JP2006135771A - 電子部品モジュール - Google Patents
電子部品モジュール Download PDFInfo
- Publication number
- JP2006135771A JP2006135771A JP2004323831A JP2004323831A JP2006135771A JP 2006135771 A JP2006135771 A JP 2006135771A JP 2004323831 A JP2004323831 A JP 2004323831A JP 2004323831 A JP2004323831 A JP 2004323831A JP 2006135771 A JP2006135771 A JP 2006135771A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- wiring board
- cavity
- secured
- component element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1085—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the BAW device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14597—Matching SAW transducers to external electrical circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/0557—Disposition the external layer being disposed on a via connection of the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/13144—Gold [Au] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16238—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area protruding from the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1311—Foil encapsulation, e.g. of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
Abstract
【解決手段】 高周波モジュールにおいて、モジュール基板12上に、RF送受信LSI10、SAWチップ20、およびチップ部品30,31を実装し、SAWチップ20は、モジュール基板12との間に空洞22を確保するように実装され、このSAWチップ20と、これを除く他のRF送受信LSI10、チップ部品30,31とは、シート状シール材11により周辺部がモジュール基板12に接着されて外側から直接覆われている。
【選択図】 図1
Description
図1及び図2により、本発明の実施の形態1である高周波モジュールの一例を説明する。
T2<T3<T1 式(1)
式(1)の条件を満たす。
図3により、本発明の実施の形態2である高周波モジュールの一例を説明する。
図4により、本発明の実施の形態3である高周波モジュールの一例を説明する。
T4<T2<T3<T1 式(2)
式(2)の条件を満たす。
図5により、本発明の実施の形態4である高周波モジュールの一例を説明する。
Claims (11)
- 一面側に配線パターンが形成され、他面側に外部接続端子が形成されている配線基板と、
前記配線基板の一面側に搭載された複数の電子部品素子と、
前記電子部品素子を覆うシート状シール材とを有し、
前記電子部品素子の少なくとも一つは、前記配線基板との間に空洞を確保するように前記配線基板に実装され、
前記空洞が確保された電子部品素子と、前記空洞が確保された電子部品素子を除く他の電子部品素子とは、前記シート状シール材により周辺部が前記配線基板に接着されて外側から直接覆われていることを特徴とする電子部品モジュール。 - 請求項1記載の電子部品モジュールにおいて、
前記空洞が確保された電子部品素子は、前記空洞が確保された電子部品素子と、前記配線基板に設けた配線パターンとを電気的に接続する金属バンプを有することを特徴とする電子部品モジュール。 - 請求項1または2記載の電子部品モジュールにおいて、
前記電子部品素子の少なくとも一つは、フェースダウンで前記配線基板に実装されるフリップチップLSIであり、
前記フリップチップLSIと前記配線基板との間隙は、アンダーフィル材により封止されていることを特徴とする電子部品モジュール。 - 一面側に配線パターンが形成され、他面側に外部接続端子が形成されている配線基板と、
前記配線基板の一面側に搭載された複数の電子部品素子と、
前記電子部品素子を覆うシート状シール材と、
前記配線基板を封止する外装用樹脂材とを有し、
前記電子部品素子の少なくとも一つは、前記配線基板との間に空洞を確保するように前記配線基板に実装され、
前記空洞が確保された電子部品素子は、前記シート状シール材により周辺部が前記配線基板に接着されて覆われ、
前記覆われて空洞が確保された電子部品素子と、前記覆われて空洞が確保された電子部品素子を除く他の電子部品素子とは、前記外装用樹脂材により外側から覆われていることを特徴とする電子部品モジュール。 - 一面側に配線パターンが形成され、他面側に外部接続端子が形成されている配線基板と、
前記配線基板の一面側に搭載された複数の電子部品素子と、
前記電子部品素子を覆うシート状シール材と、
前記配線基板を覆う外装用金属材とを有し、
前記電子部品素子の少なくとも一つは、前記配線基板との間に空洞を確保するように前記配線基板に実装され、
前記空洞が確保された電子部品素子は、前記シート状シール材により周辺部が前記配線基板に接着されて覆われ、
前記覆われて空洞が確保された電子部品素子と、前記覆われて空洞が確保された電子部品素子を除く他の電子部品素子とは、前記外装用金属材により外側から覆われていることを特徴とする電子部品モジュール。 - 請求項1または2記載の電子部品モジュールにおいて、
前記電子部品素子と前記配線基板との電気的接続は接着材によって行い、
前記接着材の融点をT1(℃)、前記シート状シール材の融点をT2(℃)とした場合に、
T2<T1
の関係を満足することを特徴とする電子部品モジュール。 - 請求項3記載の電子部品モジュールにおいて、
前記電子部品素子と前記配線基板との電気的接続を接着材によって行い、
前記接着材の融点をT1(℃)、前記シート状シール材の融点をT2(℃)、前記アンダーフィル材の融点をT3(℃)とした場合に、
T2<T3<T1
の関係を満足することを特徴とする電子部品モジュール。 - 請求項4記載の電子部品モジュールにおいて、
前記電子部品素子と前記配線基板との電気的接続を接着材によって行い、
前記接着材の融点をT1(℃)、前記シート状シール材の融点をT2(℃)、アンダーフィル材の融点をT3(℃)、前記外装用樹脂材の融点をT4(℃)とした場合に、
T4<T2<T3<T1
の関係を満足することを特徴とする電子部品モジュール。 - 請求項1〜8のいずれか1項に記載の電子部品モジュールにおいて、
前記空洞が確保された電子部品素子は、弾性表面波フィルタチップであることを特徴とする電子部品モジュール。 - 請求項1〜8のいずれか1項に記載の電子部品モジュールにおいて、
前記空洞が確保された電子部品素子は、薄膜圧電共振器であることを特徴とする電子部品モジュール。 - 請求項1〜8のいずれか1項に記載の電子部品モジュールにおいて、
前記空洞が確保された電子部品素子は、SMR型BAWであることを特徴とする電子部品モジュール。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004323831A JP2006135771A (ja) | 2004-11-08 | 2004-11-08 | 電子部品モジュール |
US11/260,485 US7453703B2 (en) | 2004-11-08 | 2005-10-28 | Electronic component module having electronic component with piezoelectric device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004323831A JP2006135771A (ja) | 2004-11-08 | 2004-11-08 | 電子部品モジュール |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006135771A true JP2006135771A (ja) | 2006-05-25 |
Family
ID=36316657
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004323831A Pending JP2006135771A (ja) | 2004-11-08 | 2004-11-08 | 電子部品モジュール |
Country Status (2)
Country | Link |
---|---|
US (1) | US7453703B2 (ja) |
JP (1) | JP2006135771A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7333965B2 (ja) | 2021-08-19 | 2023-08-28 | 三安ジャパンテクノロジー株式会社 | モジュール |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200625799A (en) * | 2004-12-22 | 2006-07-16 | Airoha Tech Corp | RF front-end structure |
JP2008028352A (ja) * | 2006-06-02 | 2008-02-07 | Nec Lighting Ltd | 電子機器および電子機器の製造方法 |
WO2008078898A1 (en) * | 2006-12-22 | 2008-07-03 | Lg Innotek Co., Ltd | High frequency module and manufacturing method thereof |
KR101349544B1 (ko) * | 2007-01-30 | 2014-01-08 | 엘지이노텍 주식회사 | 고주파 모듈 |
JP2009088351A (ja) * | 2007-10-01 | 2009-04-23 | Denso Corp | 電子回路装置の製造方法および電子回路装置 |
CN107371326A (zh) * | 2017-07-13 | 2017-11-21 | 安捷利电子科技(苏州)有限公司 | 一种传感器与印制电路板的连接结构 |
JP2021170750A (ja) * | 2020-04-17 | 2021-10-28 | 株式会社村田製作所 | 高周波モジュール及び通信装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3825475B2 (ja) * | 1995-06-30 | 2006-09-27 | 株式会社 東芝 | 電子部品の製造方法 |
US6038133A (en) * | 1997-11-25 | 2000-03-14 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module and method for producing the same |
JP3698233B2 (ja) * | 1998-04-28 | 2005-09-21 | 富士通株式会社 | プリント配線板実装構造 |
JP2001177044A (ja) * | 1999-12-15 | 2001-06-29 | Murata Mfg Co Ltd | 電子部品モジュール及び圧電発振器 |
US6538210B2 (en) * | 1999-12-20 | 2003-03-25 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module, radio device having the same, and method for producing the same |
TW569424B (en) * | 2000-03-17 | 2004-01-01 | Matsushita Electric Ind Co Ltd | Module with embedded electric elements and the manufacturing method thereof |
JP4105409B2 (ja) * | 2001-06-22 | 2008-06-25 | 株式会社ルネサステクノロジ | マルチチップモジュールの製造方法 |
JP3789410B2 (ja) | 2002-08-29 | 2006-06-21 | 富士通メディアデバイス株式会社 | 表面実装型電子部品モジュールおよびその製造方法 |
JP2004215218A (ja) | 2002-11-13 | 2004-07-29 | Hitachi Media Electoronics Co Ltd | 弾性表面波装置及びそれを用いた移動体通信機 |
JP2004222244A (ja) | 2002-12-27 | 2004-08-05 | Toshiba Corp | 薄膜圧電共振器およびその製造方法 |
JP4177233B2 (ja) * | 2003-01-28 | 2008-11-05 | 富士通メディアデバイス株式会社 | 弾性表面波デバイス及びその製造方法 |
WO2004107432A1 (ja) * | 2003-05-29 | 2004-12-09 | Fujitsu Limited | 電子部品の実装方法、取外し方法及びその装置 |
KR20050035904A (ko) * | 2003-10-07 | 2005-04-20 | 삼성전기주식회사 | 공통접지 인덕터를 구비한 래더형 벌크탄성파 필터 |
JP2005124018A (ja) * | 2003-10-20 | 2005-05-12 | Tdk Corp | 電子部品およびその製造方法 |
JP3875240B2 (ja) * | 2004-03-31 | 2007-01-31 | 株式会社東芝 | 電子部品の製造方法 |
JP4907070B2 (ja) * | 2004-09-10 | 2012-03-28 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
-
2004
- 2004-11-08 JP JP2004323831A patent/JP2006135771A/ja active Pending
-
2005
- 2005-10-28 US US11/260,485 patent/US7453703B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7333965B2 (ja) | 2021-08-19 | 2023-08-28 | 三安ジャパンテクノロジー株式会社 | モジュール |
Also Published As
Publication number | Publication date |
---|---|
US20060099390A1 (en) | 2006-05-11 |
US7453703B2 (en) | 2008-11-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7453703B2 (en) | Electronic component module having electronic component with piezoelectric device | |
US6759925B2 (en) | Radio-frequency hybrid switch module | |
JP3949695B2 (ja) | 受信装置 | |
JP2005198051A (ja) | 高周波モジュール | |
WO2021044691A1 (ja) | 高周波モジュール及び通信装置 | |
KR102431544B1 (ko) | 고주파 모듈 및 통신장치 | |
US9543268B2 (en) | Electronic component, method of manufacturing same, composite module including electronic component, and method of manufacturing same | |
JP2021103713A (ja) | 高周波モジュール及び通信装置 | |
JP3663953B2 (ja) | 高周波モジュールとその製造方法 | |
JP5107281B2 (ja) | 電子部品、デュープレクサ、通信モジュール、通信装置、および電子部品の製造方法 | |
JP4145476B2 (ja) | 弾性表面波装置の製造方法 | |
JP2008271169A (ja) | 高周波モジュール及びそれを備える携帯端末 | |
KR101633643B1 (ko) | 필터 모듈 | |
JP3948925B2 (ja) | 高周波モジュール部品 | |
JP2005110017A (ja) | 高周波フィルタモジュール及びその製造方法 | |
KR100699579B1 (ko) | 다중 모드 수정 발진기 | |
KR100435042B1 (ko) | 듀플렉스 패키지 제조방법 | |
JP4260835B2 (ja) | 高周波モジュール部品 | |
KR101700844B1 (ko) | 필터 모듈 | |
JP4148226B2 (ja) | 高周波モジュール | |
JP2003087093A (ja) | 弾性表面波フィルタ | |
KR100851169B1 (ko) | 듀플렉서 패키지 및 그 제조방법 | |
JP2004363735A (ja) | 水晶発振器、その製造方法 | |
CN111130489A (zh) | 芯片封装模块及封装方法及具有该模块的电子装置 | |
JP2006024744A (ja) | 半導体装置および半導体装置の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061006 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090316 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090407 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090602 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20090623 |