JP4180107B2 - 窒化物系半導体素子の製造方法 - Google Patents
窒化物系半導体素子の製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 211
- 150000004767 nitrides Chemical class 0.000 title claims description 112
- 238000004519 manufacturing process Methods 0.000 title claims description 45
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 104
- 238000000034 method Methods 0.000 claims description 66
- 229910052757 nitrogen Inorganic materials 0.000 claims description 53
- 239000000758 substrate Substances 0.000 claims description 36
- 238000005498 polishing Methods 0.000 claims description 26
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 claims description 2
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 claims 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 96
- 238000005530 etching Methods 0.000 description 80
- 239000007789 gas Substances 0.000 description 35
- 239000013078 crystal Substances 0.000 description 31
- 230000007547 defect Effects 0.000 description 30
- 238000001020 plasma etching Methods 0.000 description 25
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 22
- 239000000460 chlorine Substances 0.000 description 20
- 108091006149 Electron carriers Proteins 0.000 description 19
- 229910052984 zinc sulfide Inorganic materials 0.000 description 10
- 239000002019 doping agent Substances 0.000 description 9
- 230000017525 heat dissipation Effects 0.000 description 9
- 238000010306 acid treatment Methods 0.000 description 8
- 238000005253 cladding Methods 0.000 description 8
- 238000001039 wet etching Methods 0.000 description 6
- 229910052582 BN Inorganic materials 0.000 description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 4
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 4
- NWAIGJYBQQYSPW-UHFFFAOYSA-N azanylidyneindigane Chemical compound [In]#N NWAIGJYBQQYSPW-UHFFFAOYSA-N 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000003776 cleavage reaction Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000002484 cyclic voltammetry Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000007017 scission Effects 0.000 description 2
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 229910000789 Aluminium-silicon alloy Inorganic materials 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 230000005355 Hall effect Effects 0.000 description 1
- 229910052774 Proactinium Inorganic materials 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- -1 thallium nitride Chemical class 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
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Description
8 n側電極
Claims (10)
- n型の窒化物系半導体層および窒化物系半導体基板のいずれかからなる第1半導体層の上面上に、活性層を含む窒化物半導体層からなる第2半導体層を形成する第1工程と、
前記第1半導体層の裏面を研磨することにより厚み加工する第2工程と、
前記第1工程及び前記第2工程の後、前記研磨により発生した転位を含む前記第1半導体層の裏面近傍の領域を除去して前記第1半導体層の裏面の転位密度を1×109cm−2以下とする第3工程と、
その後、前記転位を含む前記第1半導体層の裏面近傍の領域が除去された第1半導体層の裏面上に、n側電極を形成する第4工程とを備え、
前記第1半導体層と前記n側電極とのコンタクト抵抗を0.05Ωcm2以下とする、窒化物系半導体素子の製造方法。 - 前記第1半導体層の裏面は、前記第1半導体層の窒素面である、請求項1に記載の窒化物系半導体素子の製造方法。
- 前記第3工程により、前記転位密度は、1×106cm−2以下に低減される、請求項1又は2に記載の窒化物系半導体素子の製造方法。
- 前記第3工程により、前記転位を含む前記第1半導体層の裏面近傍の領域が0.5μm以上除去される、請求項1〜3のいずれかに記載の窒化物系半導体素子の製造方法。
- 前記基板は、成長用基板上に成長することを利用して形成されている、請求項1〜4のいずれかに記載の窒化物系半導体素子の製造方法。
- 前記第1工程によって前記第1半導体層の上面上に前記第2半導体層を形成した後に、前記第2工程によって前記第1半導体層の裏面を研磨することにより厚み加工を行う、請求項1〜5のいずれかに記載の窒化物系半導体素子の製造方法。
- 前記第1半導体層及び前記第2半導体層を劈開することにより、共振器端面を形成する第5工程をさらに備える、請求項1〜6のいずれかに記載の窒化物系半導体素子の製造方法。
- 前記第1半導体層は、HVPE法により形成される、請求項1〜7のいずれかに記載の窒化物系半導体素子の製造方法。
- 前記第2半導体層は、MOCVD法により形成される、請求項1〜8のいずれかに記載の窒化物系半導体素子の製造方法。
- 前記第1半導体層は、前記第2工程により180μm以下の厚みになるまで厚み加工される、請求項1〜9のいずれかに記載の窒化物系半導体素子の製造方法。
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JP5025540B2 (ja) | 2012-09-12 |
US20050029539A1 (en) | 2005-02-10 |
CN1913104A (zh) | 2007-02-14 |
JP2008160166A (ja) | 2008-07-10 |
US20070235750A1 (en) | 2007-10-11 |
US20080315221A1 (en) | 2008-12-25 |
US6890779B2 (en) | 2005-05-10 |
US20080067541A1 (en) | 2008-03-20 |
JP2008211228A (ja) | 2008-09-11 |
JP2013243400A (ja) | 2013-12-05 |
JP2008160167A (ja) | 2008-07-10 |
US7629623B2 (en) | 2009-12-08 |
US20040012032A1 (en) | 2004-01-22 |
CN1271766C (zh) | 2006-08-23 |
US20080179601A1 (en) | 2008-07-31 |
JP2012028812A (ja) | 2012-02-09 |
CN1447485A (zh) | 2003-10-08 |
CN1797803A (zh) | 2006-07-05 |
US6791120B2 (en) | 2004-09-14 |
US20070077669A1 (en) | 2007-04-05 |
US20080069162A1 (en) | 2008-03-20 |
US20050191775A1 (en) | 2005-09-01 |
US7655484B2 (en) | 2010-02-02 |
CN100448039C (zh) | 2008-12-31 |
CN1913104B (zh) | 2010-05-12 |
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