JP4705450B2 - ウェーハの保持機構 - Google Patents
ウェーハの保持機構 Download PDFInfo
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- JP4705450B2 JP4705450B2 JP2005292307A JP2005292307A JP4705450B2 JP 4705450 B2 JP4705450 B2 JP 4705450B2 JP 2005292307 A JP2005292307 A JP 2005292307A JP 2005292307 A JP2005292307 A JP 2005292307A JP 4705450 B2 JP4705450 B2 JP 4705450B2
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- wafer
- holding
- suction
- frame
- tape
- Prior art date
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- 230000002093 peripheral effect Effects 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 18
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 claims description 12
- 239000010453 quartz Substances 0.000 claims description 7
- 229910052594 sapphire Inorganic materials 0.000 claims description 7
- 239000010980 sapphire Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000005388 borosilicate glass Substances 0.000 claims description 6
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 claims description 6
- 229910001634 calcium fluoride Inorganic materials 0.000 claims description 6
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 claims description 6
- 229910001635 magnesium fluoride Inorganic materials 0.000 claims description 6
- 230000014759 maintenance of location Effects 0.000 claims 1
- 238000000926 separation method Methods 0.000 description 25
- 238000005520 cutting process Methods 0.000 description 23
- 239000010408 film Substances 0.000 description 21
- 239000011148 porous material Substances 0.000 description 10
- 238000003384 imaging method Methods 0.000 description 4
- 238000005553 drilling Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910009372 YVO4 Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
- Dicing (AREA)
Description
化リチウム、フッ化マグネシウムのいずれかで構成されることが好ましい。
発光体が配設されることが好ましい。
2:保持手段
20:支持板
21:吸引部
21a:第一の吸引部 21b:第二の吸引部
21c:第一の吸引源 21d:第二の吸引源 21e:吸引源
210:露出部
22:駆動源 23a、23b:移動基台 24a、24b:ボールネジ
25a、25b:ガイドレール 26a、26b:モータ
27:フレーム支持部
270:支持部材 271:押圧部材
28:枠体
29:枠体
29a:外周溝
290:枠体
290a:フレーム支持部
3:加工手段
30:ハウジング 31:加工ヘッド 32:支持部 33a:出力調整手段
33b:発振手段 33c:周波数設定手段
34:Z軸送り手段
340:壁部 341:ボールネジ 342:パルスモータ
343:ガイドレール
35:Y軸方向送り手段
350:ボールネジ 351:移動基台 352:パルスモータ
353:ガイドレール
4:アライメント手段
40:撮像部
5:ウェーハ保持部
5a:保持面
6a、6b、6c、6d、6e:ウェーハの保持機構
7:ウェーハ保持部
7a:保持面
8:ウェーハ保持部
8a:保持面
9:空間
90:発光体
10:ウェーハ保持部
10a:保持面 100:溝
11:ウェーハ保持部
11a:保持面 110:溝
12:ウェーハ保持部
12a:保持面 120:溝
W:ウェーハ
D:デバイス S:分離予定ライン G:分離溝
T、T1:テープ F:フレーム
13:ダイアタッチフィルム
Claims (4)
- ウェーハにレーザ加工を施すレーザ加工装置に配設された、テープを介してフレームと一体となったウェーハを保持するウェーハの保持機構であって、
ウェーハを保持する保持面を有するウェーハ保持部と、該ウェーハ保持部を囲繞する枠体と、を少なくとも含み、
該ウェーハ保持部は、該保持面が該枠体の上面と面一に構成されているとともに該ウェーハ保持部の下側に配設され第一の吸引源に連通する第一の吸引部によって吸引保持され、該枠体には、第二の吸引源に連通する第二の吸引部が配設され、
該枠体の外周側には該フレームを支持するフレーム支持部が配設されており、
該フレーム支持部によって該フレームが保持されると、該第二の吸引部が該テープによって覆われてシールされ、
該第二の吸引部から該ウェーハ保持部の外周端部を介して該保持面に伝達される吸引力によって該テープと該保持面との間の空間が減圧され該テープを介して該ウェーハを該保持面において保持し、
該ウェーハ保持部は波長が355nmのレーザ光を透過、分散させる材料で形成されている、
レーザ加工装置に配設されたウェーハの保持機構。 - 前記保持面には外周端部において開口した複数の溝が形成されており、前記吸引部による吸引力が該複数の溝に伝達されてウェーハを該保持面において保持する請求項1に記載のウェーハの保持機構。
- 前記ウェーハ保持部は、石英、硼珪酸ガラス、サファイア、フッ化カルシウム、フッ化リチウム、フッ化マグネシウムのいずれかで構成される請求項1または2に記載のウェーハの保持機構。
- 前記ウェーハ保持部は、透明体または半透明体により構成され、該ウェーハ保持部の裏側には発光体が配設される請求項1、2または3に記載のウェーハの保持機構。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005292307A JP4705450B2 (ja) | 2005-03-11 | 2005-10-05 | ウェーハの保持機構 |
US11/360,814 US7557904B2 (en) | 2005-03-11 | 2006-02-24 | Wafer holding mechanism |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005069117 | 2005-03-11 | ||
JP2005069117 | 2005-03-11 | ||
JP2005292307A JP4705450B2 (ja) | 2005-03-11 | 2005-10-05 | ウェーハの保持機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006281434A JP2006281434A (ja) | 2006-10-19 |
JP4705450B2 true JP4705450B2 (ja) | 2011-06-22 |
Family
ID=36970473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005292307A Active JP4705450B2 (ja) | 2005-03-11 | 2005-10-05 | ウェーハの保持機構 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7557904B2 (ja) |
JP (1) | JP4705450B2 (ja) |
Cited By (1)
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---|---|---|---|---|
JP2015018974A (ja) * | 2013-07-11 | 2015-01-29 | 東京応化工業株式会社 | 支持体分離装置 |
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EP1803531B1 (en) * | 2004-10-15 | 2014-07-23 | Musashi Chemicals Industry Co., Ltd. | Method for processing lens using pressure-sensitive adhesive tape |
KR100674440B1 (ko) * | 2005-08-12 | 2007-01-25 | 주식회사 파이컴 | 프로브 카드 제조 방법 및 장치 |
WO2008065645A1 (en) * | 2006-11-27 | 2008-06-05 | Camtek Ltd. | A supporting system and a method for supporting an object |
DE102007033242A1 (de) * | 2007-07-12 | 2009-01-15 | Jenoptik Automatisierungstechnik Gmbh | Verfahren und Vorrichtung zum Trennen einer Planplatte aus sprödbrüchigem Material in mehrere Einzelplatten mittels Laser |
JP2009043771A (ja) * | 2007-08-06 | 2009-02-26 | Disco Abrasive Syst Ltd | チャックテーブル機構および被加工物の保持方法 |
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JP5331440B2 (ja) * | 2008-10-24 | 2013-10-30 | 株式会社ディスコ | レーザー加工装置のチャックテーブルの付着物除去方法 |
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JP2015018974A (ja) * | 2013-07-11 | 2015-01-29 | 東京応化工業株式会社 | 支持体分離装置 |
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US20060203222A1 (en) | 2006-09-14 |
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