TWI416144B - The method and device for detecting the touch point of the substrate line with the probe - Google Patents

The method and device for detecting the touch point of the substrate line with the probe Download PDF

Info

Publication number
TWI416144B
TWI416144B TW100115933A TW100115933A TWI416144B TW I416144 B TWI416144 B TW I416144B TW 100115933 A TW100115933 A TW 100115933A TW 100115933 A TW100115933 A TW 100115933A TW I416144 B TWI416144 B TW I416144B
Authority
TW
Taiwan
Prior art keywords
image sensor
detecting
substrate
probe
mold
Prior art date
Application number
TW100115933A
Other languages
Chinese (zh)
Other versions
TW201245737A (en
Inventor
Fu Lai Yao
Original Assignee
Fu Lai Yao
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fu Lai Yao filed Critical Fu Lai Yao
Priority to TW100115933A priority Critical patent/TWI416144B/en
Publication of TW201245737A publication Critical patent/TW201245737A/en
Application granted granted Critical
Publication of TWI416144B publication Critical patent/TWI416144B/en

Links

Abstract

The invention relates to an alignment method and a device using probes to touch and press line detection points of a substrate. The alignment method comprises pivoting a bearing tray for placing a substrate on a detection platform, wherein the substrate has multiple line detection points thereon; using an upper image sensor on the detection platform to sense the substrate from above the bearing tray, so as to correct the reference positions of the detection points; and using a lower image sensor on the detection platform to sense multiple probes at the bottom of a die from below a detection die following the movement of the upper image sensor, so as to correct the reference positions of the probes and the detection points.

Description

Method and device for aligning detection point of substrate by probe pressing substrate

The invention provides a method for aligning a detection point of a substrate by using a probe, and particularly relates to a reference position of a probe and a detection point by using a plurality of image sensors. The invention also relates to a aligning device implementing the method.

According to the surface of the glass substrate constituting the liquid crystal display (LCD) or the touch panel (Touch Panel), a circuit pattern structure having a plurality of external lines extending to the edge of the substrate is provided, and the circuit pattern structure utilizes the The external circuit is connected to the control circuit or the like of the external circuit; in addition, after the glass substrate is formed in the circuit pattern structure, the resistance value and the capacitance value of the circuit pattern structure are measured through the detection points on the external wiring line. In order to judge the circuit structure of the substrate is good.

It is also known that the detecting device for measuring the circuit pattern structure of the above substrate is usually equipped with a detecting mold and an image sensor which are interlocked with each other, such as a CCD (Charge Coupled Device) sensor, and the bottom of the detecting mold has a plurality of Measuring probe; the detecting mold and the image sensor can be longitudinally, laterally and vertically displaced on the detecting table of the detecting device, so that the image sensor senses the surface of the substrate on the detecting table from top to bottom An image for correcting a reference position of a target or a detection point on the substrate, and driving the detecting mold to align the substrate according to the target point or the position of the detecting point, and causing the probe to be detected by the upper and lower pressing substrates along with the detecting mold Point to measure the circuit pattern structure of the substrate.

However, although the image sensor can correct the reference position of the substrate, since the detection mold is frequently replaced according to the model of the substrate, there is a gap between the reference position of the probe and the reference position of the detection point. There are hidden dangers that are prone to errors and need to be improved.

An object of the present invention is to provide a method for aligning a detection point of a substrate by a probe, and capable of correcting a reference position of the substrate and the probe by using an image sensor, respectively, to overcome the above-mentioned prior art, the probe There is a problem that an error is likely to occur between the reference position and the reference position of the detection point.

Another object of the present invention is to provide a aligning device for detecting a point on a substrate by a probe, which is advantageous for causing the substrate and the probe to receive the image sensor to calibrate the reference position.

In order to achieve the above object and solve the problem, the method of the present invention comprises: providing a receiving and placing disk capable of placing a substrate to be tested on a detecting platform, the substrate having a detection point of a plurality of lines; using the detecting platform An upper image sensor, the substrate is sensed above the receiving plate, and the reference position of the detecting point of the substrate is corrected by mobilizing the receiving plate; and a position on the detecting table is lower than the upper image sensing a lower image sensor of the device, under the detecting mold following the movement of the upper image sensor, sensing a plurality of probes at the bottom of the detecting mold, and aligning the probe by mobilizing the loading tray or the detecting mold The reference position of the needle and the detection point.

Accordingly, it is possible to overcome the problem that an error is easily generated between the reference position of the probe and the reference position of the detection point in the above prior art, thereby improving the measurement accuracy of the circuit pattern structure on the substrate.

In a specific implementation, the receiving tray can be adjusted in a self-rotating manner The upper image sensor can be displaced along one or more axial directions to the upper side of the receiving plate, and the lower image sensor is fixed on the detecting table, and the detecting mold moves to the lower image sensor following the image sensor. Above.

In another specific implementation, the lower image sensor can also be displaced along more than one axial direction below the detection mold.

In addition, the device technology adopted by the present invention comprises: a detecting station; a receiving plate pivoted on the detecting table, wherein the substrate to be tested is placed on the receiving plate, and the substrate has a plurality of lines detected thereon An image sensor is disposed on the inspection table, and the substrate can be sensed above the receiving tray, and the reference position of the detection point of the substrate is corrected by mobilizing the receiving tray; An upper image sensor capable of following the movement of the upper image sensor, the detection mold has a plurality of probes at the bottom; and a lower image sensor disposed on the detection table below the position of the upper image sensor, The probe can be sensed under the test mold and the reference position of the probe and the detection point can be calibrated by mobilizing the display tray or the test mold.

Accordingly, it is advantageous to cause the substrate and the probe to receive the image sensor to calibrate the reference position.

In fact, the test stand has a first driver connected to the receiving and dismounting disk, and can drive the receiving and disposing disk to be rotated. The detecting station has a second driver connected to the image sensor to drive the image sensing. The device is displaced along one or more axial directions to the top of the receiving plate; the lower image sensor is fixed to On the test bench, the test mold moves to the top of the lower image sensor following the image sensor.

Alternatively, the detection station has a third driver coupled to the lower image sensor, and can also drive the lower image sensor to be displaced along one or more axial directions below the detection mold.

However, in order to clearly and fully disclose the present invention, the preferred embodiments are illustrated, and the detailed description of the embodiments will be described as follows:

Referring to FIG. 1 , a flow chart of the first embodiment of the present invention is disclosed, and the alignment method of the probe contact point detection point of the present invention is described with reference to FIG. 2 to FIG. 4 , which includes the following implementation steps:

In step S10, a mounting tray 2 capable of placing a plurality of substrates 9 to be tested is provided on a detecting station 1. The edge of the top surface of the substrate 9 has a detection point 91 of a plurality of lines (shown in FIG. 6); In an embodiment, the first drive 6 is connected to the top of the rotating shaft 61, and the first drive 6 is disposed on the top of the rotating shaft 61. The first driving device 6 is provided with a first driving device 6 for connecting the loading and unloading disk 2. The loading and unloading disk 2 can be driven to rotate via the rotating shaft 61.

In step S20, the upper image sensor 3 is used on the detection table 1, and the substrate 9 is sensed above the receiving and receiving disk 2 (shown in FIG. 5 and FIG. 6), and the loading and receiving disk 2 and the substrate 9 are transferred. Correcting the reference position of the detection point 91 of the substrate 9; in this embodiment, the upper image sensor 3 can be displaced along one or more axial directions to the top of the receiving and placing disk 2; in fact, the top of the detecting table 1 is provided with a connected image. a second driver 7 of the sensor 3, the second driver 7 includes a longitudinal driving unit 71, a lateral driving unit 72 and a vertical driving unit 73. The longitudinal driving unit 71 is disposed on the top of the detecting station 1, the lateral driving single The unit 72 is disposed on the longitudinal driving unit 71. The vertical driving unit 73 is disposed on the lateral driving unit 72, and the upper image sensor 3 is disposed on the vertical driving unit 73. The vertical, horizontal, and vertical driving units are provided. 71, 72, 73 each comprise a motor, a motor-driven screw and two guiding slides; thus, the second driver 7 can drive the upper image sensor 3 to be displaced longitudinally, laterally and vertically to the loading tray. In addition, the receiving tray 2 can mobilize the substrate 9 in a self-rotating manner via the first actuator 6.

In step S21, it is determined whether the reference position of the detection point 91 of the substrate 9 is corrected by a computer (not drawn) externally connected to the upper image sensor 3; in fact, the computer can receive the sensing by the upper image sensor 3. The image of the substrate 9 and the detection point 91 (shown in FIG. 6) is obtained, and the actual position of the substrate 9 and the detection point 91 is obtained, and the standard value of the reference position of the substrate 9 and the detection point 91 can be preset in the computer, and The computer can compare the actual position of the substrate 9 and the detection point 91 with the standard value, and obtain the error value of the substrate 9 and the detection point 91. The computer according to the error value of the substrate 9 and the detection point 91 Controlling the first driver 6 to mobilize the loading and receiving disk 2 to compensate the error values of the substrate 9 and the detection point 91, and correct the reference positions of the substrate 9 and the detection point 91; when the computer determines the reference of the detection point 91 of the substrate 9 When the position is not corrected, the process is repeated in step S20, and when the computer determines that the reference position of the detection point 91 of the substrate 9 has been corrected, the process proceeds to step S30.

In step S30, the lower image sensor 4 on the detecting station 1 having a lower position than the upper image sensor 3 is used below the detecting mold 5 following the movement of the image sensor 3 (in conjunction with FIG. 7 and FIG. 8), sensing the plurality of probes 51 at the bottom of the detecting mold 5, and mobilizing the receiving tray 2 by means of rotation And a substrate 9 for aligning the reference position of the probe 51 and the detecting point 91; in this embodiment, the detecting die 5 is disposed on the vertical driving unit 73 of the second driver 7 together with the upper image sensor 3, And detecting the height of the mold 5 is on the upper image sensor 3, and the second driver 7 can drive the detection mold 5 to follow the longitudinal, lateral and vertical displacement of the image sensor 3 to press and disengage the substrate 9. The detecting point 91 is fixed on the detecting table 1 and located on the side of the receiving tray 2, and the detecting mold 5 can be driven by the second driver 7 to follow the upper image sensor 4 to move down. Above the image sensor 4.

In step S31, the computer externally connected to the lower image sensor 4 determines whether the reference position of the probe 51 and the detection point 91 is proofed; in fact, the computer can also receive the lower image sensor 4 to sense The image of the probe 51 (shown in FIG. 7 and FIG. 8) is used to obtain the actual position of the probe 51, and the computer can detect the actual position of the probe 51 with the substrate 9 and the detection. The reference positions of the points 91 are compared with each other, and the error value of the probe 51 is obtained. The computer controls the first driver 6 to adjust the error of the probe 51 according to the error value of the probe 51. And correcting the reference position of the probe 51 and the detection point 91; when the computer determines that the reference position of the probe 51 and the detection point 91 is not collated, the method is repeated in step S30, when the computer determines the probe When the reference position of the needle 51 and the detection point 91 has been collated, the process proceeds to step S40.

In step S40, when the proofing of the reference position of the probe 51 and the detection point 91 is completed, the operation is terminated.

In another specific implementation, in step S30, the mold 5 can also be detected via the transfer, and the reference position of the probe 51 and the detection point 91 can be calibrated; In fact, in step S31, the computer can also adjust the error value of the probe 51 by rotating the detecting die 5 according to the error value of the probe 51, and correct the probe 51 and the detecting point. The base position of 91.

In another specific implementation, the lower image sensor 4 can also be displaced along one or more axial directions below the detecting mold 5; in this embodiment, the detecting station 1 has a connecting lower image sensor 4 The third driver 8 (shown in FIG. 9) can drive the lower image sensor 4 to be displaced along one or more axial directions below the detecting mold 5; in fact, the third driver 8 includes a longitudinal driving unit 81 and a lateral direction. The driving unit 82 is disposed on the detecting station 1. The horizontal driving unit 82 is disposed on the vertical driving unit 81, and the lower image sensor 4 is disposed on the horizontal driving unit 82. The vertical and horizontal driving is performed. The units 81, 82 are each constituted by a motor, a screw driven by the motor, and two guide rails; thus, the third actuator 8 can drive the lower image sensor 4 to be displaced to the detecting mold 5 in the longitudinal and lateral directions.

Accordingly, the reference position of the detection point 91 of the substrate 9 can be corrected by the upper image sensor 3, and the reference position of the probe 51 and the detection point 91 can be calibrated by the lower image sensor 4 to overcome the above prior art. In the middle, the problem that the reference position of the probe and the reference position of the detection point are easy to generate an error, thereby improving the measurement accuracy of the circuit pattern structure on the substrate.

Referring to FIG. 2, a top view of a second embodiment of the present invention is disclosed, and the alignment device for detecting a point on the substrate of the probe by the probe is described with reference to FIG. 3 and FIG. 4, and includes a detecting station 1 and a The loading tray 2, an upper image sensor 3, a detecting mold 5 and a lower image sensor 4; the receiving tray 2 is pivoted on the top of the detecting table 1, and the top of the receiving tray 2 can be placed on the substrate 9 to be tested. The surface of the substrate 9 has a detection point 91 of a plurality of lines (cooperating with FIG. 6 The upper image sensor 3 is disposed on the detecting table 1 and suspended above the detecting table 1 and the receiving tray 2 to sense the substrate 9 above the receiving tray 5 (as shown in FIG. 5). The reference position of the detection point 91 of the substrate 9 is corrected by the transfer tray 2; the detection mold 5 is coupled to the upper image sensor 3 (as shown in FIGS. 7 and 8), and can follow the movement of the upper image sensor 3, The bottom of the detecting mold 5 has a plurality of probes 51; the lower image sensor 4 is disposed on the detecting station 1 at a position lower than the upper image sensor 3, and the probe 51 can be sensed under the detecting mold 5, and The reference position of the probe 51 and the detection point 91 is calibrated by mobilizing the loading tray 2 or the detecting mold 5. The remaining component composition and implementation steps are equivalent to the first embodiment described above.

Accordingly, it is advantageous to cause the detection point 91 of the substrate 9 and the probe 51 to receive the image sensor to calibrate the reference position.

The invention is not intended to limit the invention, and other equivalent modifications or substitutions that are not departing from the spirit of the invention are intended to be included in the appended claims. Within the scope.

1‧‧‧Testing station

2‧‧‧Distribution tray

3‧‧‧Upper image sensor

4‧‧‧Down image sensor

5‧‧‧Testing mold

51‧‧‧ probe

6‧‧‧First drive

61‧‧‧ shaft

7‧‧‧second drive

71, 81‧‧‧ longitudinal drive unit

72, 82‧‧‧ transverse drive unit

73‧‧‧vertical drive unit

8‧‧‧ Third drive

9‧‧‧Substrate

91‧‧‧Checkpoints

1 is a plan view of a first embodiment of the present invention; FIG. 2 is a plan view of a second embodiment of the present invention; FIG. 3 is a cross-sectional view taken along line AA of FIG. 2; 5 is a use state diagram of FIG. 3; FIG. 6 is a partial enlarged view of one of the use states of FIG. 2; FIG. 7 is another use state diagram of FIG. 3; FIG. 8 is a probe and lower image sensor of FIG. Partial enlarged view; Figure 9 is a schematic view showing the configuration of the additional embodiment of Figure 3.

1‧‧‧Testing station

2‧‧‧Distribution tray

3‧‧‧Upper image sensor

4‧‧‧Down image sensor

5‧‧‧Testing mold

6‧‧‧First drive

61‧‧‧ shaft

7‧‧‧second drive

71‧‧‧Longitudinal drive unit

72‧‧‧Horizontal drive unit

73‧‧‧vertical drive unit

9‧‧‧Substrate

Claims (10)

  1. A method for aligning a detection point of a substrate by a probe, comprising: providing a receiving and placing disk capable of placing a substrate to be tested on a detecting platform, wherein the substrate has a detection point of a plurality of lines; using the detecting platform An upper image sensor, the substrate is sensed above the receiving plate, and the reference position of the detecting point of the substrate is corrected by mobilizing the receiving plate; and a position on the detecting table is lower than the upper image sensing a lower image sensor of the device, under the detecting mold following the movement of the upper image sensor, sensing a plurality of probes at the bottom of the detecting mold, and aligning the probe by mobilizing the loading tray or the detecting mold The reference position of the needle and the detection point.
  2. The method for aligning the detection points of the substrate by the probe according to the first aspect of the patent application, wherein the receiving tray is mobilized in a rotating manner.
  3. The method for aligning a substrate line detection point with a probe according to the first aspect of the patent application, wherein the upper image sensor is displaceable along the one or more axial directions above the receiving and placing disk.
  4. The alignment method of the probe touch-substrate line detection point according to the first aspect of the patent application, wherein the lower image sensor is fixed on the detection table, and the mold moves to the image following the image sensor Above the lower image sensor.
  5. The method for aligning the substrate line detection points with the probe according to the first aspect of the patent application, wherein the lower image sensor is capable of being displaced along the one or more axial directions below the mold.
  6. A aligning device for detecting a point on a substrate by a probe, comprising: a test tray; a receiving tray, pivoted on the detecting table, the substrate is placed on a substrate to be tested, the substrate has a detection point of a plurality of lines; an upper image sensor is disposed on the detecting platform The substrate can be sensed above the receiving tray, and the reference position of the detecting point of the substrate is adjusted by mobilizing the receiving tray; a detecting mold is coupled to the upper image sensor, and the upper image sensor can be followed Moving, the bottom of the detecting mold has a plurality of probes; and a lower image sensor is disposed on the detecting table below the position of the upper image sensor, and the probe can be sensed under the detecting mold and The receiving tray or the detecting mold is mobilized to calibrate the reference position of the probe and the detecting point.
  7. The alignment device with the probe pressing the substrate line detecting point according to the sixth aspect of the patent application, wherein the detecting station has a first driver connected to the receiving tray, and the driving tray can be driven to rotate in a rotating manner.
  8. The aligning device with the probe pressing the substrate line detecting point according to the sixth aspect of the patent application, wherein the detecting station has a second driver connected to the upper image sensor, and the upper image sensor can be driven Displaced along more than one axial direction above the susceptor disc.
  9. The alignment device for pressing a substrate line detection point with a probe according to the sixth aspect of the patent application, wherein the lower image sensor is fixed on the detection table, and the mold moves to the image following the image sensor Above the lower image sensor.
  10. The probe is pressed against the substrate line as described in claim 6 The alignment device of the detection point, wherein the detection station has a third driver coupled to the lower image sensor, and is capable of driving the lower image sensor to be displaced along the one or more axial directions below the mold.
TW100115933A 2011-05-06 2011-05-06 The method and device for detecting the touch point of the substrate line with the probe TWI416144B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW100115933A TWI416144B (en) 2011-05-06 2011-05-06 The method and device for detecting the touch point of the substrate line with the probe

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW100115933A TWI416144B (en) 2011-05-06 2011-05-06 The method and device for detecting the touch point of the substrate line with the probe
CN201110130125.2A CN102768013B (en) 2011-05-06 2011-05-19 Alignment method and device using probes to touch and press line detection points of substrate

Publications (2)

Publication Number Publication Date
TW201245737A TW201245737A (en) 2012-11-16
TWI416144B true TWI416144B (en) 2013-11-21

Family

ID=47095503

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100115933A TWI416144B (en) 2011-05-06 2011-05-06 The method and device for detecting the touch point of the substrate line with the probe

Country Status (2)

Country Link
CN (1) CN102768013B (en)
TW (1) TWI416144B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI621864B (en) * 2016-12-30 2018-04-21 技嘉科技股份有限公司 Alignment device and alignment method

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI581035B (en) * 2015-07-24 2017-05-01 惠特科技股份有限公司 Positioning method for liquid testing panel
JP6478891B2 (en) * 2015-10-07 2019-03-06 三菱電機株式会社 Probe position inspection device
CN105425140A (en) * 2015-12-17 2016-03-23 埃泰克汽车电子(芜湖)有限公司 Testing device and testing method of PCB half-finished product
CN105407703B (en) * 2015-12-17 2018-11-13 埃泰克汽车电子(芜湖)有限公司 Test device and its test method for PCB semi-finished product
CN105466337B (en) * 2015-12-31 2018-06-05 珠海市运泰利自动化设备有限公司 For detecting the fine and closely woven pin mark Systems for optical inspection of pcb board and its detection method
TWI640409B (en) * 2017-08-01 2018-11-11 蔡宜興 Micro resistance inspection device and inspection method thereof
CN109751961A (en) * 2019-01-07 2019-05-14 成都中电熊猫显示科技有限公司 A kind of the point automatic adjusting method and thicknesses of layers measuring device of film thickness measuring instrument

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5539676A (en) * 1993-04-15 1996-07-23 Tokyo Electron Limited Method of identifying probe position and probing method in prober
US5828225A (en) * 1995-07-05 1998-10-27 Tokyo Electron Limited Semiconductor wafer probing apparatus
TWI302985B (en) * 2005-05-31 2008-11-11 Tokyo Seimitsu Co Ltd Movement amount operation correction method for prober, computer-readable recording media for recording a movement amount operation operation correction processing program, and prober

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3313085B2 (en) * 1998-06-02 2002-08-12 日本電産リード株式会社 Substrate inspection apparatus and relative position adjustment method between substrate and inspection head in substrate inspection apparatus
CN1184486C (en) * 2001-12-21 2005-01-12 瀚宇彩晶股份有限公司 Electron product circuit signal position detecting system and its method
JP5506153B2 (en) * 2007-12-26 2014-05-28 株式会社ユニオンアロー・テクノロジー Board inspection equipment
CN101477155B (en) * 2008-01-03 2011-06-08 尚富煜科技股份有限公司 Electronic contact point positioning system and method
CN101738881B (en) * 2008-11-13 2011-06-22 财团法人金属工业研究发展中心 Two-stage image precise contraposition method for upper plate and lower plate, and device thereof
JP5300431B2 (en) * 2008-11-17 2013-09-25 株式会社日本マイクロニクス Substrate alignment device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5539676A (en) * 1993-04-15 1996-07-23 Tokyo Electron Limited Method of identifying probe position and probing method in prober
US5828225A (en) * 1995-07-05 1998-10-27 Tokyo Electron Limited Semiconductor wafer probing apparatus
TWI302985B (en) * 2005-05-31 2008-11-11 Tokyo Seimitsu Co Ltd Movement amount operation correction method for prober, computer-readable recording media for recording a movement amount operation operation correction processing program, and prober

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI621864B (en) * 2016-12-30 2018-04-21 技嘉科技股份有限公司 Alignment device and alignment method

Also Published As

Publication number Publication date
CN102768013A (en) 2012-11-07
CN102768013B (en) 2015-03-25
TW201245737A (en) 2012-11-16

Similar Documents

Publication Publication Date Title
KR100248569B1 (en) Probe system
KR100941441B1 (en) Test apparatus for touch screen panel
TWI416113B (en) The parallelism adjustment method and the inspection program memory medium and the inspection apparatus of the probe card and the mounting table
JP4782953B2 (en) Probe card characteristic measuring device, probe device, and probe method
CN201034559Y (en) Device for testing planarity and depth of parallelism of clintheriform workpieces top and plane
US8074497B2 (en) Indentation testing instrument and indentation testing method
CN101424507B (en) Flatness inspection device
KR101989840B1 (en) Apparatus for inspecting warpage of board-like body and method for inspecting warpage of board-like body
CN201247077Y (en) Calibration instrument for testing linear sensor
TWI438452B (en) Inspection device and inspection method
JP5295588B2 (en) Probe card tilt adjustment method, probe card tilt detection method, and program recording medium recording probe card tilt detection method
US20090284277A1 (en) Probe apparatus and method for correcting contact position
JP4968600B1 (en) Roundness measuring device and method of correcting misalignment
CN103458671B (en) A kind of contraposition kludge
JP4339631B2 (en) Inspection method and inspection apparatus
CN103743975B (en) Flexible printed circuit board automatic testing equipment and flexible printed circuit board automatic testing method
KR101282463B1 (en) testing device for performance characteristics of speed sensor
KR100968131B1 (en) Probe device and method of regulating contact pressure between object to be inspected and probe
CN102692203B (en) The method of calibration surface structure measurement device
CN103776584B (en) Torque rotary speed Standard Machine
US7688096B2 (en) Contact load measuring apparatus and inspecting apparatus
JP2010223865A (en) Corrected ball diameter calculating method and form measuring instrument
CN102607502B (en) Automatic detection device and method for size of automobile rear axle assembly
CN201488689U (en) Measuring instrument for measuring minimum ground clearance of automobile
WO2016155190A1 (en) Substrate detecting device and bulge height detecting method

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees