201025477 六、發明說明： 【發明所屬之技術領域】 本發明，是有關於對準裝置，當檢查大型的LCD基 板等的被檢查基板時，進行此被檢查基板的預對準的被檢 查基板。 【先前技術】 φ 檢查LCD基板等的被檢查基板的情況時是使用檢驗 器等的檢查裝置。在此檢查裝置中，有需要將其探針、及 被檢查基板上的電極正確地位置對合。 此情況時，通常是在進行預對準之後，進行將探針及 電極正確地位置對合的2階段的調整。習知的預對準，如 第2圖（A)所示，當玻璃基板等的被檢査基板2對於工 件載置台1被偏離載置的話，面板挾持3會接觸並按壓地 移動被檢查基板2，如第2圖（B)所示，進行被檢查基 φ 板2的預對準直到達到設定位置爲止。 此情況，面板挾持3因爲與被檢查基板2直接接觸， 所以被檢查基板2會產生缺陷。且，被檢查基板2的尺寸 變大的話，也有無法由面板挾持3按壓的情況。 另一方面，也有如專利文獻1，在將被檢査基板放置 於機械手臂狀態下’進行預對準的例。且，也有如專利文 獻2，由檢出機構檢出LCD基板的緣並檢出X軸方向的 傾斜，依據其傾斜將載置機構旋轉配合LCD基板的方向 來進行預對準的例。 -5- 201025477 [專利文獻1]日本特開平9-138256號公報 [專利文獻2]日本特公平6-27752號公報 【發明內容】 (本發明所欲解決的課題） 但是，在上述專利文獻1的被檢査基板的對準方法中 ，只限定可被載置在機械手臂的大小的被檢查基板，無法 進行大尺寸的被檢査基板的預對準。 且，在專利文獻2的LCD基板的對準方法中，在原 理上雖可以進行大尺寸的被檢查基板的預對準，但是專利 文獻2只有記載原理，具體而言由何種機構進行並未明確 記載。 本發明是有鑑於這種問題點，其目的是提供一種被檢 查基板的對準裝置，對於大尺寸的被檢查基板可以具體地 進行預對準。 (用以解決課題的手段） 本發明的對準裝置是爲了解決前述課題，其特徵爲， 具備：朝X軸方向延伸且將被檢查基板朝X軸方向可移 動地且朝0軸方向可旋轉地支撐的X0軸工件平台、及由 與該X0軸工件平台不同構件所構成且在此X0軸工件平 台的上方橫跨Y軸方向設置並將X軸預對準感測器及Y 軸預對準感測器朝Y軸方向及Z軸方向可移動地支撑的 YZ軸接點平台、及控制前述X0軸工件平台及YZ軸接點 -6 - 201025477 平台用的控制部，前述X0軸工件平台，是具備··朝X軸 方向延伸的骨組也就是架台、及將前述被檢査基板支撐的 工件載置台、及設在該工件載置台的下側面使工件載置台 旋轉的0軸旋轉機構、及被支撐於前述架台將前述0軸旋 轉機構支撐並隔著該0軸旋轉機構將前述工件載置台朝X 軸方向移動的X軸直動機構，前述ΥΖ軸接點平台，是具 備：在前述Χ0軸工件平台的上方橫跨Υ軸方向設置的支 Φ 撐臂部、及被安裝於該支撐臂部且位於前述Χ0軸工件平 台的上方的Υ軸直動機構、及藉由該Υ軸直動機構朝Υ 軸方向可移動地被支撐的複數接點平台板、及設在該複數 接點平台板之中的一方的端部側的接點平台板並檢出前述 被檢查基板的X軸方向的位置的X軸預對準感測器、及 設在另一方的端部側的接點平台板供檢出前述被檢査基板 的X軸方向的位置的X軸預對準感測器及供檢出Υ軸方 向的位置的 Υ軸預對準感測器、及設在前述各接點平台 Φ 板並將具有與前述被檢查基板上的電極接觸的探針的探針 塊朝Ζ軸方向可移動地支撐的Ζ軸直動機構，前述控制 部所具備的功能，是依據由前述ΥΖ軸接點平台側的前述 Υ軸預對準感測器及至少2個前述X軸預對準感測器檢出 的前述被檢査基板的位置資訊，將前述Χ0軸工件平台的 前述0軸旋轉機構及X軸直動機構控制且使前述工件載 置台朝X軸方向移動並且適宜地旋轉來進行該被檢查基 板的預對準。 201025477 [發明的效果] 因爲依據由前述Y軸預對準感測器及X軸預對準感 測器檢出的前述被檢查基板的位置資訊，由前述X0軸工 件平台的前述Θ軸旋轉機構及X軸直動機構調整前述工 件載置台進行被檢査基板的預對準，所以對於大型的被檢 查基板也可以確實地進行預對準。 【實施方式】 以下，對於本發明的實施例的對準機構，一邊參照添 付圖面一邊說明。 [第1實施例] 對準機構11是如第1、3、4圖所示，主要是由：X 0軸工件平台12、及YZ軸接點平台13所構成。 ΧΘ軸工件平台〗2，是朝X軸方向延伸，將大型的 LCD基板等的被檢査基板p (第1〇圖參照）朝X軸方向 可移動地且朝6»軸方向可旋轉地支撐用的裝置。此X 0軸 工件平台12主要是由：架台15、及工件載置台16、及0 軸旋轉機構（無圖示）、及X軸直動機構17所構成。 架台15’是朝X軸方向延伸的台座。此架台15，是 與後述的YZ軸接點平台13的2個架台30 —起被安裝於 基座板（無圖示）並被安裝於設置空間的底部。架台15 ，是在其上側部具備與X軸方向平行地延伸的3條支撐 框架19而構成。架台15，是例如橫寬度2ιη、高度lm、 -8 - 201025477 長度5m程度的大型的構件。 工件載置台16’是將大型的被檢查基板p支撐用的 構件。工件載置台16，是形成比被檢査基板P更大尺寸 的四角形板狀，在其上側面設有將被檢查基板P吸著支撐 用的真空溝21。真空溝21，是與真空裝置（無圖示）連 接，適宜被真空拉引。· 0軸旋轉機構，是將工件載置台16旋轉用的裝置。 φ 0軸旋轉機構可以使用公知的技術。例如，0軸旋轉機構 ，是由門狀的驅動機構所構成。具體而言，0軸旋轉機構 ，是將R導軌（環狀的導軌的一部分）設在複數處（例如 在環狀的位置等間隔地設置4處），將工件載置台16可 旋轉地支撐，由轉動機構移動工件載置台16的緣部使工 件載置台16旋轉。轉動機構，是由：步進馬達等的具備 角度調整功能的驅動馬達、及與此驅動馬達連結的螺栓棒 、及被螺入此螺栓棒的移動螺帽所構成，此移動螺帽是被 φ 固定於工件載置台16的緣部。且，由驅動馬達將螺栓棒 只有旋轉設定角度將螺栓棒正確地移動使工件載置台16 正確地只有旋轉設定角度。R導軌，是在被支撐於基板（ 無圖示）的狀態下被安裝於工件載置台16的下側面，將 工件載置台16可旋轉地支撐。 X軸直動機構17，是將工件載置台16朝X軸方向移 動用的裝置。此X軸直動機構17，是由2條導軌22、及 1個線性馬達23所構成。2條導軌22，是各別被安裝在 架台15的3條支撐框架19之中兩端的支撐框架19。在 -9- 201025477 此導軌22中，導引（無圖示）是可滑動地被安裝。前述 Θ軸旋轉機構的基板是藉由安裝在此導引，將被支撐於0 軸旋轉機構的工件載置台16，沿著導軌22朝X軸方向可 移動地支撐。 線性馬達23，是被安裝於架台15的3條支撐框架19 之中正中的支撐框架19。此線性馬達23的滑件是被安裝 於0軸旋轉機構的基板。由此，被支撐於導軌22的0軸 旋轉機構是藉由線性馬達23朝X軸方向被移動，被支撐 於0軸旋轉機構的工件載置台16，是沿著導軌22朝X軸 方向被移動。 YZ軸接點平台13，是將後述的X軸預對準感測器 38及Y軸預對準感測器40等朝Y軸方向及Z軸方向可 移動地支撐用的裝置。YZ軸接點平台13，是由與X0軸 工件平台12不同構件所構成。YZ軸接點平台13，是橫 跨被配設在X軸方向的X0軸工件平台12的上側的方式 被配設在Y軸方向。YZ軸接點平台13主要是由：支撐 臂部25、及Y軸直動機構26、及第1 Z軸平台部27、及 第2Z軸平台部28所構成。 支撐臂部25，是橫跨ΧΘ軸工件平台12的上側的方 式被橫跨設置的構件。此支撐臂部25是由：2個架台30 、及樑材31所構成。架台30，是構成YZ軸接點平台13 的兩側的腳部的構件。架台30，是在ΧΘ軸工件平台12 的兩側位置被安裝於基座板（無圖示）並被安裝於設置空 間的底部。樑材3 1 ’是在工件載置台1 6的上側位置在水 -10- 201025477 平方向被橫跨的構件。樑材31，是使其兩端部被固定於2 個架台30。由此，支撐臂部25,是在工件載置台16的上 側位置在Y軸方向呈拱門狀被橫跨。 Y軸直動機構26’是將第1 Z軸平台部27及第2 Z 軸平台部28朝Y軸方向移動用的裝置。此γ軸直動機構 26是由；導軌33、及線性馬達34所構成。導軌33，是 被安裝於朝Y軸方向延伸的樑材31的縱壁。線性馬達34 φ ，是與導軌33平行且一體地被安裝於樑材31。在導軌33 中，線性馬達34的滑件35是可滑動地被安裝。滑件35 ，是在線性馬達34被設置2個。在各滑件35各別被安裝 有第1 Z軸平台部27及第2 Z軸平台部28。各滑件35， 是藉由線性馬達34，個別獨立地被移動控制。 第1Z軸平台部27，是進行：被載置在工件載置台 16上的被檢查基板P的X軸方向的大致的位置對合、及 其後的被檢查基板P的正確地位置對合、及朝被檢査基板 φ P上的試驗電路E (第4圖參照）的電極電接觸用的裝置 。第1 Z軸平台部27，是如第5、6圖所示，由：接點平 台板37、及X軸預對準感測器38、及Z軸直動機構39、 及檢索用照相機40、及對準照相機41、及探針塊42所構 成。 接點平台板37，是直接被安裝在Y軸直動機構26的 滑件35的板材。藉由接點平台板37使Z軸直動機構39 等被支撐。 X軸預對準感測器38’是爲了將工件載置台16上的 -11 - 201025477 被檢査基板P的X軸方向的大致的位置調整而檢出工件 載置台16的緣部用的感測器。X軸預對準感測器38’是 如第5圖〜8所示，具備：將檢查光C發出的發光元件（ 無圖示）、及從此發光元件被發出並受光由檢查基板P的 表面反射的檢査光C用的受光元件（無圖示）。這些的發 光元件及受光元件，是使其檢查光C與被檢查基板P的 緣部平行地的方式被配設。這是依據以下的理由。如第8 圖（A) (B)所示，檢査光C是與被檢查基板P的緣部 垂直的方式配設的話，會藉由被檢查基板P的厚度使位置 偏離。第8圖（A)是薄的被檢查基板P的例，第8圖（ B)是厚的被檢查基板P的例。與第8圖（A)的薄的被 檢查基板P相比，第8圖（B)的厚的被檢查基板P的情 況的話，檢查光C是在接近發光元件的位置被反射，而比 薄的被檢查基板P更早被檢出。對於此，將檢查光C平 行地朝向被檢查基板P的緣部的話，被檢查基板P的厚度 成爲無關係。因此，將發光元件及受光元件配設成使其檢 查光C與被檢查基板P的緣部平行。 第5、6圖所示的Z軸直動機構39，是將檢索用照相 機40等支撐並朝Z軸方向移動用的裝置。Z軸直動機構 39是由：Z軸移動機構部3 9A、及Z軸平台板3 9B、及Z 軸馬達39C所構成。Z軸移動機構部3 9A，是將Z軸平台 板3 9B朝Z軸方向可滑動地支撐用的構件。Z軸移動機構 部3 9A，是由導軌等所構成。2軸平台板3 9B’是將檢索 用照相機40等支撐用的構件°2軸平台板39B’是具備 201025477 設有朝水平延伸的2條腕的托架39D，在此托架39D安裝 有檢索用照相機40等。Z軸馬達39C，是將Z軸平台板 3 9B朝Z軸方向移動用的馬達。在z軸馬達39C中，具 備螺栓棒及移動螺帽（皆無圖示），移動螺帽是被固定於 平台板39B，將Z軸平台板3 9B朝Z軸方向移動。 檢索用照相機40，是將被檢查基板p的定位用記號 由廣視野檢索用的照相機。對準照相機41，是正確地認 φ 識由檢索用照相機40特定的被定位用記號，進行被檢查 基板P的正確地位置對合用的照相機。對準照相機41， 是由窄視野將被檢查基板P攝影。檢索用照相機40及對 準照相機41，是各別被支撐在托架39D的2條腕。探針 塊42，是與被檢查基板P的試驗電路E的電極電接觸來 進行檢査用的構件。 第2 Z軸平台部28，是進行：被載置在工件載置台 16上的被檢查基板P的X軸方向及Y軸方向的大致的位 φ 置對合、及其後的被檢查基板p的正確地位置對合、及朝 被檢查基板P上的電極電接觸用的裝置。此第2 Z軸平台 部28，是整體與前述第1 Z軸平台部27同樣。在第2 Z 軸平台部28中，如第9圖所示，除了第1 Z軸平台部27 以外，具備Y軸預對準感測器43。此Y軸預對準感測器 43，是爲了進行工件載置台16上的被檢查基板P的Y軸 方向的大致的位置調整而檢出工件載置台16的緣部用的 感測器。Y軸預對準感測器43,是與X軸預對準感測器 38同樣地，具備發光元件及受光元件。這些的發光元件 -13- 201025477 及受光元件，是使其檢查光C與被檢查基板P的緣部平 行地的方式被配設。由此，使X軸預對準感測器38的檢 査光C及Y軸預對準感測器43的檢査光C成爲垂直交叉 的位置關係的方式，配設有X軸預對準感測器38及Y軸 預對準感測器43。 如以上構成的被檢查基板P的對準機構11是如下地 動作。依據第10圖〜14進行說明。 首先，如第10圖所示，被檢查基板P，是被載置在 X0軸工件平台12的工件載置台16，由此X0軸工件平 台12朝YZ軸接點平台13側被移送。此時，被檢查基板 P偏離的話，如第1 1圖所示，2個X軸預對準感測器3 8 之中的一方，是先檢出被檢查基板P的緣部。接著，如第 12圖所示’另一方的X軸預對準感測器38是檢出被檢查 基板P的緣部。依據此2個X軸預對準感測器38所檢出 的偏離，將被檢查基板P的傾斜由控制部45讀取座標並 加以計算。且，由控制部4 5，控制X 0軸工件平台1 2的 0軸旋轉機構’如第13圖所示，只有前述被檢査基板P 的傾斜的部分將工件載置台16旋轉進行修正。 接著’第2 Z軸平台部28是由Y軸直動機構26朝Y 軸方向被移動’由Y軸預對準感測器43檢出被檢查基板 P的緣部。 由此，被檢査基板P的X軸方向及Y軸方向的位置 ’被檢査基板P的角度被特定，進行被檢査基板P的大致 的位置對合。 -14- 201025477 接著，藉由檢索用照相機40,使被檢查基板P由廣 視野被攝影使被檢查基板P的定位用記號被特定。接著， 藉由對準照相機41，使被檢查基板P的定位用記號由窄 視野被攝影使被檢查基板P的位置正確地被調整。接著， 探針塊42的探針是與試驗電路E的電極接觸來進行檢查 〇 藉由以上，對於大型的被檢查基板P，也可以確實地 Φ 進行預對準。 因爲由控制部45進行修正，所以即使X 0軸工件平 台12及YZ軸接點平台13是不同構件的情況，也可以修 正被檢査基板P的偏離，確實地進行預對準。 在YZ軸接點平台13的Z軸直動機構39，因爲具備 :爲了檢索被檢査基板P的定位用記號而由廣視野將被檢 査基板P攝影的檢索用照相機40、及爲了將被檢査基板P 的正確地定位由窄視野將被檢査基板P攝影的對準照相機 41，所以X軸預對準感測器38及Y軸預對準感測器43 相輔，可以將大型的被檢查基板P由短時間容易且正確地 位置對合。此結果，被檢查基板P的檢查的作業性提高。 因爲將X軸預對準感測器38及Y軸預對準感測器43 ，由：將檢查光C發出的發光元件、及從該發光元件被發 出並受光由前述被檢查基板的表面被反射的檢查光C用的 受光元件所構成，使前述檢査光c與被檢査基板p的緣 部平行的方式配設前述發光元件及受光元件，所以可以正 確地檢出被檢查基板P的緣部。此結果，大型的被檢查基 -15- 201025477 板P可以由短時間容易且正確地位置對合，被檢査基板p 的檢查的作業性可提高。 且，控制部45，因爲具備吸收不同構件也就是ΧΘ 軸工件平台12及YZ軸接點平台13的設置時等的偏離的 修正功能，所以即使X0軸工件平台12及YZ軸接點平 台13因諸狀況而偏離，對於大型的被檢查基板P也可以 正確地位置對合。 [第2實施例] 接著，對於本發明的第2實施例依據第15圖進行說 明。 本實施例的對準機構51的整體構成，因爲是與前述 第1實施例的對準機構1 1幾乎同樣，所以對於同一部分 材附加同一符號並省略其說明。本實施例的對準機構51 ，是對於第1實施例的對準機構11，追加第3 Z軸平台 部52、及第4Z軸平台部53。 第3 Z軸平台部52，是對於第5、6圖所示的前述第 1實施例的第1 Z軸平台部27的各裝置之中，沒有X軸 預對準感測器38、檢索用照相機40、對準照相機41，只 有探針塊42。在被安裝於接點平台板37的Z軸直動機構 39的Z軸平台板39B安裝有探針塊42。此第3 Z軸平台 部52，是藉由被控制部45控制的Y軸直動機構26朝Y 軸方向適宜被移動，探針塊42的探針及被檢查基板p的 試驗電路E的電極是彼此之間被整合。且，由z軸直動 -16- 201025477 機構39使探針塊42被上下動使探針與被檢查基板P的試 驗電路E的電極電接觸。[Technical Field] The present invention relates to an aligning apparatus which performs a pre-alignment of the substrate to be inspected when inspecting a substrate to be inspected such as a large LCD substrate. [Prior Art] When φ is inspected for an inspected substrate such as an LCD substrate, an inspection device such as a tester is used. In this inspection apparatus, it is necessary to accurately position the probe and the electrodes on the substrate to be inspected. In this case, usually, after the pre-alignment is performed, the two-stage adjustment in which the probe and the electrode are correctly aligned is performed. As shown in FIG. 2(A), when the substrate 2 to be inspected such as a glass substrate is displaced from the workpiece mounting table 1, the panel holder 3 contacts and presses the substrate 2 to be inspected. As shown in Fig. 2(B), the pre-alignment of the substrate φ plate 2 to be inspected is performed until the set position is reached. In this case, since the panel holding 3 is in direct contact with the substrate 2 to be inspected, the substrate 2 to be inspected is defective. Further, when the size of the substrate 2 to be inspected is increased, there is a case where the panel holder 3 cannot be pressed. On the other hand, there is an example in which the pre-alignment is performed by placing the substrate to be inspected in the state of the robot arm as in Patent Document 1. Further, as in Patent Document 2, an example in which the edge of the LCD substrate is detected by the detecting means and the inclination in the X-axis direction is detected, and the mounting mechanism is rotated to match the direction of the LCD substrate to perform pre-alignment. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. In the alignment method of the substrate to be inspected, only the substrate to be inspected that can be placed on the robot arm is limited, and pre-alignment of the large-sized substrate to be inspected cannot be performed. Further, in the alignment method of the LCD substrate of Patent Document 2, in principle, pre-alignment of a large-sized substrate to be inspected can be performed, but Patent Document 2 only describes the principle, and specifically, which mechanism does not perform Clearly documented. SUMMARY OF THE INVENTION The present invention has been made in view of such a problem, and an object thereof is to provide an alignment device for inspecting a substrate, which can be specifically pre-aligned for a large-sized substrate to be inspected. (Means for Solving the Problem) The alignment device of the present invention is characterized in that the alignment device is provided to extend in the X-axis direction and to move the substrate to be inspected in the X-axis direction and to be rotatable in the 0-axis direction. The ground supported X0 axis workpiece platform and the different components formed from the X0 axis workpiece platform and disposed above the X0 axis workpiece platform across the Y axis direction and pre-align the X-axis pre-alignment sensor and the Y-axis a YZ-axis contact platform movably supported by the quasi-sensor in the Y-axis direction and the Z-axis direction, and a control unit for controlling the X0-axis workpiece platform and the YZ-axis contact -6 - 201025477 platform, the X0-axis workpiece platform And a 0-axis rotating mechanism having a bone group extending in the X-axis direction, that is, a gantry, and a workpiece mounting table that supports the substrate to be inspected, and a lower surface of the workpiece mounting table to rotate the workpiece mounting table, and An X-axis linear motion mechanism supported by the 0-axis rotating mechanism and supported by the 0-axis rotating mechanism to move the workpiece mounting table in the X-axis direction, and the x-axis contact platform includes: Axle workpiece platform a support Φ arm portion disposed above the y-axis direction, and a 直-axis linear motion mechanism mounted on the support arm portion and located above the Χ0-axis workpiece platform, and the 直-axis linear motion mechanism a plurality of contact platform plates movably supported in the direction, and a contact platform plate provided on one end side of the plurality of contact platform plates, and detecting the position of the X-axis direction of the substrate to be inspected X An axis pre-alignment sensor and a contact platform plate provided on the other end side for detecting an X-axis pre-alignment sensor of the X-axis direction of the substrate to be inspected and for detecting the x-axis a yaw axis pre-alignment sensor at a position of the directional direction, and a probe block provided on each of the contact platform Φ plates and movably supporting the probe block having a probe in contact with the electrode on the substrate to be inspected in the z-axis direction The 直-axis linear motion mechanism, wherein the control unit has a function of detecting the Υ-axis pre-alignment sensor and the at least two X-axis pre-alignment sensors on the side of the y-axis contact platform The position information of the aforementioned inspected substrate, the aforementioned 0 axis of the aforementioned Χ0 axis workpiece platform The rotating mechanism and the X-axis linear motion mechanism control and move the aforementioned workpiece mounting table in the X-axis direction and rotate appropriately to perform pre-alignment of the inspected substrate. 201025477 [Effects of the Invention] The aforementioned x-axis rotating mechanism of the aforementioned X0-axis workpiece platform is based on the position information of the aforementioned inspected substrate detected by the aforementioned Y-axis pre-alignment sensor and the X-axis pre-alignment sensor Since the X-axis linear motion mechanism adjusts the workpiece mounting table to perform pre-alignment of the substrate to be inspected, the large-sized substrate to be inspected can be reliably pre-aligned. [Embodiment] Hereinafter, an alignment mechanism according to an embodiment of the present invention will be described with reference to an addition drawing. [First Embodiment] The alignment mechanism 11 is mainly composed of an X 0-axis workpiece stage 12 and a YZ-axis contact stage 13 as shown in Figs. 1, 3, and 4. The 工件-axis workpiece stage 〗 2 extends in the X-axis direction and is rotatably supported in the X-axis direction by the inspection substrate p (referenced in the first drawing) such as a large LCD substrate. s installation. The X 0-axis workpiece stage 12 is mainly composed of a gantry 15, a workpiece mounting table 16, a zero-axis rotating mechanism (not shown), and an X-axis linear motion mechanism 17. The gantry 15' is a pedestal that extends in the X-axis direction. This gantry 15 is attached to a base plate (not shown) together with the two gantry 30 of the YZ-axis contact platform 13 to be described later, and is attached to the bottom of the installation space. The gantry 15 is configured to have three support frames 19 extending in parallel with the X-axis direction at the upper side portion thereof. The gantry 15 is, for example, a large-sized member having a horizontal width of 2 ηη, a height of lm, and an -8 - 201025477 and a length of about 5 m. The workpiece mounting table 16' is a member for supporting a large-sized inspection substrate p. The workpiece mounting table 16 is formed in a quadrangular plate shape having a larger size than the substrate P to be inspected, and a vacuum groove 21 for absorbing and supporting the substrate to be inspected P is provided on the upper surface side. The vacuum chamber 21 is connected to a vacuum device (not shown) and is preferably pulled by a vacuum. The 0-axis rotation mechanism is a device for rotating the workpiece mounting table 16. A well-known technique can be used for the φ 0-axis rotating mechanism. For example, the 0-axis rotating mechanism is constituted by a door-shaped driving mechanism. Specifically, the zero-axis rotating mechanism is provided with a plurality of R guides (a part of the annular guide rails) at a plurality of positions (for example, four at equal intervals in an annular position), and the workpiece mounting table 16 is rotatably supported. The edge of the workpiece mounting table 16 is moved by the rotating mechanism to rotate the workpiece mounting table 16. The rotation mechanism is composed of a drive motor having an angle adjustment function such as a stepping motor, a bolt rod connected to the drive motor, and a moving nut screwed into the bolt rod. The moving nut is φ. It is fixed to the edge of the workpiece mounting table 16. Further, the bolts are correctly moved by the drive motor only by the rotation set angle, so that the workpiece mounting table 16 correctly rotates only at the set angle. The R guide rail is attached to the lower surface of the workpiece mounting table 16 while being supported by a substrate (not shown), and the workpiece mounting table 16 is rotatably supported. The X-axis linear motion mechanism 17 is a device for moving the workpiece mounting table 16 in the X-axis direction. This X-axis linear motion mechanism 17 is composed of two guide rails 22 and one linear motor 23. The two guide rails 22 are support frames 19 which are respectively mounted at both ends of the three support frames 19 of the gantry 15. In the guide rail 22 of -9-201025477, a guide (not shown) is slidably mounted. The substrate of the above-described x-axis rotating mechanism is guided by the workpiece mounting table 16 supported by the zero-axis rotating mechanism, and is movably supported along the guide rail 22 in the X-axis direction. The linear motor 23 is a support frame 19 that is mounted in the middle of the three support frames 19 of the gantry 15. The slider of this linear motor 23 is a substrate mounted on a zero-axis rotating mechanism. Thereby, the 0-axis rotation mechanism supported by the guide rail 22 is moved in the X-axis direction by the linear motor 23, and is supported by the workpiece mounting table 16 of the 0-axis rotation mechanism, and is moved along the guide rail 22 in the X-axis direction. . The YZ-axis contact stage 13 is a device that movably supports the X-axis pre-alignment sensor 38, the Y-axis pre-alignment sensor 40, and the like, which will be described later, in the Y-axis direction and the Z-axis direction. The YZ-axis contact platform 13 is composed of different members from the X0-axis workpiece stage 12. The YZ-axis contact stage 13 is disposed in the Y-axis direction so as to straddle the upper side of the X0-axis workpiece stage 12 disposed in the X-axis direction. The YZ-axis contact platform 13 is mainly composed of a support arm portion 25, a Y-axis linear motion mechanism 26, a first Z-axis platform portion 27, and a second Z-axis platform portion 28. The support arm portion 25 is a member that is spanned across the upper side of the boring workpiece stage 12. The support arm portion 25 is composed of two gantry 30 and a beam member 31. The gantry 30 is a member constituting the leg portions on both sides of the YZ-axis contact platform 13. The gantry 30 is attached to a base plate (not shown) at both sides of the ram workpiece stage 12 and is attached to the bottom of the installation space. The beam material 3 1 ' is a member that is spanned in the horizontal direction of the water -10- 201025477 at the upper position of the workpiece mounting table 16 . The beam member 31 is such that its both end portions are fixed to the two gantry 30. Thereby, the support arm portion 25 is spanned in the shape of an arch in the Y-axis direction at the upper position of the workpiece mounting table 16. The Y-axis linear motion mechanism 26' is a device for moving the first Z-axis platform portion 27 and the second Z-axis platform portion 28 in the Y-axis direction. The γ-axis linear motion mechanism 26 is composed of a guide rail 33 and a linear motor 34. The guide rail 33 is a vertical wall that is attached to the beam member 31 that extends in the Y-axis direction. The linear motor 34 φ is integrally attached to the beam 31 in parallel with the guide rail 33. In the guide rail 33, the slider 35 of the linear motor 34 is slidably mounted. The slider 35 is provided in the linear motor 34. The first Z-axis platform portion 27 and the second Z-axis platform portion 28 are attached to the respective sliders 35. Each of the sliders 35 is individually and independently controlled by the linear motor 34. In the first Z-axis stage portion 27, the position of the inspection target substrate P placed on the workpiece mounting table 16 in the X-axis direction is substantially aligned, and the subsequent inspection of the substrate P to be inspected is performed. And an apparatus for electrical contact of the electrodes to the test circuit E (refer to FIG. 4) on the substrate φ P to be inspected. The first Z-axis stage portion 27 is a contact platform plate 37, an X-axis pre-alignment sensor 38, a Z-axis linear motion mechanism 39, and a search camera 40 as shown in FIGS. 5 and 6. And aligning the camera 41 and the probe block 42. The contact platform plate 37 is a plate material that is directly attached to the slider 35 of the Y-axis linear motion mechanism 26. The Z-axis linear motion mechanism 39 or the like is supported by the contact platform plate 37. The X-axis pre-alignment sensor 38' is for sensing the edge of the workpiece mounting table 16 in order to adjust the approximate position of the inspection substrate P of the inspection substrate P on the workpiece mounting table 16 in the X-axis direction. Device. As shown in FIGS. 5 to 8 , the X-axis pre-alignment sensor 38 ′ includes a light-emitting element (not shown) that emits the inspection light C, and a surface from which the light-emitting element is emitted and received by the inspection substrate P. A light-receiving element (not shown) for reflecting the inspection light C. These light-emitting elements and light-receiving elements are arranged such that the inspection light C is parallel to the edge of the substrate P to be inspected. This is for the following reasons. As shown in Fig. 8 (A) and (B), when the inspection light C is disposed perpendicular to the edge of the substrate P to be inspected, the position of the substrate to be inspected P is shifted by the thickness of the substrate to be inspected. Fig. 8(A) shows an example of a thin substrate P to be inspected, and Fig. 8(B) shows an example of a substrate P to be inspected. In the case of the thick inspection target substrate P of FIG. 8(B), the inspection light C is reflected at a position close to the light-emitting element, and is thinner than the thin inspection substrate P of FIG. 8(A). The inspected substrate P is detected earlier. In this case, when the inspection light C is directed toward the edge of the substrate P to be inspected, the thickness of the substrate P to be inspected is irrelevant. Therefore, the light-emitting element and the light-receiving element are disposed such that the inspection light C is parallel to the edge of the substrate P to be inspected. The Z-axis linear motion mechanism 39 shown in Figs. 5 and 6 is a device for supporting the search camera 40 or the like and moving in the Z-axis direction. The Z-axis linear motion mechanism 39 is composed of a Z-axis moving mechanism portion 39A, a Z-axis plate plate 39B, and a Z-axis motor 39C. The Z-axis moving mechanism portion 392A is a member for slidably supporting the Z-axis platen plate 39B in the Z-axis direction. The Z-axis moving mechanism portion 3 9A is constituted by a guide rail or the like. The two-axis platform plate 3 9B' is a member for supporting the search camera 40 or the like. The two-axis plate plate 39B' is a bracket 39D having two wrists extending horizontally in 201025477, and the bracket 39D is mounted with a search. Use camera 40 or the like. The Z-axis motor 39C is a motor for moving the Z-axis plate plate 39 9B in the Z-axis direction. In the z-axis motor 39C, a bolt bar and a moving nut (both not shown) are provided, and the moving nut is fixed to the deck plate 39B to move the Z-axis plate plate 39 9B in the Z-axis direction. The search camera 40 is a camera for searching the positioning of the substrate p to be inspected by the wide field of view. In alignment with the camera 41, it is possible to recognize the position-receiving symbol specified by the search camera 40 and perform a correct positional alignment of the inspected substrate P. In alignment with the camera 41, the substrate P to be inspected is photographed by a narrow field of view. The search camera 40 and the alignment camera 41 are two wrists that are respectively supported by the bracket 39D. The probe block 42 is a member for inspecting the electrodes of the test circuit E of the substrate P to be inspected. In the second Z-axis stage portion 28, the X-axis direction of the inspection target substrate P placed on the workpiece mounting table 16 and the approximate position φ in the Y-axis direction are aligned, and the inspected substrate p to be inspected thereafter The correct position and the device for electrical contact with the electrodes on the substrate P to be inspected. The second Z-axis platform portion 28 is the same as the first Z-axis platform portion 27 as a whole. In the second Z-axis stage portion 28, as shown in Fig. 9, a Y-axis pre-alignment sensor 43 is provided in addition to the first Z-axis stage portion 27. The Y-axis pre-alignment sensor 43 is a sensor for detecting the edge of the workpiece mounting table 16 in order to adjust the approximate position of the substrate P to be inspected on the workpiece mounting table 16 in the Y-axis direction. The Y-axis pre-alignment sensor 43 includes a light-emitting element and a light-receiving element similarly to the X-axis pre-alignment sensor 38. The light-emitting elements -13 to 201025477 and the light-receiving elements are arranged such that the inspection light C is parallel to the edge of the substrate P to be inspected. Thereby, the inspection light C of the X-axis pre-alignment sensor 38 and the inspection light C of the Y-axis pre-alignment sensor 43 are placed in a vertically intersecting positional relationship, and X-axis pre-alignment sensing is provided. The device 38 and the Y-axis pre-align the sensor 43. The alignment mechanism 11 of the substrate P to be inspected as described above operates as follows. Description will be made based on Figs. 10 to 14. First, as shown in Fig. 10, the substrate to be inspected P is placed on the workpiece stage 16 of the X0-axis workpiece stage 12, whereby the X0-axis workpiece stage 12 is transferred toward the YZ-axis contact stage 13 side. At this time, when the substrate P to be inspected is deviated, as shown in Fig. 1, one of the two X-axis pre-alignment sensors 38 detects the edge of the substrate P to be inspected first. Next, as shown in Fig. 12, the other X-axis pre-alignment sensor 38 detects the edge of the substrate P to be inspected. Based on the deviation detected by the two X-axis pre-alignment sensors 38, the inclination of the substrate P to be inspected is read by the control unit 45 and calculated. Further, as shown in Fig. 13, the control unit 45 controls the 0-axis rotation mechanism of the X 0-axis workpiece stage 1 2, and only the inclined portion of the inspection target substrate P rotates the workpiece stage 16 to be corrected. Then, the second Z-axis stage portion 28 is moved in the Y-axis direction by the Y-axis linear motion mechanism 26, and the edge portion of the inspection target substrate P is detected by the Y-axis pre-alignment sensor 43. Thereby, the position of the inspected substrate P in the X-axis direction and the Y-axis direction is specified, and the approximate position of the inspected substrate P is aligned. -14-201025477 Next, by the search camera 40, the substrate to be inspected P is photographed by the wide field of view and the positioning mark of the substrate P to be inspected is specified. Then, by aligning the camera 41, the positioning mark of the substrate P to be inspected is photographed from a narrow field of view so that the position of the substrate P to be inspected is accurately adjusted. Next, the probe of the probe block 42 is in contact with the electrode of the test circuit E to perform inspection. 藉 In the above, the large-sized substrate P to be inspected can be positively aligned with Φ. Since the correction is performed by the control unit 45, even if the X-axis workpiece stage 12 and the YZ-axis contact stage 13 are different members, the deviation of the substrate P to be inspected can be corrected, and the pre-alignment can be surely performed. The Z-axis linear motion mechanism 39 of the YZ-axis contact platform 13 includes a search camera 40 that images the inspection target P by a wide field of view in order to search for the positioning mark of the inspection target P, and a substrate to be inspected. The correct positioning of P is performed by the alignment camera 41 which is to be inspected by the inspection substrate P by the narrow field of view, so that the X-axis pre-alignment sensor 38 and the Y-axis pre-alignment sensor 43 are complementary, and the large-sized substrate to be inspected can be used. P is easily and correctly positioned in a short time. As a result, the workability of the inspection of the substrate P to be inspected is improved. Since the X-axis pre-alignment sensor 38 and the Y-axis pre-alignment sensor 43 are: the light-emitting element emitted from the inspection light C, and the surface emitted from the light-emitting element and received by the surface of the substrate to be inspected are The light-receiving element for the reflected inspection light C is configured such that the light-emitting element and the light-receiving element are disposed so that the inspection light c is parallel to the edge of the inspection substrate p. Therefore, the edge of the inspection substrate P can be accurately detected. . As a result, the large-sized inspection base -15-201025477 board P can be easily and correctly positioned in a short time, and the workability of the inspection of the inspected substrate p can be improved. Further, since the control unit 45 has a correction function for absorbing the deviation of the different members, that is, the arrangement of the y-axis workpiece stage 12 and the YZ-axis contact stage 13, the X0-axis workpiece stage 12 and the YZ-axis contact stage 13 are The conditions are deviated, and the large inspected substrate P can be correctly aligned. [Second embodiment] Next, a second embodiment of the present invention will be described based on Fig. 15. The entire configuration of the alignment mechanism 51 of the present embodiment is substantially the same as that of the alignment mechanism 1 1 of the first embodiment, and therefore the same reference numerals will be given to the same components, and the description thereof will be omitted. In the alignment mechanism 51 of the present embodiment, the third Z-axis plate portion 52 and the fourth Z-axis plate portion 53 are added to the alignment mechanism 11 of the first embodiment. In the third Z-axis stage unit 52, the X-axis pre-alignment sensor 38 and the search are not included in the respective devices of the first Z-axis stage unit 27 of the first embodiment shown in FIGS. 5 and 6 . The camera 40, the alignment camera 41, has only the probe block 42. A probe block 42 is attached to the Z-axis plate plate 39B of the Z-axis linear motion mechanism 39 mounted on the contact platform plate 37. The third Z-axis stage unit 52 is appropriately moved in the Y-axis direction by the Y-axis linear motion mechanism 26 controlled by the control unit 45, and the probe of the probe block 42 and the electrode of the test circuit E of the substrate to be inspected p It is integrated with each other. Further, the mechanism 39 moves the probe block 42 up and down by the z-axis linear motion -16 - 201025477 mechanism to electrically contact the probe with the electrode of the test circuit E of the substrate P to be inspected.
第4 Z軸平台部53是與第3 Z軸平台部52同樣的裝 置。在本實施例中，追加第3 Z軸平台部52及第4 Z軸 平台部53的2個裝置構成4個Z軸平台部。構成4個Z 軸平台部的理由，是爲了配設4列被檢查基板P上的試驗 電路E。即，在本實施例的被檢查基板P中，試驗電路E • 因爲被配設4行4列，所以第1Z軸平台部27、第2Z軸 平台部28、第3 Z軸平台部52及第4Z軸平台部53是各 別配合於試驗電路E的列被配設，一次將4個探針塊42 的探針各別接觸4個試驗電路E，由4次的接觸完成1枚 的被檢查基板P的試驗。 具體而言，將第1 Z軸平台部27及第2 Z軸平台部 28由Y軸直動機構26朝Y軸方向適宜移動，由X軸預 對準感測器38及Y軸預對準感測器43檢出被檢查基板P φ 的緣部，使被檢査基板P的X軸方向及γ軸方向的位置 、及被檢查基板P的角度被特定，進行被檢查基板p的大 致的位置對合。接著，由檢索用照相機40檢索被檢査基 板P的定位用記號，由對準照相機41將被檢査基板P的 位置正確地調整。 接著，控制部45，是依據正確地被定位的被檢査基 板P，計算被檢查基板P上的各試驗電路E的位置，控制 Y軸直動機構26，與第1 Z軸平台部27及第2Z軸平台 部28 —起，各別移動第3 Z軸平台部52及第4 Z軸平台 -17- 201025477 部53’整合於第1列的各試驗電路e的位置。接著，由 Z軸直動機構39將探針塊42的各探針與各試驗電路E的 電極接觸，進行檢查。一邊由X0軸工件平台12將被檢 查基板P朝X軸方向移動，一邊將探針塊42的各探針與 第2〜4列的各試驗電路E的電極接觸，進行檢査。且， 由此4次的接觸完成1枚的被檢查基板p的試驗。 由此’可達成與前述第1實施例同樣的效果，並且因 爲由4個Z軸平台部平行檢查，所以可以達成檢查作業的 效率化。特別是，在大型的被檢査基板P中，Z軸平台部 的數量少的話，此Z軸平台部的移動量是變多，雖在檢査 作業會花費時間，但是藉由如本實施例由4個Z軸平台部 平行檢查，可以達成檢查作業的效率化。 [變形例] 在前述第1實施例中，藉由該Y軸直動機構朝Y軸 方向可移動地被支撐的Z軸平台部，雖設有第1 Z軸平台 部27及第2 Z軸平台部28的2個，但是設置3個以上也 可以。被檢查基板P是大型的話，因爲其緣部也不一定被 維持在正確地尺寸，所以由複數處檢出被檢查基板P的緣 部，在座標上確認各位置。此時，彼此之間偏離的情況時 ，判斷其是否在誤差的範圍內。且，若在誤差的範圍內的 話忽視，若超越誤差的範圍的話，依據各點的平均値特定 座標。The fourth Z-axis platform portion 53 is the same as the third Z-axis platform portion 52. In the present embodiment, two devices in which the third Z-axis stage portion 52 and the fourth Z-axis plate portion 53 are added constitute four Z-axis plate portions. The reason for constituting the four Z-axis stage portions is to arrange the test circuits E on the four rows of the inspection target substrates P. In other words, in the test substrate P of the present embodiment, the test circuit E is arranged in four rows and four columns, so the first Z-axis stage portion 27, the second Z-axis stage portion 28, the third Z-axis plate portion 52, and the first The 4Z-axis stage unit 53 is disposed in a row that is fitted to the test circuit E, and the probes of the four probe blocks 42 are individually contacted with the four test circuits E at one time, and one test is completed by four contacts. Test of substrate P. Specifically, the first Z-axis stage portion 27 and the second Z-axis plate portion 28 are appropriately moved in the Y-axis direction by the Y-axis linear motion mechanism 26, and are pre-aligned by the X-axis pre-alignment sensor 38 and the Y-axis. The sensor 43 detects the edge of the substrate P φ to be inspected, and positions the X-axis direction and the γ-axis direction of the substrate P to be inspected and the angle of the substrate P to be inspected, and the approximate position of the substrate p to be inspected is performed. Match. Next, the positioning symbol of the inspected substrate P is retrieved by the search camera 40, and the position of the inspected substrate P is accurately adjusted by the alignment camera 41. Next, the control unit 45 calculates the position of each test circuit E on the substrate P to be inspected based on the substrate P to be inspected correctly, and controls the Y-axis linear motion mechanism 26 and the first Z-axis platform unit 27 and The 2Z-axis stage unit 28 starts to move the third Z-axis stage unit 52 and the fourth Z-axis stage -17-201025477 part 53' to be integrated in the position of each test circuit e in the first column. Next, each probe of the probe block 42 is brought into contact with the electrodes of the respective test circuits E by the Z-axis linear motion mechanism 39 to perform inspection. When the inspection substrate P is moved in the X-axis direction by the X0-axis workpiece stage 12, the probes of the probe block 42 are brought into contact with the electrodes of the respective test circuits E of the second to fourth rows, and are inspected. Then, the test of one test substrate p to be inspected was completed by the contact of four times. Thus, the same effects as those of the first embodiment described above can be achieved, and since the four Z-axis stages are in parallel inspection, the efficiency of the inspection work can be achieved. In particular, in the large-sized inspected substrate P, when the number of the Z-axis plate portions is small, the amount of movement of the Z-axis plate portion is increased, and it takes time in the inspection work, but by the present embodiment, by 4 Parallel inspection of the Z-axis platform sections enables the efficiency of inspection work to be achieved. [Modification] In the first embodiment, the Z-axis stage portion movably supported in the Y-axis direction by the Y-axis linear motion mechanism is provided with the first Z-axis stage portion 27 and the second Z-axis. There are two of the platform units 28, but three or more of them may be provided. When the substrate P to be inspected is large, the edge portion thereof is not necessarily maintained at the correct size. Therefore, the edge of the substrate P to be inspected is detected from a plurality of points, and each position is confirmed on the coordinates. At this time, when they deviate from each other, it is judged whether or not it is within the range of the error. Moreover, if it is within the range of the error, if it is beyond the range of the error, it depends on the average 値 specific coordinates of each point.
在前述第2實施例中，雖對於第1實施例追加2個Z -18- 201025477 軸平台部52、53構成4個Z軸平台部（第1〜第4 Z軸 平台部27、28、52、53)，但是對於第1實施例，追加1 個或是3個以上的Z軸平台部，構成3個Z軸平台部或 是5個以上的Z軸平台部也可以。可依據被檢查基板P的 尺寸 '和試驗電路E的個數等的諸條件，設定Z軸平台 部的設置個數。 且，設置複數z軸平台部的情況，Y軸預對準感測器 φ 43是設在複數Z軸平台部之中端部的z軸平台部的較佳 ，但是X軸預對準感測器38是設在各Z軸平台部也可以 。因爲由某程度遠離的2處的位置將被檢查基板P的緣部 檢出即可，所以設在複數Z軸平台部之中的某程度遠離的 2個Z軸平台部即可。且，在全部的Z軸平台部設置X軸 預對準感測器38，將某程度遠離的2個Z軸平台部的X 軸預對準感測器38適宜地選擇來檢出被檢查基板P的緣 部也可以。 Φ 藉此，也可以達成與前述第1及第2實施例同樣的作 用、效果。 【圖式簡單說明】 [第1圖]顯示本發明的第1實施例的對準機構的立體 ΓΒΊ 圖 [第2圖]顯示習知的被檢查基板的調整方法的意示圖 [第3圖]顯示本發明的第1實施例的對準機構的平面 -19- 201025477 圖。 [第4圖]顯示本發明的第1實施例的對準機構的平面 圖。 [第5圖]顯示本發明的第1實施例的第丨2軸平台部 的立體圖。 [第6圖]顯示本發明的第1實施例的第〗乙軸平台部 的前視圖。 [第7圖]顯示本發明的第1實施例的X軸預對準感測 器的意示圖。 [第8圖]顯示由本發明的第1實施例的X軸預對準感 測器檢出厚度不同的被檢查基板的狀態的意示圖。 [第9圖]顯示本發明的第1實施例的第2 Z軸平台部 的前視圖。 [第10圖]顯示本發明的第1實施例的對準機構中的 被檢查基板的對準的意示圖。 [第11圖]顯示第IX軸預對準感測器從第10圖的狀 態將被檢查基板的緣檢出的狀態的意示圖。 [第12圖]顯示第2X軸預對準感測器從第11圖的狀 態將被檢查基板的緣檢出的狀態的意示圖。 [第13圖]顯示從第12圖的狀態將被檢查基板旋轉並 修正的狀態的意示圖。 [第14圖]顯示從第13圖的狀態將Y軸預對準感測器 移動並檢出被檢查基板的緣的狀態的意示圖。 [第15圖]顯示本發明的第2實施例的對準機構的平 -20- 201025477 面圖。 【主要元件符號說明】 1 1 :對準機構 12: X0軸工件平台 13 : YZ軸接點平台 15 :架台 φ 1 6 :工件載置台 1 7 : X軸直動機構 1 9 :支撐框架 21 :真空溝 22 :導軌 23 :線性馬達 25 :支撐臂部 26 : Y軸直動機構 φ 27:第1Z軸平台部 28:第2Z軸平台部 30 :架台 3 1 :樑材 33 :導軌 34 :線性馬達 3 5 :滑件 3 7 :接點平台板 3 8 : X軸預對準感測器 -21 201025477 39 : Z軸直動機構 40 :檢索用照相機 4 1 :對準照相機 42 :探針塊 43 : Y軸預對準感測器 45 :控制部 5 1 :對準機構 52:第3Z軸平台部 53:第4Z軸平台部 ❹ -22-In the second embodiment, the two Z -18-201025477 shaft platform portions 52 and 53 are added to the first embodiment to form four Z-axis platform portions (the first to fourth Z-axis platform portions 27, 28, 52). 53) However, in the first embodiment, one or three or more Z-axis platform portions may be added to constitute three Z-axis platform portions or five or more Z-axis platform portions. The number of the Z-axis stage portions can be set in accordance with conditions such as the size of the substrate P to be inspected and the number of test circuits E. Further, in the case where a plurality of z-axis stage portions are provided, the Y-axis pre-alignment sensor φ 43 is preferably a z-axis plate portion provided at an end portion of the plurality of Z-axis plate portions, but the X-axis pre-alignment sensing The device 38 may be provided in each Z-axis platform portion. It is only necessary to detect the edge of the inspected substrate P at two locations that are far away from each other. Therefore, it is sufficient to provide two Z-axis platform portions that are apart from each other among the plurality of Z-axis platform portions. Further, the X-axis pre-alignment sensor 38 is provided on all of the Z-axis stage portions, and the X-axis pre-alignment sensor 38 of the two Z-axis stage portions that are separated to some extent is appropriately selected to detect the substrate to be inspected. The edge of P can also be. Φ By this, the same effects and effects as those of the first and second embodiments described above can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1] A perspective view showing an alignment mechanism of a first embodiment of the present invention. [Fig. 2] A schematic view showing a conventional method of adjusting a substrate to be inspected [Fig. 3] The plane -19-201025477 of the alignment mechanism of the first embodiment of the present invention is shown. Fig. 4 is a plan view showing an alignment mechanism of a first embodiment of the present invention. Fig. 5 is a perspective view showing a second-axis platform portion of the first embodiment of the present invention. Fig. 6 is a front elevational view showing the y-axis platform portion of the first embodiment of the present invention. Fig. 7 is a view showing the X-axis pre-alignment sensor of the first embodiment of the present invention. [Fig. 8] Fig. 8 is a view showing a state in which the inspection target substrates having different thicknesses are detected by the X-axis pre-alignment sensor according to the first embodiment of the present invention. [Fig. 9] A front view showing a second Z-axis stage portion according to the first embodiment of the present invention. [Fig. 10] Fig. 10 is a view showing the alignment of the substrate to be inspected in the alignment mechanism of the first embodiment of the present invention. [Fig. 11] A view showing a state in which the IX-axis pre-alignment sensor detects the edge of the substrate to be inspected from the state of Fig. 10. [12] Fig. 12 is a view showing a state in which the second X-axis pre-alignment sensor detects the edge of the substrate to be inspected from the state of Fig. 11. [Fig. 13] A view showing a state in which the substrate to be inspected is rotated and corrected from the state of Fig. 12. [Fig. 14] A view showing a state in which the Y-axis pre-alignment sensor is moved from the state of Fig. 13 and the edge of the substrate to be inspected is detected. Fig. 15 is a plan view showing the alignment mechanism of the second embodiment of the present invention. [Main component symbol description] 1 1 : Alignment mechanism 12: X0 axis workpiece platform 13 : YZ axis contact platform 15 : gantry φ 1 6 : workpiece mounting table 1 7 : X-axis linear motion mechanism 1 9 : support frame 21 : Vacuum groove 22: Guide rail 23: Linear motor 25: Support arm portion 26: Y-axis linear motion mechanism φ 27: First Z-axis platform portion 28: Second Z-axis platform portion 30: Stand 3 1 : Beam material 33: Guide rail 34: Linear Motor 3 5 : Slide 3 7 : Contact platform plate 3 8 : X-axis pre-alignment sensor-21 201025477 39 : Z-axis linear motion mechanism 40 : Search camera 4 1 : Alignment camera 42 : Probe block 43 : Y-axis pre-alignment sensor 45 : Control portion 5 1 : Alignment mechanism 52 : 3rd Z-axis platform portion 53 : 4th Z-axis platform portion -22 -22-