JP4803959B2 - 試験プローブ整列装置 - Google Patents

試験プローブ整列装置 Download PDF

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Publication number
JP4803959B2
JP4803959B2 JP2003580875A JP2003580875A JP4803959B2 JP 4803959 B2 JP4803959 B2 JP 4803959B2 JP 2003580875 A JP2003580875 A JP 2003580875A JP 2003580875 A JP2003580875 A JP 2003580875A JP 4803959 B2 JP4803959 B2 JP 4803959B2
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stage
alignment system
probe alignment
test probe
rotatable
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Japanese (ja)
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JP2005521066A5 (enExample
JP2005521066A (ja
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ワイ キュン キム
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エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2003580875A 2002-03-22 2003-03-21 試験プローブ整列装置 Expired - Fee Related JP4803959B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US36691202P 2002-03-22 2002-03-22
US60/366,912 2002-03-22
PCT/US2003/008913 WO2003083494A1 (en) 2002-03-22 2003-03-21 Test probe alignment apparatus

Publications (3)

Publication Number Publication Date
JP2005521066A JP2005521066A (ja) 2005-07-14
JP2005521066A5 JP2005521066A5 (enExample) 2006-04-27
JP4803959B2 true JP4803959B2 (ja) 2011-10-26

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JP2003580875A Expired - Fee Related JP4803959B2 (ja) 2002-03-22 2003-03-21 試験プローブ整列装置

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US (1) US7119566B2 (enExample)
JP (1) JP4803959B2 (enExample)
KR (1) KR101163972B1 (enExample)
CN (1) CN100430735C (enExample)
AU (1) AU2003218348A1 (enExample)
CA (1) CA2476389A1 (enExample)
DE (1) DE10392404T5 (enExample)
GB (1) GB2400447B (enExample)
TW (1) TWI272392B (enExample)
WO (1) WO2003083494A1 (enExample)

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US20030178988A1 (en) 2003-09-25
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US7119566B2 (en) 2006-10-10
GB2400447A (en) 2004-10-13
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GB2400447B (en) 2005-10-12
TWI272392B (en) 2007-02-01
CN1639577A (zh) 2005-07-13
TW200304545A (en) 2003-10-01
KR101163972B1 (ko) 2012-07-09
WO2003083494A1 (en) 2003-10-09
CN100430735C (zh) 2008-11-05
DE10392404T5 (de) 2005-04-14
JP2005521066A (ja) 2005-07-14

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