JP4105409B2 - マルチチップモジュールの製造方法 - Google Patents

マルチチップモジュールの製造方法 Download PDF

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Publication number
JP4105409B2
JP4105409B2 JP2001189893A JP2001189893A JP4105409B2 JP 4105409 B2 JP4105409 B2 JP 4105409B2 JP 2001189893 A JP2001189893 A JP 2001189893A JP 2001189893 A JP2001189893 A JP 2001189893A JP 4105409 B2 JP4105409 B2 JP 4105409B2
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Japan
Prior art keywords
semiconductor chip
chip
electrode pads
main surface
wiring board
Prior art date
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Expired - Fee Related
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JP2001189893A
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English (en)
Japanese (ja)
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JP2003007960A (ja
JP2003007960A5 (enExample
Inventor
一之 田口
憲彦 杉田
英樹 田中
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Renesas Technology Corp
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Renesas Technology Corp
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Priority to JP2001189893A priority Critical patent/JP4105409B2/ja
Priority to US10/481,463 priority patent/US7026188B2/en
Priority to PCT/JP2002/002187 priority patent/WO2003001596A1/ja
Priority to TW091112380A priority patent/TW594892B/zh
Publication of JP2003007960A publication Critical patent/JP2003007960A/ja
Publication of JP2003007960A5 publication Critical patent/JP2003007960A5/ja
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Publication of JP4105409B2 publication Critical patent/JP4105409B2/ja
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    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2001189893A 2001-06-22 2001-06-22 マルチチップモジュールの製造方法 Expired - Fee Related JP4105409B2 (ja)

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US10/481,463 US7026188B2 (en) 2001-06-22 2002-03-08 Electronic device and method for manufacturing the same
PCT/JP2002/002187 WO2003001596A1 (fr) 2001-06-22 2002-03-08 Dispositif electronique et son procede de fabrication
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