JP2019149466A - 回路モジュール - Google Patents
回路モジュール Download PDFInfo
- Publication number
- JP2019149466A JP2019149466A JP2018033425A JP2018033425A JP2019149466A JP 2019149466 A JP2019149466 A JP 2019149466A JP 2018033425 A JP2018033425 A JP 2018033425A JP 2018033425 A JP2018033425 A JP 2018033425A JP 2019149466 A JP2019149466 A JP 2019149466A
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- electronic component
- resin layer
- insulating resin
- metal layer
- layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0045—Casings being rigid plastic containers having a coating of shielding material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16238—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area protruding from the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
- H01L2224/81815—Reflow soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (3)
- 配線構造体と、
前記配線構造体の上面に配置された少なくとも1つの電子部品と、
前記配線構造体の上面に設けられて少なくとも1つの前記電子部品を埋め込む絶縁樹脂層と、
前記絶縁樹脂層の上面に設けられた金属層と、
を備え、
前記絶縁樹脂層の上面における各前記電子部品の直上の部分の表面粗さがそれぞれR1と表され、前記絶縁樹脂層の上面における全ての前記電子部品の直上の部分以外の部分の表面粗さがR2と表されるとき、少なくとも一つのR1が、R1>R2を満たす、回路モジュール。 - R1/R2が1.01〜8.00である、請求項1に記載の回路モジュール。
- 前記電子部品の上面の少なくとも一部が、凹形状又は凸形状を有する、請求項1又は2に記載の回路モジュール。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018033425A JP7056226B2 (ja) | 2018-02-27 | 2018-02-27 | 回路モジュール |
US16/284,231 US11076513B2 (en) | 2018-02-27 | 2019-02-25 | Circuit module |
US17/352,982 US11606888B2 (en) | 2018-02-27 | 2021-06-21 | Circuit module |
US18/104,956 US11812542B2 (en) | 2018-02-27 | 2023-02-02 | Circuit module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018033425A JP7056226B2 (ja) | 2018-02-27 | 2018-02-27 | 回路モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019149466A true JP2019149466A (ja) | 2019-09-05 |
JP7056226B2 JP7056226B2 (ja) | 2022-04-19 |
Family
ID=67686286
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018033425A Active JP7056226B2 (ja) | 2018-02-27 | 2018-02-27 | 回路モジュール |
Country Status (2)
Country | Link |
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US (3) | US11076513B2 (ja) |
JP (1) | JP7056226B2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021124806A1 (ja) * | 2019-12-20 | 2021-06-24 | 株式会社村田製作所 | 電子部品モジュール、および、電子部品モジュールの製造方法 |
WO2022038887A1 (ja) * | 2020-08-20 | 2022-02-24 | 株式会社村田製作所 | モジュール |
WO2022123840A1 (ja) * | 2020-12-07 | 2022-06-16 | 株式会社村田製作所 | 高周波モジュール及び通信装置 |
WO2023017698A1 (ja) * | 2021-08-10 | 2023-02-16 | 株式会社村田製作所 | モジュール |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220029987A (ko) * | 2020-09-02 | 2022-03-10 | 에스케이하이닉스 주식회사 | 3차원 구조의 반도체 장치 |
CN114256211B (zh) * | 2020-09-25 | 2022-10-18 | 荣耀终端有限公司 | 封装体及其制备方法、终端和电子设备 |
TWI832393B (zh) * | 2022-08-24 | 2024-02-11 | 易鼎股份有限公司 | 電路板之導電凸塊結構及其製造方法 |
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2018
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2019
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2021
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2023
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JPH06163755A (ja) * | 1992-11-24 | 1994-06-10 | Mitsubishi Electric Corp | 樹脂封止型半導体装置 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2021124806A1 (ja) * | 2019-12-20 | 2021-06-24 | 株式会社村田製作所 | 電子部品モジュール、および、電子部品モジュールの製造方法 |
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WO2022038887A1 (ja) * | 2020-08-20 | 2022-02-24 | 株式会社村田製作所 | モジュール |
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WO2023017698A1 (ja) * | 2021-08-10 | 2023-02-16 | 株式会社村田製作所 | モジュール |
Also Published As
Publication number | Publication date |
---|---|
US11812542B2 (en) | 2023-11-07 |
US20190269046A1 (en) | 2019-08-29 |
US11076513B2 (en) | 2021-07-27 |
US11606888B2 (en) | 2023-03-14 |
US20210315137A1 (en) | 2021-10-07 |
US20230189491A1 (en) | 2023-06-15 |
JP7056226B2 (ja) | 2022-04-19 |
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