AU2003218348A1 - Test probe alignment apparatus - Google Patents

Test probe alignment apparatus

Info

Publication number
AU2003218348A1
AU2003218348A1 AU2003218348A AU2003218348A AU2003218348A1 AU 2003218348 A1 AU2003218348 A1 AU 2003218348A1 AU 2003218348 A AU2003218348 A AU 2003218348A AU 2003218348 A AU2003218348 A AU 2003218348A AU 2003218348 A1 AU2003218348 A1 AU 2003218348A1
Authority
AU
Australia
Prior art keywords
test probe
alignment apparatus
probe alignment
test
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003218348A
Other languages
English (en)
Inventor
Kyung Y. Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of AU2003218348A1 publication Critical patent/AU2003218348A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
AU2003218348A 2002-03-22 2003-03-21 Test probe alignment apparatus Abandoned AU2003218348A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US36691202P 2002-03-22 2002-03-22
US60/366,912 2002-03-22
PCT/US2003/008913 WO2003083494A1 (en) 2002-03-22 2003-03-21 Test probe alignment apparatus

Publications (1)

Publication Number Publication Date
AU2003218348A1 true AU2003218348A1 (en) 2003-10-13

Family

ID=28675301

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003218348A Abandoned AU2003218348A1 (en) 2002-03-22 2003-03-21 Test probe alignment apparatus

Country Status (10)

Country Link
US (1) US7119566B2 (enExample)
JP (1) JP4803959B2 (enExample)
KR (1) KR101163972B1 (enExample)
CN (1) CN100430735C (enExample)
AU (1) AU2003218348A1 (enExample)
CA (1) CA2476389A1 (enExample)
DE (1) DE10392404T5 (enExample)
GB (1) GB2400447B (enExample)
TW (1) TWI272392B (enExample)
WO (1) WO2003083494A1 (enExample)

Families Citing this family (118)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050205778A1 (en) * 2003-10-17 2005-09-22 Gsi Lumonics Corporation Laser trim motion, calibration, imaging, and fixturing techniques
CN100480953C (zh) * 2005-01-10 2009-04-22 新科实业有限公司 短尾读写头万向架组件测试夹具
US7891936B2 (en) 2005-03-30 2011-02-22 Brooks Automation, Inc. High speed substrate aligner apparatus
US8545165B2 (en) 2005-03-30 2013-10-01 Brooks Automation, Inc. High speed substrate aligner apparatus
JP4529135B2 (ja) * 2005-04-11 2010-08-25 富士機械製造株式会社 対回路基板作業システム
KR100734751B1 (ko) * 2005-04-28 2007-07-03 에버테크노 주식회사 소형 편광필름 검사용 지그
US7471094B2 (en) * 2005-06-24 2008-12-30 Formfactor, Inc. Method and apparatus for adjusting a multi-substrate probe structure
US7355422B2 (en) * 2005-09-17 2008-04-08 Touchdown Technologies, Inc. Optically enhanced probe alignment
US7362116B1 (en) * 2005-11-09 2008-04-22 Electroglas, Inc. Method for probing impact sensitive and thin layered substrate
US7365553B2 (en) * 2005-12-22 2008-04-29 Touchdown Technologies, Inc. Probe card assembly
US7368929B2 (en) * 2006-01-18 2008-05-06 Electroglas, Inc. Methods and apparatuses for improved positioning in a probing system
US7583098B2 (en) * 2006-02-08 2009-09-01 Sv Probe Pte. Ltd. Automated probe card planarization and alignment methods and tools
US7514942B2 (en) * 2006-09-27 2009-04-07 Intel Corporation Probe based patterning of microelectronic and micromechanical devices
US8436636B2 (en) * 2006-10-10 2013-05-07 Apple Inc. Methods and apparatuses for testing circuit boards
US8362793B2 (en) 2006-11-07 2013-01-29 Apple Inc. Circuit boards including removable test point portions and configurable testing platforms
US7764079B1 (en) * 2007-01-31 2010-07-27 SemiProbe LLC Modular probe system
EP2114634A4 (en) * 2007-02-23 2010-11-17 Intest Corp TESTING HEAD MANIPULATOR
US7965091B2 (en) * 2007-04-30 2011-06-21 Electro Scientific Industries, Inc. Test plate for electronic handler
US7557594B2 (en) * 2007-08-14 2009-07-07 Electro Scientific Industries, Inc. Automated contact alignment tool
DE102007046443A1 (de) * 2007-09-28 2009-04-09 Siemens Ag Verfahren zur Messnadelüberwachung im Prüfbetrieb
CN101424870B (zh) * 2007-10-31 2011-09-28 鸿富锦精密工业（深圳）有限公司 镜座测试装置及测试方法
US7924037B2 (en) * 2007-12-07 2011-04-12 Ricoh Company, Ltd. Inspection apparatus comprising means for removing flux
US7791361B2 (en) * 2007-12-10 2010-09-07 Touchdown Technologies, Inc. Planarizing probe card
CN101464474B (zh) * 2007-12-20 2012-03-21 和舰科技(苏州)有限公司 一种可旋转探针卡的半导体测量探针台
US7609078B2 (en) * 2007-12-21 2009-10-27 Electro Scientific Industries, Inc. Contact alignment verification/adjustment fixture
US7888949B2 (en) * 2008-03-21 2011-02-15 Electro Scientific Industries, Inc. Electrical tester setup and calibration device
US8024060B2 (en) * 2008-06-16 2011-09-20 Electro Scientific Industries, Inc. Method for defining safe zones in laser machining systems
TWI402932B (zh) * 2009-05-27 2013-07-21 Star Techn Inc 具有多軸載台之半導體元件測試裝置
WO2010140244A1 (ja) * 2009-06-05 2010-12-09 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
CN101852612B (zh) * 2010-03-25 2012-07-04 西北工业大学 一种慢波结构和扰动杆的对中装置
US9684052B2 (en) 2010-04-23 2017-06-20 Rudolph Technologies, Inc. Method of measuring and assessing a probe card with an inspection device
TWI507692B (zh) 2010-04-23 2015-11-11 Rudolph Technologies Inc 具有可垂直移動總成之檢查裝置
JP5517350B2 (ja) * 2010-06-15 2014-06-11 東京エレクトロン株式会社 載置台駆動装置
US7986157B1 (en) * 2010-09-02 2011-07-26 Star Technologies Inc. High speed probing apparatus for semiconductor devices and probe stage for the same
US8838408B2 (en) 2010-11-11 2014-09-16 Optimal Plus Ltd Misalignment indication decision system and method
KR101129195B1 (ko) * 2010-12-20 2012-03-27 주식회사 탑 엔지니어링 어레이 테스트 장치
CN102175264B (zh) * 2011-01-23 2012-11-14 浙江大学 一种测量光纤陀螺带宽的方法
DE102011102791A1 (de) * 2011-05-27 2012-11-29 Feinmetall Gmbh Federkontaktstiftanordnung
KR101223584B1 (ko) * 2011-06-01 2013-01-17 에이엘티 세미콘(주) 프로브 카드의 정렬 장치
CN102590566B (zh) * 2012-03-16 2014-06-04 苏州工业园区世纪福科技有限公司 一种电子产品测试夹具的自动对准方法
CN104838276A (zh) * 2012-07-12 2015-08-12 康拉德有限责任公司 制备和/或加工工件的装置
CN102778591A (zh) * 2012-07-20 2012-11-14 昆山迈致治具科技有限公司 Pcb电压测量治具
CN102967806B (zh) * 2012-11-09 2016-04-13 昆山迈致治具科技有限公司 测高压治具
CN103018505A (zh) * 2012-12-04 2013-04-03 无锡圆方半导体测试有限公司 一种探针修正装置
US20140184003A1 (en) * 2012-12-31 2014-07-03 Cascade Microtech, Inc. Systems and methods for rotational alignment of a device under test
CN103091521B (zh) * 2013-01-08 2015-07-15 上海交通大学 一种探针和引脚自动对准的方法及其探针台测试系统
US9335345B1 (en) * 2013-03-18 2016-05-10 Christos Tsironis Method for planarity alignment of waveguide wafer probes
US9322843B1 (en) * 2013-03-19 2016-04-26 Christos Tsironis Method for planarity alignment of wafer probes
KR101332588B1 (ko) * 2013-06-25 2013-11-25 주식회사 프로이천 필름타입 프로브카드
WO2015017765A2 (en) * 2013-08-01 2015-02-05 Hysitron, Inc. Instrument changing assembly and methods for the same
TWI497090B (zh) * 2013-09-05 2015-08-21 Chroma Ate Inc With the coaxial drive pick and place the detection machine
JP6084140B2 (ja) * 2013-09-06 2017-02-22 ヤマハファインテック株式会社 電気検査装置
TWI522628B (zh) * 2013-12-13 2016-02-21 Mpi Corp Electrical detection device
KR101503289B1 (ko) * 2013-12-27 2015-03-18 주식회사 이레테크 전자파 테스트용 지지장치
WO2015103365A1 (en) * 2013-12-31 2015-07-09 Celadon Systems, Inc. Test apparatus having a probe core with a latch mechanism
US10281518B2 (en) 2014-02-25 2019-05-07 Formfactor Beaverton, Inc. Systems and methods for on-wafer dynamic testing of electronic devices
KR101438098B1 (ko) * 2014-03-20 2014-09-12 피앤티솔루션 주식회사 연성 인쇄회로기판의 프로브카드 얼라인장치
KR101934880B1 (ko) * 2014-05-15 2019-01-03 삼성전자주식회사 탐침 장치 및 그 운용 방법
JP6680695B2 (ja) * 2014-06-06 2020-04-15 ルドルフ・テクノロジーズ，インコーポレーテッド 検査デバイスを用いてプローブカードを測定および評価する方法
KR101598596B1 (ko) * 2014-07-24 2016-03-14 (주) 루켄테크놀러지스 전자 디바이스의 검사장치
TW201617631A (zh) * 2014-11-10 2016-05-16 Tian Zheng Internat Prec Machinery Co Ltd 自動化層測設備
CN105319402B (zh) * 2015-01-13 2018-03-09 湘潭大学 一种检测金属材料损伤的微电阻测量夹具装置及使用方法
US10168287B2 (en) * 2015-06-12 2019-01-01 The Boeing Company Automated detection of fatigue cracks around fasteners using millimeter waveguide probe
WO2017014060A1 (ja) * 2015-07-23 2017-01-26 株式会社東京精密 プローバ及びプローブコンタクト方法
DE102015113046A1 (de) * 2015-08-07 2017-02-09 Xcerra Corp. Positioniereinrichtung für einen Paralleltester zum Testen von Leiterplatten und Paralleltester zum Testen von Leiterplatten
KR101588856B1 (ko) * 2015-09-04 2016-01-27 주식회사 디이엔티 액정표시패널 검사장치의 프로브 유닛 위치 조절장치
KR101738257B1 (ko) * 2015-09-11 2017-05-30 안동대학교 산학협력단 프로브 회전형 원자현미경의 프로브 정렬도 측정 방법
CN105223389B (zh) * 2015-09-28 2018-02-02 大族激光科技产业集团股份有限公司 一种飞针测试机的对位方法
TWI616664B (zh) * 2016-03-23 2018-03-01 創意電子股份有限公司 使用探針卡之方法、系統及其探針卡裝置
CN106249081A (zh) * 2016-08-29 2016-12-21 芜湖创易科技有限公司 一种电子产品检测系统
CN106569476B (zh) * 2016-10-20 2019-01-11 西安坤蓝电子技术有限公司 一种天线轴系固有频率及控制系统带宽的自我检测方法
CN108122795A (zh) * 2016-11-28 2018-06-05 深圳市微凡半导体有限公司 Cmos摄像头晶圆单颗电性和功能检测装置及方法
TWI630391B (zh) * 2016-12-28 2018-07-21 東捷科技股份有限公司 Jig with retractable probe
CN106839937B (zh) * 2017-01-23 2019-08-06 安徽三安光电有限公司 一种晶片厚度测量装置及其测量方法
JP6671310B2 (ja) * 2017-03-13 2020-03-25 株式会社Ｓｃｒｅｅｎホールディングス ワーク保持装置、検査装置およびワーク位置補正方法
KR101917161B1 (ko) * 2017-03-20 2019-01-25 양윤재 평판 디스플레이용 전기적 특성 시험 장치의 헤드부 프로브 카드 회전 및 이송 장치
CN107192353B (zh) * 2017-06-08 2019-07-30 京东方科技集团股份有限公司 台阶仪及探针检测装置
TWI645194B (zh) * 2017-07-12 2018-12-21 萬潤科技股份有限公司 探針模組、探針裝置及使用該探針裝置之電子元件檢測方法及設備
US10527649B2 (en) 2017-07-14 2020-01-07 International Business Machines Corporation Probe card alignment
US10345136B2 (en) * 2017-07-14 2019-07-09 International Business Machines Corporation Adjustable load transmitter
CN107389983B (zh) * 2017-07-31 2020-05-12 京东方科技集团股份有限公司 定位装置及显示模组的电学检测系统
US10761145B2 (en) 2017-08-22 2020-09-01 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Illuminating fixture and device
CN107578733A (zh) * 2017-08-22 2018-01-12 武汉华星光电半导体显示技术有限公司 一种点亮治具及装置
MX2020003490A (es) * 2017-10-09 2020-09-21 Ascent Auto Interior Llc Sistema de embalaje automatizado.
CN108535622A (zh) * 2018-04-28 2018-09-14 德淮半导体有限公司 晶圆测试装置、系统及方法
CN109031095B (zh) * 2018-07-23 2025-04-01 清华大学 用于植入式医疗仪器电路板自动测试的探针接触式工装
JP7182951B2 (ja) * 2018-08-27 2022-12-05 株式会社日本マイクロニクス 検査装置及び検査方法
DE102018121911A1 (de) * 2018-09-07 2020-03-12 Formfactor Gmbh Verfahren zur Positionierung von Testsubstrat, Sonden und Inspektionseinheit relativ zueinander und Prober zu dessen Ausführung
KR102581387B1 (ko) * 2018-09-11 2023-09-21 삼성전자주식회사 프로브 및 이를 포함하는 프로브 카드
CN111239448B (zh) * 2018-11-28 2024-05-03 长鑫存储技术有限公司 测试机以及用于校准探针卡与待测器件的方法
WO2020108352A1 (en) * 2018-11-28 2020-06-04 Changxin Memory Technologies, Inc. Tester and method for calibrating probe card and device under testing (dut)
CN109782103B (zh) * 2019-03-11 2021-07-30 镇江宏祥自动化科技有限公司 探针与电子器件引脚的对准方法及系统
CN110187259A (zh) * 2019-06-10 2019-08-30 德淮半导体有限公司 一种防止晶圆测试中针痕偏移的调整系统以及调整方法
TWI692644B (zh) * 2019-06-18 2020-05-01 旺矽科技股份有限公司 電子元件針測裝置
US11637030B2 (en) * 2019-06-18 2023-04-25 Kla Corporation Multi-stage, multi-zone substrate positioning systems
JP7371885B2 (ja) * 2019-07-08 2023-10-31 ヤマハファインテック株式会社 電気検査装置及び保持ユニット
US10867822B1 (en) * 2019-07-26 2020-12-15 Yaskawa America, Inc. Wafer pre-alignment apparatus and method
KR102353209B1 (ko) * 2020-01-22 2022-01-24 주식회사 탑 엔지니어링 프로브 장치
CN111243976A (zh) * 2020-03-17 2020-06-05 南京中电熊猫平板显示科技有限公司 一种检测修补设备和方法
KR102261798B1 (ko) * 2020-04-03 2021-06-07 (주)화이컴 프로브 카드 제조용 지그, 이를 포함하는 프로브 정렬 시스템 및 이를 이용하여 제조된 프로브 카드
TWI821750B (zh) * 2020-10-07 2023-11-11 台灣愛司帝科技股份有限公司 電子元件量測設備、電子元件量測方法及發光二極體的製造方法
CN115406887B (zh) * 2021-05-28 2025-10-28 长鑫存储技术有限公司 微光探测装置和半导体设备
CN115704857A (zh) * 2021-08-09 2023-02-17 苏州联讯仪器有限公司 激光器芯片用测试探针台
US11668745B1 (en) * 2022-03-09 2023-06-06 Nanya Technology Corporation Probe apparatus having a track and wafer inspection method using the same
US11747394B1 (en) * 2022-03-09 2023-09-05 Nanya Technology Corporation Probe apparatus with a track
TWI825731B (zh) * 2022-03-09 2023-12-11 南亞科技股份有限公司 探針裝置及晶圓檢測方法
KR102646590B1 (ko) * 2022-04-05 2024-03-13 주식회사 아이에스시 프로브 카드 고정장치
US11940486B2 (en) 2022-06-01 2024-03-26 Nanya Technology Corporation Probe station capable of maintaining stable and accurate contact to device under test
CN114994508A (zh) * 2022-06-13 2022-09-02 深圳米飞泰克科技股份有限公司 一种基板测试系统和基板测试方法
TWI825798B (zh) * 2022-06-22 2023-12-11 吳俊杰 彈性探針及電路測試裝置
CN115265623A (zh) * 2022-08-08 2022-11-01 上海泽丰半导体科技有限公司 一种存储针卡定位装置及定位系统
TWI858524B (zh) * 2023-01-19 2024-10-11 旺矽科技股份有限公司 電路板檢測設備
CN116643147B (zh) * 2023-05-26 2024-05-07 深圳市奇易创新科技有限公司 一种移动电源电芯电路板焊接检测机
CN116500424B (zh) * 2023-06-27 2024-03-29 深圳市克洛诺斯科技有限公司 一种pcb检测装置
US20250258219A1 (en) * 2024-02-13 2025-08-14 Teradyne, Inc. Aligning connectors in a test system
JP2025136117A (ja) * 2024-03-06 2025-09-19 株式会社 東京ウエルズ ステージユニット及び処理システム
JP2025136108A (ja) * 2024-03-06 2025-09-19 株式会社 東京ウエルズ ステージユニット及び処理システム
CN118466471B (zh) * 2024-07-11 2024-10-01 西安交通大学城市学院 一种电气控制板测试架

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2275291A (en) * 1939-04-04 1942-03-03 Rudolph F Bannow Machine tool operating at universal angles in overall locations
US3899634A (en) 1971-05-26 1975-08-12 Western Electric Co Video controlled positioning method and apparatus
US4266191A (en) 1979-04-18 1981-05-05 Spano John D Test probe alignment apparatus
JPS6115341A (ja) 1984-07-02 1986-01-23 Canon Inc ウエハプロ−バ
JPS61181143A (ja) * 1985-02-06 1986-08-13 Matsushita Electric Ind Co Ltd プロ−ブマニユピレ−タ
JPS61283138A (ja) * 1985-06-07 1986-12-13 Canon Inc プロ−バ
JPS6362245A (ja) * 1986-09-02 1988-03-18 Canon Inc ウエハプロ−バ
US4864227A (en) 1987-02-27 1989-09-05 Canon Kabushiki Kaisha Wafer prober
JPH0719811B2 (ja) * 1987-03-31 1995-03-06 東京エレクトロン株式会社 プロ−ブ装置によるウエハの検査方法
JPS63260146A (ja) * 1987-04-17 1988-10-27 Nippon Maikuronikusu:Kk 半導体ウエハ測定装置
JPS6486531A (en) * 1987-09-29 1989-03-31 Canon Kk Prober
JPH0194631A (ja) * 1987-10-06 1989-04-13 Canon Inc ウエハプローバ
JP2533178B2 (ja) * 1988-12-20 1996-09-11 富士通株式会社 テスタヘッド搭載スタンド
JP2735859B2 (ja) * 1989-02-10 1998-04-02 東京エレクトロン株式会社 プローバ及びプロービング方法
JPH0328909A (ja) * 1989-06-26 1991-02-07 Tokyo Electron Ltd 移動誤差補正方法
JPH04129044A (ja) * 1990-09-19 1992-04-30 Canon Inc 情報読取り及び／又は入力装置
JPH04312939A (ja) * 1990-12-28 1992-11-04 Tokyo Electron Ltd プローブ装置
JPH0621166A (ja) * 1992-06-30 1994-01-28 Mitsubishi Electric Corp ウエハプローバ
JP2963603B2 (ja) 1993-05-31 1999-10-18 東京エレクトロン株式会社 プローブ装置のアライメント方法
US5642056A (en) 1993-12-22 1997-06-24 Tokyo Electron Limited Probe apparatus for correcting the probe card posture before testing
US5528158A (en) 1994-04-11 1996-06-18 Xandex, Inc. Probe card changer system and method
US5656942A (en) 1995-07-21 1997-08-12 Electroglas, Inc. Prober and tester with contact interface for integrated circuits-containing wafer held docked in a vertical plane
US5731708A (en) * 1995-10-31 1998-03-24 Hughes Aircraft Company Unpackaged semiconductor testing using an improved probe and precision X-Y table
US6166552A (en) * 1996-06-10 2000-12-26 Motorola Inc. Method and apparatus for testing a semiconductor wafer
US5982166A (en) * 1997-01-27 1999-11-09 Motorola, Inc. Method for measuring a characteristic of a semiconductor wafer using cylindrical control
US6002426A (en) 1997-07-02 1999-12-14 Cerprobe Corporation Inverted alignment station and method for calibrating needles of probe card for probe testing of integrated circuits
US5994909A (en) 1997-08-25 1999-11-30 Lucas; Brian K. Robotic twin probe for measurement on printed circuit boards and electrical and electronic assemblies
EP0962777A3 (en) * 1998-06-02 2002-12-11 Nihon Densan Read Kabushiki Kaisha, (Nidec-Read Corporation) Printed circuit board testing apparatus
JP2000077488A (ja) * 1998-08-31 2000-03-14 Nec Kyushu Ltd プローブ装置

Also Published As

Publication number Publication date
CA2476389A1 (en) 2003-10-09
US20030178988A1 (en) 2003-09-25
KR20040105785A (ko) 2004-12-16
US7119566B2 (en) 2006-10-10
GB2400447A (en) 2004-10-13
JP4803959B2 (ja) 2011-10-26
GB0416819D0 (en) 2004-09-01
GB2400447B (en) 2005-10-12
TWI272392B (en) 2007-02-01
CN1639577A (zh) 2005-07-13
TW200304545A (en) 2003-10-01
KR101163972B1 (ko) 2012-07-09
WO2003083494A1 (en) 2003-10-09
CN100430735C (zh) 2008-11-05
DE10392404T5 (de) 2005-04-14
JP2005521066A (ja) 2005-07-14

Similar Documents

Publication Publication Date Title
AU2003218348A1 (en) Test probe alignment apparatus
EP2461156B8 (en) Apparatus for luminescence test measurements
AU2002349755A1 (en) Electronic part test apparatus
AU2003282642A1 (en) Blood testing apparatus
AU2003217078A1 (en) Apparatus for seismic measurements
TWI317816B (en) Testing apparatus
AU2002347370A1 (en) Test apparatus
AU2003237344A1 (en) Testing device
GB2395281B (en) Test probe
GB0304619D0 (en) Testing apparatus
EP1511986A4 (en) APPARATUS FOR MEASURING THE SURFACE SPEED OF A GREEN
AU2003291821A1 (en) Corrosion testing apparatus
EP1666896A4 (en) TEST DEVICE
AU2002951034A0 (en) Testing process and apparatus
AU2003227908A1 (en) Test apparatus
AU2002951189A0 (en) An inflatable pipe test probe
AU2003292115A1 (en) Adapter for testing conductor arrangements
AU2003275680A1 (en) Probe for physical properties measurement
AU2003209987A1 (en) Sterility testing apparatus
TWI340249B (en) Test apparatus
EP1607758A4 (en) TEST DEVICE
AU2002352810A1 (en) Test strip analysis apparatus
EP1666903A4 (en) TEST DEVICE
AU2003272955A1 (en) Ship draft test apparatus
TW497718U (en) Horizontal-rod type probe test apparatus

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase