JP3852221B2 - 封止用エポキシ樹脂成形材料及び電子部品装置 - Google Patents
封止用エポキシ樹脂成形材料及び電子部品装置 Download PDFInfo
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- JP3852221B2 JP3852221B2 JP27634498A JP27634498A JP3852221B2 JP 3852221 B2 JP3852221 B2 JP 3852221B2 JP 27634498 A JP27634498 A JP 27634498A JP 27634498 A JP27634498 A JP 27634498A JP 3852221 B2 JP3852221 B2 JP 3852221B2
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- epoxy resin
- molding material
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- 125000004432 carbon atom Chemical group C* 0.000 claims description 20
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- 238000001746 injection moulding Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000000040 m-tolyl group Chemical group [H]C1=C([H])C(*)=C([H])C(=C1[H])C([H])([H])[H] 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- UJNZOIKQAUQOCN-UHFFFAOYSA-N methyl(diphenyl)phosphane Chemical compound C=1C=CC=CC=1P(C)C1=CC=CC=C1 UJNZOIKQAUQOCN-UHFFFAOYSA-N 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 125000004957 naphthylene group Chemical group 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- 125000003261 o-tolyl group Chemical group [H]C1=C([H])C(*)=C(C([H])=C1[H])C([H])([H])[H] 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- RPGWZZNNEUHDAQ-UHFFFAOYSA-N phenylphosphine Chemical compound PC1=CC=CC=C1 RPGWZZNNEUHDAQ-UHFFFAOYSA-N 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 125000005628 tolylene group Chemical group 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27634498A JP3852221B2 (ja) | 1998-09-30 | 1998-09-30 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27634498A JP3852221B2 (ja) | 1998-09-30 | 1998-09-30 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
Related Child Applications (2)
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|---|---|---|---|
| JP2004021442A Division JP3982505B2 (ja) | 2004-01-29 | 2004-01-29 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
| JP2006013660A Division JP2006111888A (ja) | 2006-01-23 | 2006-01-23 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000103939A JP2000103939A (ja) | 2000-04-11 |
| JP2000103939A5 JP2000103939A5 (enrdf_load_stackoverflow) | 2004-12-24 |
| JP3852221B2 true JP3852221B2 (ja) | 2006-11-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27634498A Expired - Fee Related JP3852221B2 (ja) | 1998-09-30 | 1998-09-30 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006111888A (ja) * | 2006-01-23 | 2006-04-27 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び電子部品装置 |
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|---|---|---|---|---|
| JP3489025B2 (ja) * | 2000-01-14 | 2004-01-19 | 大塚化学ホールディングス株式会社 | エポキシ樹脂組成物及びそれを用いた電子部品 |
| JP2001316565A (ja) * | 2000-05-10 | 2001-11-16 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2001335679A (ja) * | 2000-05-29 | 2001-12-04 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP4765150B2 (ja) * | 2000-05-29 | 2011-09-07 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
| JP2001354839A (ja) * | 2000-06-15 | 2001-12-25 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2002003701A (ja) * | 2000-06-20 | 2002-01-09 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2002012741A (ja) * | 2000-06-27 | 2002-01-15 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP3889206B2 (ja) * | 2000-07-24 | 2007-03-07 | 京セラケミカル株式会社 | 封止用樹脂組成物および半導体封止装置 |
| JP3957957B2 (ja) * | 2000-07-24 | 2007-08-15 | 京セラケミカル株式会社 | 封止用樹脂組成物および半導体封止装置 |
| JP2002047393A (ja) * | 2000-08-01 | 2002-02-12 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| TW572964B (en) * | 2000-09-21 | 2004-01-21 | Chang Chun Plastics Co Ltd | Flame retarded epoxy resin composition |
| JP4899273B2 (ja) * | 2001-08-27 | 2012-03-21 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
| JP5061413B2 (ja) * | 2001-09-10 | 2012-10-31 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
| JP2002317101A (ja) * | 2001-04-23 | 2002-10-31 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2002327105A (ja) * | 2001-05-07 | 2002-11-15 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
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| KR100448164B1 (ko) * | 2001-12-07 | 2004-09-10 | 제일모직주식회사 | 난연성 열가소성 수지조성물 |
| KR100600597B1 (ko) * | 2001-12-28 | 2006-07-13 | 제일모직주식회사 | 반도체 봉지재용 에폭시 수지 조성물 |
| JP2005047995A (ja) * | 2003-07-30 | 2005-02-24 | Kaneka Corp | 難燃性を向上させた耐熱性樹脂組成物およびその利用 |
| WO2007080998A1 (ja) | 2006-01-13 | 2007-07-19 | Fushimi Pharmaceutical Co., Ltd. | シアナト基含有環状ホスファゼン化合物およびその製造方法 |
| WO2009048117A1 (ja) * | 2007-10-11 | 2009-04-16 | Fushimi Pharmaceutical Co., Ltd. | エポキシ化合物組成物 |
-
1998
- 1998-09-30 JP JP27634498A patent/JP3852221B2/ja not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006111888A (ja) * | 2006-01-23 | 2006-04-27 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び電子部品装置 |
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