (zh) 2008-08-22 2009-07-23 导电图形的形成方法以及导电膜基板
CN201410519874.8A Expired - Fee Related CN104282360B (zh) 2008-08-22 2009-07-23 感光性导电膜、导电膜的形成方法、导电图形的形成方法以及导电膜基板
CN2012102742308A Pending CN102789131A (zh) 2008-08-22 2009-07-23 感光性导电膜、导电膜的形成方法、导电图形的形成方法以及导电膜基板
CN201310692470.4A Expired - Fee Related CN103728794B (zh) 2008-08-22 2009-07-23 感光性导电膜、导电膜的形成方法、导电图形的形成方法以及导电膜基板

Family Applications After (4)

Application Number Title Priority Date Filing Date
CN201210088511.4A Expired - Fee Related CN102645840B (zh) 2008-08-22 2009-07-23 导电图形的形成方法以及导电膜基板
CN201410519874.8A Expired - Fee Related CN104282360B (zh) 2008-08-22 2009-07-23 感光性导电膜、导电膜的形成方法、导电图形的形成方法以及导电膜基板
CN2012102742308A Pending CN102789131A (zh) 2008-08-22 2009-07-23 感光性导电膜、导电膜的形成方法、导电图形的形成方法以及导电膜基板
CN201310692470.4A Expired - Fee Related CN103728794B (zh) 2008-08-22 2009-07-23 感光性导电膜、导电膜的形成方法、导电图形的形成方法以及导电膜基板

Country Status (7)

Country Link
US (4) US8171628B2 (enExample)
EP (2) EP2320433B1 (enExample)
JP (5) JP4811533B2 (enExample)
KR (7) KR101316977B1 (enExample)
CN (5) CN102124529B (enExample)
TW (4) TWI549142B (enExample)
WO (1) WO2010021224A1 (enExample)

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