JP4724562B2 - 真空吸着ヘッド、その真空吸着ヘッドを用いた真空吸着装置及びテーブル - Google Patents

真空吸着ヘッド、その真空吸着ヘッドを用いた真空吸着装置及びテーブル Download PDF

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Publication number
JP4724562B2
JP4724562B2 JP2005515658A JP2005515658A JP4724562B2 JP 4724562 B2 JP4724562 B2 JP 4724562B2 JP 2005515658 A JP2005515658 A JP 2005515658A JP 2005515658 A JP2005515658 A JP 2005515658A JP 4724562 B2 JP4724562 B2 JP 4724562B2
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Prior art keywords
suction
casing
shaft
vacuum suction
vacuum
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Expired - Lifetime
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Japanese (ja)
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JPWO2005049287A1 (ja
Inventor
仁孝 西尾
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B25B11/007—Vacuum work holders portable, e.g. handheld
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Liquid Crystal (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
  • Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)
  • Sanitary Device For Flush Toilet (AREA)
JP2005515658A 2003-11-21 2004-11-19 真空吸着ヘッド、その真空吸着ヘッドを用いた真空吸着装置及びテーブル Expired - Lifetime JP4724562B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005515658A JP4724562B2 (ja) 2003-11-21 2004-11-19 真空吸着ヘッド、その真空吸着ヘッドを用いた真空吸着装置及びテーブル

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003392157 2003-11-21
JP2003392157 2003-11-21
PCT/JP2004/017255 WO2005049287A1 (ja) 2003-11-21 2004-11-19 真空吸着ヘッド、その真空吸着ヘッドを用いた真空吸着装置及びテーブル
JP2005515658A JP4724562B2 (ja) 2003-11-21 2004-11-19 真空吸着ヘッド、その真空吸着ヘッドを用いた真空吸着装置及びテーブル

Publications (2)

Publication Number Publication Date
JPWO2005049287A1 JPWO2005049287A1 (ja) 2008-03-06
JP4724562B2 true JP4724562B2 (ja) 2011-07-13

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US (1) US7665783B2 (enExample)
EP (1) EP1685930B1 (enExample)
JP (1) JP4724562B2 (enExample)
KR (1) KR101142346B1 (enExample)
CN (1) CN100445049C (enExample)
AT (1) ATE420751T1 (enExample)
DE (1) DE602004019132D1 (enExample)
PL (1) PL1685930T3 (enExample)
TW (1) TW200529997A (enExample)
WO (1) WO2005049287A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010527805A (ja) * 2007-05-31 2010-08-19 ヨナス アンド レードマン アウトマーツィオーンズテヒニク ゲーエムベーハー ベルヌーイ・グリッパからなるグリッパ
JP2017537479A (ja) * 2014-11-18 2017-12-14 エルジー・シルトロン・インコーポレーテッド ウェハー研磨装備のウェハーローディング装置及びウェハーローディング位置調整方法
US12486898B2 (en) 2024-04-26 2025-12-02 Honeywell Federal Manufacturing & Technologies, Llc Collapsible gasket

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CN1882425A (zh) 2006-12-20
EP1685930A4 (en) 2007-10-10
PL1685930T3 (pl) 2009-06-30
EP1685930B1 (en) 2009-01-14
WO2005049287A1 (ja) 2005-06-02
ATE420751T1 (de) 2009-01-15
DE602004019132D1 (de) 2009-03-05
US7665783B2 (en) 2010-02-23
KR20060126485A (ko) 2006-12-07
KR101142346B1 (ko) 2012-05-18
US20070200377A1 (en) 2007-08-30
TW200529997A (en) 2005-09-16
TWI346034B (enExample) 2011-08-01
EP1685930A1 (en) 2006-08-02

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