JP6671310B2 - ワーク保持装置、検査装置およびワーク位置補正方法 - Google Patents
ワーク保持装置、検査装置およびワーク位置補正方法 Download PDFInfo
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- JP6671310B2 JP6671310B2 JP2017047285A JP2017047285A JP6671310B2 JP 6671310 B2 JP6671310 B2 JP 6671310B2 JP 2017047285 A JP2017047285 A JP 2017047285A JP 2017047285 A JP2017047285 A JP 2017047285A JP 6671310 B2 JP6671310 B2 JP 6671310B2
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- 238000007689 inspection Methods 0.000 title claims description 105
- 238000012937 correction Methods 0.000 title claims description 14
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- 230000007246 mechanism Effects 0.000 claims description 92
- 238000003384 imaging method Methods 0.000 claims description 27
- 230000002093 peripheral effect Effects 0.000 claims description 17
- 238000001514 detection method Methods 0.000 claims description 8
- 238000012545 processing Methods 0.000 description 13
- 238000005286 illumination Methods 0.000 description 12
- 230000004044 response Effects 0.000 description 9
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- 230000007547 defect Effects 0.000 description 3
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- 238000005266 casting Methods 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/952—Inspecting the exterior surface of cylindrical bodies or wires
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
- G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
- G01M11/0207—Details of measuring devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
- G01M11/0242—Testing optical properties by measuring geometrical properties or aberrations
- G01M11/025—Testing optical properties by measuring geometrical properties or aberrations by determining the shape of the object to be tested
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9515—Objects of complex shape, e.g. examined with use of a surface follower device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/2441—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using interferometry
Description
21A,21B…保持テーブル
22…チャック機構
23…水平位置決め機構
24…回転機構
27…アライメントカメラ(アライメント用撮像部)
31…検査カメラ(検査用撮像部)
51…演算処理部(芯ズレ検出部、ワーク位置補正部)
100…検査装置
221〜223…可動部材
271…ラインセンサ
AX2…(チャック機構の)中心軸
AX3…(モータ241の)回転軸
AX4…対称軸
PA…プリアライメント位置
PI…検査位置(非プリアライメント位置)
W…ワーク
Δ…ズレ量
Claims (6)
- 対称軸まわりに回転対称な外周部を有するワークを検査するための検査位置で前記ワークを保持して回転軸まわりに回転させるワーク保持装置であって、
前記ワークを保持するチャック機構と、前記チャック機構を支持しながら前記回転軸と直交する方向に前記チャック機構を移動させて前記ワークを位置決めする位置決め機構と、前記位置決め機構を前記回転軸まわりに回転させることで前記チャック機構に保持された前記ワークを前記回転軸まわりに回転させる回転機構とを有する保持テーブルと、
前記検査位置から離間したプリアライメント位置と前記検査位置との間で前記保持テーブルを移動させるテーブル移動機構と、
前記保持テーブルが前記検査位置に移動される前に前記プリアライメント位置で前記保持テーブルの前記チャック機構に保持された前記ワークの前記外周部を撮像するアライメント用撮像部と、
前記回転機構により回転される前記ワークを前記アライメント用撮像部で撮像することで取得される画像に基づいて前記回転軸に対する前記対称軸の芯ズレを検出する芯ズレ検出部と、
前記芯ズレを解消するように前記位置決め機構により前記チャック機構を移動させて前記対称軸が前記回転軸と一致するように前記ワークの位置補正を行うワーク位置補正部と、
を備えることを特徴とするワーク保持装置。 - 請求項1に記載のワーク保持装置であって、
前記チャック機構は、複数の可動部材と、前記複数の可動部材を中心軸に対して近接および離間させる移動部とを有し、前記移動部により前記複数の可動部材を同時にそれぞれ前記中心軸に向かって移動させて前記ワークを保持するワーク保持装置。 - 請求項2に記載のワーク保持装置であって、
前記芯ズレ検出部は、前記複数の可動部材により保持された前記ワークを、前記回転軸に対して前記中心軸が一致するように位置決めした状態で前記回転機構により回転させるワーク保持装置。 - 請求項1ないし3のいずれか一項に記載のワーク保持装置であって、
前記保持テーブルを前記プリアライメント位置から前記検査位置に移動している間に、前記芯ズレの検出および前記ワークの位置補正の少なくとも一部が並行して実行されるワーク保持装置。 - 対称軸まわりに回転対称な外周部を有するワークを検査するための検査位置で前記ワークを検査する検査装置であって、
請求項1ないし4のいずれか一項に記載されたワーク保持装置と、
前記検査位置で前記ワーク保持装置により前記対称軸を前記回転軸と一致させた状態で前記回転軸まわりに回転される前記ワークを撮像する検査用撮像部と、
前記検査用撮像部により撮像された画像に基づいて前記ワークを検査するワーク検査部と、
を備えることを特徴とする検査装置。 - 対称軸まわりに回転対称な外周部を有するワークを検査するための検査位置で前記ワークを保持して回転軸まわりに回転させるワーク保持装置におけるワーク位置補正方法であって、
前記ワーク保持装置のチャック機構により前記ワークを保持する第1工程と、
前記ワークを保持した前記チャック機構が前記検査位置に移動される前に前記検査位置から離間したプリアライメント位置で前記チャック機構を前記回転軸まわりに回転させながら前記ワークの前記外周部を撮像する第2工程と、
前記第2工程により得られる画像に基づいて前記回転軸に対する前記対称軸の芯ズレを検出する第3工程と、
前記芯ズレを解消するように前記チャック機構を前記回転軸に対して直交する方向に移動させて前記対称軸を前記回転軸に一致させる第4工程と
を備えることを特徴とするワーク位置補正方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017047285A JP6671310B2 (ja) | 2017-03-13 | 2017-03-13 | ワーク保持装置、検査装置およびワーク位置補正方法 |
PCT/JP2017/040423 WO2018168065A1 (ja) | 2017-03-13 | 2017-11-09 | ワーク保持装置、検査装置およびワーク位置補正方法 |
EP17900295.1A EP3598109B1 (en) | 2017-03-13 | 2017-11-09 | Workpiece holding device, inspection device, and workpiece position correction method |
CN201780081005.3A CN110114658A (zh) | 2017-03-13 | 2017-11-09 | 工件保持装置、检查装置及工件位置校正方法 |
US16/475,987 US10658219B2 (en) | 2017-03-13 | 2017-11-09 | Workpiece holder, inspection apparatus, and workpiece position correction method |
TW106139507A TWI663393B (zh) | 2017-03-13 | 2017-11-15 | 工件保持裝置、檢查裝置及工件位置補正方法 |
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JP2017047285A JP6671310B2 (ja) | 2017-03-13 | 2017-03-13 | ワーク保持装置、検査装置およびワーク位置補正方法 |
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JP2018151243A JP2018151243A (ja) | 2018-09-27 |
JP6671310B2 true JP6671310B2 (ja) | 2020-03-25 |
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US (1) | US10658219B2 (ja) |
EP (1) | EP3598109B1 (ja) |
JP (1) | JP6671310B2 (ja) |
CN (1) | CN110114658A (ja) |
TW (1) | TWI663393B (ja) |
WO (1) | WO2018168065A1 (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP6598898B2 (ja) * | 2018-02-27 | 2019-10-30 | 株式会社Screenホールディングス | 芯ズレ検出装置および芯ズレ検出方法 |
JP7161956B2 (ja) * | 2019-02-22 | 2022-10-27 | 株式会社Screenホールディングス | 検査装置および検査方法 |
JP7204309B2 (ja) * | 2020-09-24 | 2023-01-16 | 旭精機工業株式会社 | 孔開け加工システム |
CN111928796B (zh) * | 2020-09-27 | 2021-01-01 | 山东海德智汇智能装备有限公司 | 一种基于3d扫描和激光制造的零件高精度识别检测系统 |
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2017
- 2017-03-13 JP JP2017047285A patent/JP6671310B2/ja active Active
- 2017-11-09 CN CN201780081005.3A patent/CN110114658A/zh active Pending
- 2017-11-09 EP EP17900295.1A patent/EP3598109B1/en active Active
- 2017-11-09 WO PCT/JP2017/040423 patent/WO2018168065A1/ja unknown
- 2017-11-09 US US16/475,987 patent/US10658219B2/en active Active
- 2017-11-15 TW TW106139507A patent/TWI663393B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
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EP3598109B1 (en) | 2023-10-18 |
EP3598109A4 (en) | 2021-01-13 |
EP3598109A1 (en) | 2020-01-22 |
US20190353555A1 (en) | 2019-11-21 |
US10658219B2 (en) | 2020-05-19 |
TW201843437A (zh) | 2018-12-16 |
WO2018168065A1 (ja) | 2018-09-20 |
TWI663393B (zh) | 2019-06-21 |
CN110114658A (zh) | 2019-08-09 |
JP2018151243A (ja) | 2018-09-27 |
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