JP2016164271A - ポリイミド前駆体及びポリイミド - Google Patents
ポリイミド前駆体及びポリイミド Download PDFInfo
- Publication number
- JP2016164271A JP2016164271A JP2016076388A JP2016076388A JP2016164271A JP 2016164271 A JP2016164271 A JP 2016164271A JP 2016076388 A JP2016076388 A JP 2016076388A JP 2016076388 A JP2016076388 A JP 2016076388A JP 2016164271 A JP2016164271 A JP 2016164271A
- Authority
- JP
- Japan
- Prior art keywords
- group
- polyimide
- polyimide precursor
- tetracarboxylic acid
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001721 polyimide Polymers 0.000 title claims abstract description 332
- 239000004642 Polyimide Substances 0.000 title claims abstract description 255
- 239000002243 precursor Substances 0.000 title claims abstract description 171
- 239000000126 substance Substances 0.000 claims abstract description 133
- 150000000000 tetracarboxylic acids Chemical class 0.000 claims abstract description 104
- 125000003118 aryl group Chemical group 0.000 claims abstract description 36
- -1 diamine compound Chemical class 0.000 claims abstract description 25
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 17
- 150000004985 diamines Chemical class 0.000 claims description 138
- 239000002904 solvent Substances 0.000 claims description 97
- 238000002834 transmittance Methods 0.000 claims description 81
- 239000000203 mixture Substances 0.000 claims description 49
- 239000000758 substrate Substances 0.000 claims description 43
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 42
- 125000004432 carbon atom Chemical group C* 0.000 claims description 30
- 230000003287 optical effect Effects 0.000 claims description 22
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 18
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 15
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 12
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 12
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 10
- 239000001301 oxygen Substances 0.000 claims description 10
- 229910052760 oxygen Inorganic materials 0.000 claims description 10
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 8
- 125000005103 alkyl silyl group Chemical group 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 6
- 229910052717 sulfur Inorganic materials 0.000 claims description 6
- 125000004434 sulfur atom Chemical group 0.000 claims description 6
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 claims description 4
- ZFPGARUNNKGOBB-UHFFFAOYSA-N 1-Ethyl-2-pyrrolidinone Chemical compound CCN1CCCC1=O ZFPGARUNNKGOBB-UHFFFAOYSA-N 0.000 claims description 4
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 4
- 125000000962 organic group Chemical group 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 abstract description 2
- 229920002647 polyamide Polymers 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 113
- 239000010408 film Substances 0.000 description 40
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 27
- 238000006243 chemical reaction Methods 0.000 description 27
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 26
- 238000000034 method Methods 0.000 description 25
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 23
- 239000000178 monomer Substances 0.000 description 23
- 238000004817 gas chromatography Methods 0.000 description 21
- 229910001873 dinitrogen Inorganic materials 0.000 description 20
- 239000002253 acid Substances 0.000 description 19
- 239000003795 chemical substances by application Substances 0.000 description 15
- 238000005452 bending Methods 0.000 description 13
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 12
- 238000004458 analytical method Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- 229920005575 poly(amic acid) Polymers 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical compound FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 6
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- LAHCMYYCRFQUHP-UHFFFAOYSA-N 2-(4-azidophenyl)sulfanylisoindole-1,3-dione Chemical compound C1=CC(N=[N+]=[N-])=CC=C1SN1C(=O)C2=CC=CC=C2C1=O LAHCMYYCRFQUHP-UHFFFAOYSA-N 0.000 description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 5
- 125000006159 dianhydride group Chemical group 0.000 description 5
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000010992 reflux Methods 0.000 description 5
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 4
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 4
- RPOHXHHHVSGUMN-UHFFFAOYSA-N 1-n,4-n-bis(4-aminophenyl)benzene-1,4-dicarboxamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=C(C(=O)NC=2C=CC(N)=CC=2)C=C1 RPOHXHHHVSGUMN-UHFFFAOYSA-N 0.000 description 4
- NJHOBWAEBBSZLP-UHFFFAOYSA-N 2-n,4-n-bis(4-aminophenyl)-6-n-phenyl-1,3,5-triazine-2,4,6-triamine Chemical compound C1=CC(N)=CC=C1NC1=NC(NC=2C=CC=CC=2)=NC(NC=2C=CC(N)=CC=2)=N1 NJHOBWAEBBSZLP-UHFFFAOYSA-N 0.000 description 4
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 4
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- LGTGOCSQAOUUFP-UHFFFAOYSA-N 4-amino-n-[4-[(4-aminobenzoyl)amino]phenyl]benzamide Chemical compound C1=CC(N)=CC=C1C(=O)NC(C=C1)=CC=C1NC(=O)C1=CC=C(N)C=C1 LGTGOCSQAOUUFP-UHFFFAOYSA-N 0.000 description 4
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 4
- 0 CCC(C)(*)C(NN(*)C(C)(C)C(N*C)=O)=O Chemical compound CCC(C)(*)C(NN(*)C(C)(C)C(N*C)=O)=O 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 4
- 150000004984 aromatic diamines Chemical class 0.000 description 4
- 239000004305 biphenyl Substances 0.000 description 4
- XOZUGNYVDXMRKW-UHFFFAOYSA-N carbamoyliminourea Chemical compound NC(=O)N=NC(N)=O XOZUGNYVDXMRKW-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 4
- 238000004040 coloring Methods 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 4
- 150000005690 diesters Chemical class 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- JBFHTYHTHYHCDJ-UHFFFAOYSA-N gamma-caprolactone Chemical compound CCC1CCC(=O)O1 JBFHTYHTHYHCDJ-UHFFFAOYSA-N 0.000 description 4
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 239000005340 laminated glass Substances 0.000 description 4
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 4
- 230000014759 maintenance of location Effects 0.000 description 4
- 239000012046 mixed solvent Substances 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical compound C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 description 3
- QYIMZXITLDTULQ-UHFFFAOYSA-N 4-(4-amino-2-methylphenyl)-3-methylaniline Chemical compound CC1=CC(N)=CC=C1C1=CC=C(N)C=C1C QYIMZXITLDTULQ-UHFFFAOYSA-N 0.000 description 3
- XPAQFJJCWGSXGJ-UHFFFAOYSA-N 4-amino-n-(4-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=C(N)C=C1 XPAQFJJCWGSXGJ-UHFFFAOYSA-N 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- 150000001491 aromatic compounds Chemical class 0.000 description 3
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 3
- 235000010290 biphenyl Nutrition 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 238000006358 imidation reaction Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 3
- 238000007363 ring formation reaction Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- SIOVKLKJSOKLIF-HJWRWDBZSA-N trimethylsilyl (1z)-n-trimethylsilylethanimidate Chemical compound C[Si](C)(C)OC(/C)=N\[Si](C)(C)C SIOVKLKJSOKLIF-HJWRWDBZSA-N 0.000 description 3
- 230000004580 weight loss Effects 0.000 description 3
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 2
- 238000005160 1H NMR spectroscopy Methods 0.000 description 2
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 2
- FTYSULAJAVFRBZ-UHFFFAOYSA-N 2-n,4-n-bis(4-aminophenyl)-1,3,5-triazine-2,4,6-triamine Chemical compound C1=CC(N)=CC=C1NC1=NC(N)=NC(NC=2C=CC(N)=CC=2)=N1 FTYSULAJAVFRBZ-UHFFFAOYSA-N 0.000 description 2
- GTALYBOAEVNYOZ-UHFFFAOYSA-N 3-(2,3-dicarboxycyclohexyl)cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1C(C(=O)O)CCCC1C1C(C(O)=O)C(C(O)=O)CCC1 GTALYBOAEVNYOZ-UHFFFAOYSA-N 0.000 description 2
- JUZVXGMLUGCXEQ-UHFFFAOYSA-N 3-(3,4-dicarboxycyclohexyl)cyclohexane-1,2-dicarboxylic acid Chemical compound C1C(C(O)=O)C(C(=O)O)CCC1C1C(C(O)=O)C(C(O)=O)CCC1 JUZVXGMLUGCXEQ-UHFFFAOYSA-N 0.000 description 2
- OQEBBZSWEGYTPG-UHFFFAOYSA-N 3-aminobutanoic acid Chemical compound CC(N)CC(O)=O OQEBBZSWEGYTPG-UHFFFAOYSA-N 0.000 description 2
- HORNXRXVQWOLPJ-UHFFFAOYSA-N 3-chlorophenol Chemical compound OC1=CC=CC(Cl)=C1 HORNXRXVQWOLPJ-UHFFFAOYSA-N 0.000 description 2
- LJMPOXUWPWEILS-UHFFFAOYSA-N 3a,4,4a,7a,8,8a-hexahydrofuro[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1C2C(=O)OC(=O)C2CC2C(=O)OC(=O)C21 LJMPOXUWPWEILS-UHFFFAOYSA-N 0.000 description 2
- BKQWDTFZUNGWNV-UHFFFAOYSA-N 4-(3,4-dicarboxycyclohexyl)cyclohexane-1,2-dicarboxylic acid Chemical compound C1C(C(O)=O)C(C(=O)O)CCC1C1CC(C(O)=O)C(C(O)=O)CC1 BKQWDTFZUNGWNV-UHFFFAOYSA-N 0.000 description 2
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- ZPAKUZKMGJJMAA-UHFFFAOYSA-N Cyclohexane-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C(C(O)=O)CC1C(O)=O ZPAKUZKMGJJMAA-UHFFFAOYSA-N 0.000 description 2
- QGLBZNZGBLRJGS-UHFFFAOYSA-N Dihydro-3-methyl-2(3H)-furanone Chemical compound CC1CCOC1=O QGLBZNZGBLRJGS-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- CJYIPJMCGHGFNN-UHFFFAOYSA-N bicyclo[2.2.1]heptane-2,3,5,6-tetracarboxylic acid Chemical compound C1C2C(C(O)=O)C(C(=O)O)C1C(C(O)=O)C2C(O)=O CJYIPJMCGHGFNN-UHFFFAOYSA-N 0.000 description 2
- XQBSPQLKNWMPMG-UHFFFAOYSA-N bicyclo[2.2.2]octane-2,3,5,6-tetracarboxylic acid Chemical compound C1CC2C(C(O)=O)C(C(=O)O)C1C(C(O)=O)C2C(O)=O XQBSPQLKNWMPMG-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- DCFKHNIGBAHNSS-UHFFFAOYSA-N chloro(triethyl)silane Chemical compound CC[Si](Cl)(CC)CC DCFKHNIGBAHNSS-UHFFFAOYSA-N 0.000 description 2
- KQIADDMXRMTWHZ-UHFFFAOYSA-N chloro-tri(propan-2-yl)silane Chemical compound CC(C)[Si](Cl)(C(C)C)C(C)C KQIADDMXRMTWHZ-UHFFFAOYSA-N 0.000 description 2
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000021615 conjugation Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 2
- 239000003759 ester based solvent Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- GAEKPEKOJKCEMS-UHFFFAOYSA-N gamma-valerolactone Chemical compound CC1CCC(=O)O1 GAEKPEKOJKCEMS-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- YAMHXTCMCPHKLN-UHFFFAOYSA-N imidazolidin-2-one Chemical compound O=C1NCCN1 YAMHXTCMCPHKLN-UHFFFAOYSA-N 0.000 description 2
- 238000001095 inductively coupled plasma mass spectrometry Methods 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 230000009878 intermolecular interaction Effects 0.000 description 2
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 2
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- CZRKJHRIILZWRC-UHFFFAOYSA-N methyl acetate;propane-1,2-diol Chemical compound COC(C)=O.CC(O)CO CZRKJHRIILZWRC-UHFFFAOYSA-N 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- CTSLXHKWHWQRSH-UHFFFAOYSA-N oxalyl chloride Chemical compound ClC(=O)C(Cl)=O CTSLXHKWHWQRSH-UHFFFAOYSA-N 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 2
- 150000003505 terpenes Chemical class 0.000 description 2
- 235000007586 terpenes Nutrition 0.000 description 2
- BCNZYOJHNLTNEZ-UHFFFAOYSA-N tert-butyldimethylsilyl chloride Chemical compound CC(C)(C)[Si](C)(C)Cl BCNZYOJHNLTNEZ-UHFFFAOYSA-N 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- FYSNRJHAOHDILO-UHFFFAOYSA-N thionyl chloride Chemical compound ClS(Cl)=O FYSNRJHAOHDILO-UHFFFAOYSA-N 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 2
- JDGFELYPUWNNGR-UHFFFAOYSA-N 1,2,3,3a,4,5,6,6a-octahydropentalene-1,3,4,6-tetracarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C2C(C(=O)O)CC(C(O)=O)C21 JDGFELYPUWNNGR-UHFFFAOYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- KCZIUKYAJJEIQG-UHFFFAOYSA-N 1,3,5-triazin-2-amine Chemical compound NC1=NC=NC=N1 KCZIUKYAJJEIQG-UHFFFAOYSA-N 0.000 description 1
- MMBDKCNXVOREEF-UHFFFAOYSA-N 1-methyloctane-1,2,5,6-tetracarboxylic acid Chemical compound CCC(C(CCC(C(C)C(=O)O)C(=O)O)C(=O)O)C(=O)O MMBDKCNXVOREEF-UHFFFAOYSA-N 0.000 description 1
- AUTLGCUFNGHKMV-UHFFFAOYSA-N 1-n,3-n-bis(4-aminophenyl)-4-bromobenzene-1,3-dicarboxamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=C(Br)C(C(=O)NC=2C=CC(N)=CC=2)=C1 AUTLGCUFNGHKMV-UHFFFAOYSA-N 0.000 description 1
- DCLZMHCMMYGVJJ-UHFFFAOYSA-N 1-n,3-n-bis(4-aminophenyl)-5-tert-butylbenzene-1,3-dicarboxamide Chemical compound C=1C(C(C)(C)C)=CC(C(=O)NC=2C=CC(N)=CC=2)=CC=1C(=O)NC1=CC=C(N)C=C1 DCLZMHCMMYGVJJ-UHFFFAOYSA-N 0.000 description 1
- WCUIWQLAKQXKSU-UHFFFAOYSA-N 1-n,4-n-bis(4-aminophenyl)-2,3,5,6-tetrabromobenzene-1,4-dicarboxamide Chemical compound C1=CC(N)=CC=C1NC(=O)C(C(=C1Br)Br)=C(Br)C(Br)=C1C(=O)NC1=CC=C(N)C=C1 WCUIWQLAKQXKSU-UHFFFAOYSA-N 0.000 description 1
- MFZYBNYRKWXZAF-UHFFFAOYSA-N 1-n,4-n-bis(4-aminophenyl)-2,3,5,6-tetrachlorobenzene-1,4-dicarboxamide Chemical compound C1=CC(N)=CC=C1NC(=O)C(C(=C1Cl)Cl)=C(Cl)C(Cl)=C1C(=O)NC1=CC=C(N)C=C1 MFZYBNYRKWXZAF-UHFFFAOYSA-N 0.000 description 1
- ULAGWROFVKKYIA-UHFFFAOYSA-N 1-n,4-n-bis(4-aminophenyl)-2,5-dichlorobenzene-1,4-dicarboxamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC(Cl)=C(C(=O)NC=2C=CC(N)=CC=2)C=C1Cl ULAGWROFVKKYIA-UHFFFAOYSA-N 0.000 description 1
- MYEWQUYMRFSJHT-UHFFFAOYSA-N 2-(2-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC=C1S(=O)(=O)C1=CC=CC=C1N MYEWQUYMRFSJHT-UHFFFAOYSA-N 0.000 description 1
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
- QHDSBTKCTUXBEG-UHFFFAOYSA-N 2-[2-(2-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC=C1OC1=CC=CC=C1OC1=CC=CC=C1N QHDSBTKCTUXBEG-UHFFFAOYSA-N 0.000 description 1
- FLLRAXRMITXCAH-UHFFFAOYSA-N 2-[2-(2-aminophenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]aniline Chemical compound NC1=CC=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=CC=C1N FLLRAXRMITXCAH-UHFFFAOYSA-N 0.000 description 1
- MQZCBPWIFIEALZ-UHFFFAOYSA-N 2-[2-[2-[2-(2-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound NC1=CC=CC=C1OC1=CC=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=CC=C1OC1=CC=CC=C1N MQZCBPWIFIEALZ-UHFFFAOYSA-N 0.000 description 1
- GNQHLRFTGRZHLH-UHFFFAOYSA-N 2-[2-[2-[2-(2-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=CC=C(OC=2C(=CC=CC=2)N)C=1C(C)(C)C1=CC=CC=C1OC1=CC=CC=C1N GNQHLRFTGRZHLH-UHFFFAOYSA-N 0.000 description 1
- XMOJDDYUUPGBIT-UHFFFAOYSA-N 2-amino-6-[2-(3-amino-2-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phenol Chemical compound NC1=CC=CC(C(C=2C(=C(N)C=CC=2)O)(C(F)(F)F)C(F)(F)F)=C1O XMOJDDYUUPGBIT-UHFFFAOYSA-N 0.000 description 1
- BDWOJXKKPRYSTD-UHFFFAOYSA-N 2-n,4-n-bis(4-aminophenyl)-1,3,5-triazine-2,4-diamine Chemical compound C1=CC(N)=CC=C1NC1=NC=NC(NC=2C=CC(N)=CC=2)=N1 BDWOJXKKPRYSTD-UHFFFAOYSA-N 0.000 description 1
- ZFQAHQFOCBOMRX-UHFFFAOYSA-N 2-n,4-n-bis(4-aminophenyl)-6-ethyl-1,3,5-triazine-2,4-diamine Chemical compound N=1C(NC=2C=CC(N)=CC=2)=NC(CC)=NC=1NC1=CC=C(N)C=C1 ZFQAHQFOCBOMRX-UHFFFAOYSA-N 0.000 description 1
- HKEWCTIQGFTRHM-UHFFFAOYSA-N 2-n,4-n-bis(4-aminophenyl)-6-methyl-1,3,5-triazine-2,4-diamine Chemical compound N=1C(NC=2C=CC(N)=CC=2)=NC(C)=NC=1NC1=CC=C(N)C=C1 HKEWCTIQGFTRHM-UHFFFAOYSA-N 0.000 description 1
- PBSXNMHNUFQDKL-UHFFFAOYSA-N 2-n,4-n-bis(4-aminophenyl)-6-n-ethyl-1,3,5-triazine-2,4,6-triamine Chemical compound N=1C(NC=2C=CC(N)=CC=2)=NC(NCC)=NC=1NC1=CC=C(N)C=C1 PBSXNMHNUFQDKL-UHFFFAOYSA-N 0.000 description 1
- VVFMZHWAQNSESG-UHFFFAOYSA-N 2-n,4-n-bis(4-aminophenyl)-6-n-methyl-1,3,5-triazine-2,4,6-triamine Chemical compound N=1C(NC=2C=CC(N)=CC=2)=NC(NC)=NC=1NC1=CC=C(N)C=C1 VVFMZHWAQNSESG-UHFFFAOYSA-N 0.000 description 1
- DGVNUVUXXDLECE-UHFFFAOYSA-N 2-n,4-n-bis(4-aminophenyl)-6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound C1=CC(N)=CC=C1NC1=NC(NC=2C=CC(N)=CC=2)=NC(C=2C=CC=CC=2)=N1 DGVNUVUXXDLECE-UHFFFAOYSA-N 0.000 description 1
- SMDGQEQWSSYZKX-UHFFFAOYSA-N 3-(2,3-dicarboxyphenoxy)phthalic acid Chemical compound OC(=O)C1=CC=CC(OC=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O SMDGQEQWSSYZKX-UHFFFAOYSA-N 0.000 description 1
- FMXFZZAJHRLHGP-UHFFFAOYSA-N 3-(2,3-dicarboxyphenyl)sulfonylphthalic acid Chemical compound OC(=O)C1=CC=CC(S(=O)(=O)C=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O FMXFZZAJHRLHGP-UHFFFAOYSA-N 0.000 description 1
- QKWHURWFPGLXGD-UHFFFAOYSA-N 3-amino-n-(4-aminophenyl)-4-methylbenzamide Chemical compound C1=C(N)C(C)=CC=C1C(=O)NC1=CC=C(N)C=C1 QKWHURWFPGLXGD-UHFFFAOYSA-N 0.000 description 1
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 1
- CMHOFUYXIPMWBH-UHFFFAOYSA-N 4-(3,4-dicarboxycyclohexyl)oxycyclohexane-1,2-dicarboxylic acid Chemical compound C1C(C(O)=O)C(C(=O)O)CCC1OC1CC(C(O)=O)C(C(O)=O)CC1 CMHOFUYXIPMWBH-UHFFFAOYSA-N 0.000 description 1
- HLUQDUQCLMLYLO-UHFFFAOYSA-N 4-(3,4-dicarboxycyclohexyl)sulfanylcyclohexane-1,2-dicarboxylic acid Chemical compound C1C(C(O)=O)C(C(=O)O)CCC1SC1CC(C(O)=O)C(C(O)=O)CC1 HLUQDUQCLMLYLO-UHFFFAOYSA-N 0.000 description 1
- WJDHNPKLJKPWPI-UHFFFAOYSA-N 4-[(3,4-dicarboxycyclohexyl)-dimethylsilyl]cyclohexane-1,2-dicarboxylic acid Chemical compound C1CC(C(O)=O)C(C(O)=O)CC1[Si](C)(C)C1CCC(C(O)=O)C(C(O)=O)C1 WJDHNPKLJKPWPI-UHFFFAOYSA-N 0.000 description 1
- NTMNCGZUCLRMHK-UHFFFAOYSA-N 4-[(3,4-dicarboxycyclohexyl)methyl]cyclohexane-1,2-dicarboxylic acid Chemical compound C1C(C(O)=O)C(C(=O)O)CCC1CC1CC(C(O)=O)C(C(O)=O)CC1 NTMNCGZUCLRMHK-UHFFFAOYSA-N 0.000 description 1
- UFFLFXDNZXTURQ-UHFFFAOYSA-N 4-[2-(3,4-dicarboxycyclohexyl)propan-2-yl]cyclohexane-1,2-dicarboxylic acid Chemical compound C1CC(C(O)=O)C(C(O)=O)CC1C(C)(C)C1CCC(C(O)=O)C(C(O)=O)C1 UFFLFXDNZXTURQ-UHFFFAOYSA-N 0.000 description 1
- APXJLYIVOFARRM-UHFFFAOYSA-N 4-[2-(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(C(O)=O)C(C(O)=O)=C1 APXJLYIVOFARRM-UHFFFAOYSA-N 0.000 description 1
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 1
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 description 1
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 1
- LAEDKAVFQIILQF-UHFFFAOYSA-N 4-amino-n-(3-amino-4-bromophenyl)benzamide Chemical compound C1=CC(N)=CC=C1C(=O)NC1=CC=C(Br)C(N)=C1 LAEDKAVFQIILQF-UHFFFAOYSA-N 0.000 description 1
- NYFMLKFVNPVUMD-UHFFFAOYSA-N 4-amino-n-(3-amino-4-chlorophenyl)benzamide Chemical compound C1=CC(N)=CC=C1C(=O)NC1=CC=C(Cl)C(N)=C1 NYFMLKFVNPVUMD-UHFFFAOYSA-N 0.000 description 1
- URSCQJNZXVDAFA-UHFFFAOYSA-N 4-amino-n-(3-amino-4-fluorophenyl)benzamide Chemical compound C1=CC(N)=CC=C1C(=O)NC1=CC=C(F)C(N)=C1 URSCQJNZXVDAFA-UHFFFAOYSA-N 0.000 description 1
- HWKHQQCBFMYAJZ-UHFFFAOYSA-N 4-amino-n-(3-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1C(=O)NC1=CC=CC(N)=C1 HWKHQQCBFMYAJZ-UHFFFAOYSA-N 0.000 description 1
- YQSTVNJAQLPOGY-UHFFFAOYSA-N 4-amino-n-(4-amino-2,6-dichlorophenyl)benzamide Chemical compound C1=CC(N)=CC=C1C(=O)NC1=C(Cl)C=C(N)C=C1Cl YQSTVNJAQLPOGY-UHFFFAOYSA-N 0.000 description 1
- GFJNVCTUMOQWTF-UHFFFAOYSA-N 4-amino-n-(4-amino-2,6-dimethylphenyl)benzamide Chemical compound CC1=CC(N)=CC(C)=C1NC(=O)C1=CC=C(N)C=C1 GFJNVCTUMOQWTF-UHFFFAOYSA-N 0.000 description 1
- YCSQADLXNHJXCN-UHFFFAOYSA-N 4-amino-n-(4-amino-2-methylphenyl)benzamide Chemical compound CC1=CC(N)=CC=C1NC(=O)C1=CC=C(N)C=C1 YCSQADLXNHJXCN-UHFFFAOYSA-N 0.000 description 1
- FLYCPDGTLGZSDW-UHFFFAOYSA-N 4-amino-n-(4-amino-3-chlorophenyl)benzamide Chemical compound C1=CC(N)=CC=C1C(=O)NC1=CC=C(N)C(Cl)=C1 FLYCPDGTLGZSDW-UHFFFAOYSA-N 0.000 description 1
- AYSLWAMPAPAUOQ-UHFFFAOYSA-N 4-amino-n-(4-amino-3-methylphenyl)benzamide Chemical compound C1=C(N)C(C)=CC(NC(=O)C=2C=CC(N)=CC=2)=C1 AYSLWAMPAPAUOQ-UHFFFAOYSA-N 0.000 description 1
- XDKSKRORBIZOCZ-UHFFFAOYSA-N 4-amino-n-(4-aminophenyl)-2-bromobenzamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=C(N)C=C1Br XDKSKRORBIZOCZ-UHFFFAOYSA-N 0.000 description 1
- UNLDYLKYVUHALD-UHFFFAOYSA-N 4-amino-n-(4-aminophenyl)-2-chlorobenzamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=C(N)C=C1Cl UNLDYLKYVUHALD-UHFFFAOYSA-N 0.000 description 1
- SUTYWQSYCRBRCP-UHFFFAOYSA-N 4-amino-n-(4-aminophenyl)-2-methylbenzamide Chemical compound CC1=CC(N)=CC=C1C(=O)NC1=CC=C(N)C=C1 SUTYWQSYCRBRCP-UHFFFAOYSA-N 0.000 description 1
- PRCZROFEDIXZQB-UHFFFAOYSA-N 4-amino-n-(4-aminophenyl)-3-bromobenzamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=C(N)C(Br)=C1 PRCZROFEDIXZQB-UHFFFAOYSA-N 0.000 description 1
- JSVGPOXACVDXJT-UHFFFAOYSA-N 4-amino-n-(4-aminophenyl)-3-chlorobenzamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=C(N)C(Cl)=C1 JSVGPOXACVDXJT-UHFFFAOYSA-N 0.000 description 1
- OEIUYPYXOYZUAX-UHFFFAOYSA-N 4-amino-n-[3-[(4-aminobenzoyl)amino]phenyl]benzamide Chemical compound C1=CC(N)=CC=C1C(=O)NC1=CC=CC(NC(=O)C=2C=CC(N)=CC=2)=C1 OEIUYPYXOYZUAX-UHFFFAOYSA-N 0.000 description 1
- OHZBVFSIYLEJEB-UHFFFAOYSA-N 4-amino-n-[4-amino-2-(trifluoromethyl)phenyl]benzamide Chemical compound C1=CC(N)=CC=C1C(=O)NC1=CC=C(N)C=C1C(F)(F)F OHZBVFSIYLEJEB-UHFFFAOYSA-N 0.000 description 1
- NYYZMMHXWUNWIA-UHFFFAOYSA-N 4-amino-n-[4-amino-3-(trifluoromethyl)phenyl]benzamide Chemical compound C1=CC(N)=CC=C1C(=O)NC1=CC=C(N)C(C(F)(F)F)=C1 NYYZMMHXWUNWIA-UHFFFAOYSA-N 0.000 description 1
- UWVXHTPIZDLJFV-UHFFFAOYSA-N 4-n,6-n-bis(4-aminophenyl)-2-n,2-n-diethyl-1,3,5-triazine-2,4,6-triamine Chemical compound N=1C(NC=2C=CC(N)=CC=2)=NC(N(CC)CC)=NC=1NC1=CC=C(N)C=C1 UWVXHTPIZDLJFV-UHFFFAOYSA-N 0.000 description 1
- XYNWBGOVBMXUKZ-UHFFFAOYSA-N 4-n,6-n-bis(4-aminophenyl)-2-n,2-n-dimethyl-1,3,5-triazine-2,4,6-triamine Chemical compound N=1C(NC=2C=CC(N)=CC=2)=NC(N(C)C)=NC=1NC1=CC=C(N)C=C1 XYNWBGOVBMXUKZ-UHFFFAOYSA-N 0.000 description 1
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 1
- VWRKHZDUJPWJKV-UHFFFAOYSA-N 6-(carboxymethyl)bicyclo[2.2.1]heptane-2,3,5-tricarboxylic acid Chemical compound C1C2C(C(O)=O)C(CC(=O)O)C1C(C(O)=O)C2C(O)=O VWRKHZDUJPWJKV-UHFFFAOYSA-N 0.000 description 1
- JMHYNOCZNRXMLN-UHFFFAOYSA-N C/C(/NC)=N/C Chemical compound C/C(/NC)=N/C JMHYNOCZNRXMLN-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- HOONTXYGVYYNBV-UHFFFAOYSA-N ClC1=C(C=C(C(=O)NC2=CC=C(C=C2)N)C=C1)N.NC=1C=C(C(=O)NC2=CC=C(C=C2)N)C=CC1 Chemical compound ClC1=C(C=C(C(=O)NC2=CC=C(C=C2)N)C=C1)N.NC=1C=C(C(=O)NC2=CC=C(C=C2)N)C=CC1 HOONTXYGVYYNBV-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004805 Cyclohexane-1,2-dicarboxylic acid Substances 0.000 description 1
- DLEPYXFUDLQGDW-UHFFFAOYSA-N FC(F)(F)NC1=CC=C(C2=CC=C(NC(F)(F)F)C=C2)C=C1 Chemical compound FC(F)(F)NC1=CC=C(C2=CC=C(NC(F)(F)F)C=C2)C=C1 DLEPYXFUDLQGDW-UHFFFAOYSA-N 0.000 description 1
- XCOBLONWWXQEBS-KPKJPENVSA-N N,O-bis(trimethylsilyl)trifluoroacetamide Chemical compound C[Si](C)(C)O\C(C(F)(F)F)=N\[Si](C)(C)C XCOBLONWWXQEBS-KPKJPENVSA-N 0.000 description 1
- CDNRWDQZVLZMCQ-UHFFFAOYSA-N NC1=CC=C(C=C1)NC(C1=C(C(=C(C(=O)NC2=CC=C(C=C2)N)C(=C1F)F)F)F)=O.NC1=CC=C(C=C1)NC(C1=C(C=C(C(=O)NC2=CC=C(C=C2)N)C(=C1)C)C)=O Chemical compound NC1=CC=C(C=C1)NC(C1=C(C(=C(C(=O)NC2=CC=C(C=C2)N)C(=C1F)F)F)F)=O.NC1=CC=C(C=C1)NC(C1=C(C=C(C(=O)NC2=CC=C(C=C2)N)C(=C1)C)C)=O CDNRWDQZVLZMCQ-UHFFFAOYSA-N 0.000 description 1
- RVISPXAQHCEOEY-UHFFFAOYSA-N NC1=CC=C(NC2=NC(=NC(=N2)NC2=CC=C(C=C2)N)NCC)C=C1.NC1=CC=C(NC2=NC(=NC(=N2)NC2=CC=C(C=C2)N)NC)C=C1 Chemical compound NC1=CC=C(NC2=NC(=NC(=N2)NC2=CC=C(C=C2)N)NCC)C=C1.NC1=CC=C(NC2=NC(=NC(=N2)NC2=CC=C(C=C2)N)NC)C=C1 RVISPXAQHCEOEY-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001334 alicyclic compounds Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000000010 aprotic solvent Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- BKDVBBSUAGJUBA-UHFFFAOYSA-N bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic acid Chemical compound C1=CC2C(C(O)=O)C(C(=O)O)C1C(C(O)=O)C2C(O)=O BKDVBBSUAGJUBA-UHFFFAOYSA-N 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 125000002529 biphenylenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C12)* 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 150000001718 carbodiimides Chemical class 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000012320 chlorinating reagent Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- YCXVDEMHEKQQCI-UHFFFAOYSA-N chloro-dimethyl-propan-2-ylsilane Chemical compound CC(C)[Si](C)(C)Cl YCXVDEMHEKQQCI-UHFFFAOYSA-N 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000009918 complex formation Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- CURBACXRQKTCKZ-UHFFFAOYSA-N cyclobutane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1C(C(O)=O)C(C(O)=O)C1C(O)=O CURBACXRQKTCKZ-UHFFFAOYSA-N 0.000 description 1
- YMHQVDAATAEZLO-UHFFFAOYSA-N cyclohexane-1,1-diamine Chemical compound NC1(N)CCCCC1 YMHQVDAATAEZLO-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 description 1
- WVIIMZNLDWSIRH-UHFFFAOYSA-N cyclohexylcyclohexane Chemical compound C1CCCCC1C1CCCCC1 WVIIMZNLDWSIRH-UHFFFAOYSA-N 0.000 description 1
- HRYUOPWKEXOLLL-UHFFFAOYSA-N dec-3-ene-1,2,7,8-tetracarboxylic acid Chemical compound CCC(C(O)=O)C(C(O)=O)CCC=CC(C(O)=O)CC(O)=O HRYUOPWKEXOLLL-UHFFFAOYSA-N 0.000 description 1
- GUIAWEJKSYXUFP-UHFFFAOYSA-N decane-2,3,6,7-tetracarboxylic acid Chemical compound CCC(C(CCC(C(CC)C(=O)O)C(=O)O)C(=O)O)C(=O)O GUIAWEJKSYXUFP-UHFFFAOYSA-N 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004811 liquid chromatography Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000013615 primer Substances 0.000 description 1
- 239000002987 primer (paints) Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 125000006160 pyromellitic dianhydride group Chemical class 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 238000001226 reprecipitation Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000006884 silylation reaction Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 125000004665 trialkylsilyl group Chemical group 0.000 description 1
- 150000003628 tricarboxylic acids Chemical class 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/30—Processes for applying liquids or other fluent materials performed by gravity only, i.e. flow coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0406—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being air
- B05D3/0413—Heating with air
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
- C08G73/0644—Poly(1,3,5)triazines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
- C08G73/1078—Partially aromatic polyimides wholly aromatic in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1085—Polyimides with diamino moieties or tetracarboxylic segments containing heterocyclic moieties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/14—Polyamide-imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03926—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M14/00—Electrochemical current or voltage generators not provided for in groups H01M6/00 - H01M12/00; Manufacture thereof
- H01M14/005—Photoelectrochemical storage cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
- B29K2079/08—PI, i.e. polyimides or derivatives thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0012—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0012—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
- B29K2995/0016—Non-flammable or resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
- B29K2995/0026—Transparent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0037—Other properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0037—Other properties
- B29K2995/0082—Flexural strength; Flexion stiffness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Photovoltaic Devices (AREA)
- Hybrid Cells (AREA)
Abstract
Description
1. 下記化学式(1)で表される繰り返し単位を含むことを特徴とするポリイミド前駆体。
5. ジアミン成分が、化学式(1)で表される繰り返し単位を与えるジアミン成分に加えて、p−フェニレンジアミン、ベンジジン、2,2’−ビス(トリフルオロメチル)ベンジジン、3,3’−ジメチルベンジジン、2,2’−ジメチルベンジジンまたはトランス−シクロヘキサンジアミンのいずれか1種以上を30モル%以下で含むことを特徴とする前記項4に記載のポリイミド前駆体。
6. ポリイミド前駆体の対数粘度(温度:30℃、濃度:0.5g/dL、溶媒:N,N−ジメチルアセトアミド)が0.2dL/g以上であることを特徴とする前記項1〜5のいずれかに記載のポリイミド前駆体。
7. 純度(複数の立体異性体を含む場合は、それらを区別せず同一成分と見なした場合の純度)が99%以上のテトラカルボン酸成分と、純度が99%以上のジアミン成分とから得られることを特徴とする前記項1〜6のいずれかに記載のポリイミド前駆体。
8. 光透過率が70%以上のテトラカルボン酸成分(但し、テトラカルボン酸成分の光透過率は、2規定水酸化ナトリウム溶液に10質量%の濃度に溶解して得られた溶液に対する波長400nm、光路長1cmの透過率を表す。)と、光透過率が30%以上のジアミン成分(但し、ジアミン成分の光透過率は、メタノール、水、N,N−ジメチルアセトアミド、酢酸もしくはこれらの塩酸溶液に、8質量%の濃度に溶解して得られた溶液に対する波長400nm、光路長1cmの透過率を表す。)とから得られることを特徴とする前記項1〜7のいずれかに記載のポリイミド前駆体。
9. N,N−ジメチルホルムアミド、N,N−ジメチルアセトアミド、N−メチル−2−ピロリドン、N−エチル−2−ピロリドン、1,3−ジメチル−2−イミダゾリジノン、ジメチルスルホオキシド、水より選ばれる溶媒に10質量%の濃度に溶解して得られた溶液に対する波長400nm、光路長1cmの光透過率が40%以上であることを特徴とする前記項1〜8のいずれかに記載のポリイミド前駆体。
前記溶媒の波長400nm、光路長1cmの光透過率が89%以上であることを特徴とするポリイミド前駆体溶液組成物。
12. 厚さ10μmのフィルムでの全光透過率(波長380nm〜780nmの平均光透過率)が70%以上、好ましくは80%以上、より好ましくは85%以上であることを特徴とする前記項11に記載のポリイミド。
13. 厚さ10μmのフィルムでの波長400nmの光透過率が50%以上、好ましくは60%以上、より好ましくは70%以上、特に好ましくは75%以上であることを特徴とする前記項11または12に記載のポリイミド。
14. 厚さ10μmのフィルムでの50〜200℃における平均線膨張係数が50ppm/K以下、好ましくは45ppm/K以下、より好ましくは40ppm/K以下、特に好ましくは20ppm/K以下であることを特徴とする前記項11〜13のいずれかに記載のポリイミド。
1R,2S,4S,5R−シクロヘキサンテトラカルボン酸(以下PMTA−HSと略すことがあり、更にその酸二無水物をPMDA−HSと略すことがある。)、
1S,2S,4R,5R−シクロヘキサンテトラカルボン酸(以下PMTA−HHと略すことがあり、更にその酸二無水物をPMDA−HHと略すことがある。)、
(1R,1’S,3R,3’S,4R,4’S)ジシクロヘキシル−3,3’,4,4’−テトラカルボン酸(以下trans−DCTAと略すことがあり、更にその酸二無水物をtrans−DCDAと略すことがある。)、
(1R,1’S,3R,3’S,4S,4’R)ジシクロヘキシル−3,3’,4,4’−テトラカルボン酸(以下cis−DCTAと略すことがあり、更にその酸二無水物をcis−DCDAと略すことがある。)
が好ましく、PMTA−HS、trans−DCTA、cis−DCTAは、酸二無水物とした場合の反応性に優れるため、より好ましい。
1rC7−ビシクロ[2.2.2]オクタン−2t,3t,5c,6c−テトラカルボン酸(以下cis/trans−BTTA−Hと略すことがあり、更にその無水物をcis/trans−BTA−Hと略すことがある。)
1rC7−ビシクロ[2.2.2]オクタン−2c,3c,5c,6c−テトラカルボン酸(以下cis/cis−BTTA−Hと略すことがあり、更にその酸二無水物をcis/cis−BTA−Hと略すことがある。)
(4arH,8acH)−デカヒドロ−1t,4t:5c,8c−ジメタノナフタレン−2t,3t,6c,7c−テトラカルボン酸(以下DNTAxxと略すことがあり、更にその酸二無水物をDNDAxxと略すことがある。)
(4arH,8acH)−デカヒドロ−1t,4t:5c,8c−ジメタノナフタレン−2c,3c,6c,7c−テトラカルボン酸(以下DNTAdxと略すことがあり、更にその酸二無水物をDNDAdxと略すことがある。)
が好ましい。
本発明のポリイミド前駆体は、溶媒中でテトラカルボン酸成分(好ましくはテトラカルボン酸二無水物)とジアミン成分とを略等モル、好ましくはテトラカルボン酸成分に対するジアミン成分のモル比[ジアミン成分のモル数/テトラカルボン酸成分のモル数]が好ましくは0.90〜1.10、より好ましくは0.95〜1.05の割合で、例えば120℃以下の比較的低温度でイミド化を抑制しながら反応することによって、ポリイミド前駆体溶液組成物として好適に得ることができる。
テトラカルボン酸二無水物を任意のアルコールと反応させ、ジエステルジカルボン酸を得た後、塩素化試薬(チオニルクロライド、オキサリルクロライドなど)と反応させ、ジエステルジカルボン酸クロライドを得る。このジエステルジカルボン酸クロライドとジアミンを−20〜120℃、好ましくは−5〜80℃の範囲で1〜72時間攪拌することで、ポリイミド前駆体が得られる。80℃以上で反応させる場合、分子量が重合時の温度履歴に依存して変動し、また熱によりイミド化が進行することから、ポリイミド前駆体を安定して製造できなくなる可能性がある。また、ジエステルジカルボン酸とジアミンを、リン系縮合剤や、カルボジイミド縮合剤などを用いて脱水縮合することでも、簡便にポリイミド前駆体が得られる。
あらかじめ、ジアミンとシリル化剤を反応させ、シリル化されたジアミンを得る。必要に応じて、蒸留等により、シリル化されたジアミンの精製を行う。そして、脱水された溶媒中にシリル化されたジアミンを溶解させておき、攪拌しながら、テトラカルボン酸二無水物を徐々に添加し、0〜120℃、好ましくは5〜80℃の範囲で1〜72時間攪拌することで、ポリイミド前駆体が得られる。80℃以上で反応させる場合、分子量が重合時の温度履歴に依存して変動し、また熱によりイミド化が進行することから、ポリイミド前駆体を安定して製造できなくなる可能性がある。
(b)使用される溶媒として、窒素中で3時間加熱還流した後の光路長1cm、波長400nmにおける光透過率が20%以上、より好ましくは40%以上、特に好ましくは80%以上である溶媒
(c)使用される溶媒として、ガスクロマトグラフィー分析より求められた純度が99.8%以上、より好ましくは99.9%以上、さらに好ましくは99.99%以上である溶媒
(d)使用される溶媒として、ガスクロマトグラフィー分析で求められる主成分ピークの保持時間に対し、長時間側に現れる不純物ピークの総量が、0.2%未満、より好ましくは0.1%以下、特に好ましくは0.05%以下である溶媒
(e)使用される溶媒の250℃での不揮発成分の量が0.1%以下、より好ましくは0.05%以下、特に好ましくは0.01%以下であること
(f)使用される溶媒の金属成分(例えば、Li,Na,Mg,Ca,Al,K,Ca,Ti,Cr,Mn,Fe,Co,Ni,Cu,Zn,Mo,Cd)の含有率が、10ppm以下、より好ましくは1ppm以下、特に好ましくは500ppb以下、より特に好ましくは300ppb以下であること
[光透過率]
テトラカルボン酸成分では、所定量のテトラカルボン酸成分を溶媒(2N水酸化ナトリウム水溶液)に溶解し、10質量%溶液を得た。ジアミン成分では、所定量のジアミン成分を溶媒(メタノール)に溶解し、8質量%溶液を得た。調製した溶液を用い、大塚電子製MCPD−300、光路長1cmの標準セルを用いて、溶媒をブランクとし、テトラカルボン酸成分、ジアミン成分の波長400nmにおける光透過率を測定した。
[GC分析:溶媒の純度]
島津製作所製GC−2010を用い、以下の条件で測定した。純度(GC)はピーク面積分率より求めた。
カラム: J&W社製DB−FFAP 0.53mmID×30m
カラム温度: 40℃(5分保持)+40℃〜250℃(10℃/分)+250℃(9分保持)
注入口温度: 240℃
検出器温度: 260℃
キャリアガス: ヘリウム 10ml/分
注入量: 1μL
ガラス製容器に溶媒5gを秤量し、250℃の熱風循環オーブン中で30分加熱した。室温に冷却し、その残分を秤量した。その質量より、溶媒の不揮発分(質量%)を求めた。
大塚電子製MCPD−300、光路長1cmの石英標準セルを用いて、超純水をブランクとして、溶媒の波長400nmにおける光透過率を測定した。
パーキン・エルマー製ElanDRC II 誘導結合プラズマ質量分析(ICP−MS)を用い、溶媒に含まれる金属成分を定量した。
[固形分濃度]
アルミシャーレにポリイミド前駆体組成物1gを量り取り、200℃の熱風循環オーブン中で2時間加熱して固形分以外を除去し、その残分の質量より固形分濃度(質量%)を求めた。
東機産業製TV−22 E型回転粘度計を用い、温度25℃、せん断速度20sec−1でのポリイミド前駆体溶液の粘度を求めた。
濃度0.5g/dLのポリイミド前駆体のN,N−ジメチルアセトアミド溶液を、ウベローデ粘度計を用いて、30℃で測定し、対数粘度を求めた。
10質量%のポリイミド前駆体溶液となる様に、ポリイミド前駆体をN,N−ジメチルアセトアミドで希釈した。調製した溶液を用い、大塚電子製MCPD−300、光路長1cmの標準セルを用いて、N,N−ジメチルアセトアミドをブランクとし、10質量%のポリイミド前駆体溶液の波長400nmにおける光透過率を測定した。
[400nm光透過率、全光透過率]
大塚電子製MCPD−300を用いて、膜厚10μmのポリイミド膜の400nmにおける光透過率と、全光透過率(380nm〜780nmにおける平均透過率)を測定した。
膜厚10μmのポリイミドフィルムをIEC450規格のダンベル形状に打ち抜いて試験片とし、ORIENTEC社製TENSILONを用いて、チャック間長30mm、引張速度2mm/minで、初期の弾性率、破断伸度を測定した。
膜厚約10μmのポリイミドフィルムを幅4mmの短冊状に切り取って試験片とし、島津製作所製TMA−50を用い、チャック間長15mm、荷重2g、昇温速度20℃/minで300℃まで昇温した。得られたTMA曲線から、50℃から200℃までの平均線膨張係数を求めた。
膜厚約10μmのポリイミドフィルムを幅4mmの短冊状に切り取って試験片とし、温度25℃、湿度50%RHの条件下、曲率半径1mmで折り曲げた。その後の試験片を目視で確認し、異常がないものを○、クラックが生じたものを×で示した。
膜厚約10μmのポリイミド膜を温度25℃の条件下、N,N−ジメチルアセトアミドに1時間浸漬した後、膜の状態を目視で確認した。異常がないものを○、しわや一部形状が変化したものを△、溶解したり、顕著に形状が変化したものを×で示した。
膜厚10μmのポリイミドフィルムを試験片とし、エスアイアイ・ナノテクノロジー製 示差熱熱重量同時測定装置(TG/DTA6300)を用い、窒素気流中、昇温速度10℃/minで25℃から600℃まで昇温した。得られた重量曲線から、5%重量減少温度を求めた。
膜厚約30μmのポリイミドフィルムを試験片とし、東洋精機製作所製 キャンドル燃焼試験機D型を用い、JIS K7201に準拠した方法(試験片形状:V型 140mm×52mm×約30μm)で求めた。
DABAN: 4,4’−ジアミノベンズアニリド〔純度:99.90%(GC分析)〕
4−APTP: N,N’−ビス(4−アミノフェニル)テレフタルアミド〔純度:99.95%(GC分析)〕
ODA: 4,4’−オキシジアニリン〔純度:99.9%(GC分析)〕
PPD: p−フェニレンジアミン〔純度:99.9%(GC分析)〕
TFMB: 2,2’−ビス(トリフルオロメチル)ベンジジン〔純度:99.83%(GC分析)〕
BABA: N,N’−p−フェニレンビス(p−アミノベンズアミド)〔純度:99%(LC分析)〕
AZDA: 2,4−ビス(4−アミノアニリノ)−6−アニリノ−1,3,5−トリアジン〔純度:99.9%(GC分析)〕
[テトラカルボン酸成分]
PMDA−HS: 1R,2S,4S,5R−シクロヘキサンテトラカルボン酸二無水物〔PMDA−HSとしての純度:92.7%(GC分析),水素化ピロメリット酸二無水物(立体異性体の混合物)としての純度:99.9%(GC分析)〕
BPDA−H: 3,3’,4,4’−ビシクロヘキシルテトラカルボン酸二無水物(立体異性体の混合物)〔純度:99.9%(GC分析)〕
cis/cis−BTA−H: 1rC7−ビシクロ[2.2.2]オクタン−2c,3c,5c,6c−テトラカルボン酸−2,3:5,6−二無水物〔cis/cis−BTA−Hとしての純度:99.9%(GC分析)〕
DNDAxx:(4arH,8acH)−デカヒドロ−1t,4t:5c,8c−ジメタノナフタレン−2t,3t,6c,7c−テトラカルボン酸二無水物〔DNDAxxとしての純度:99.2%(GC分析)〕
DNDAdx:(4arH,8acH)−デカヒドロ−1t,4t:5c,8c−ジメタノナフタレン−2c,3c,6c,7c−テトラカルボン酸二無水物〔DNDAdxとしての純度:99.7%(GC分析)〕
[ジアミン、酸二無水物溶液の透過率]
BSA: N,O−ビス(トリメチルシリル)アセトアミド
[溶媒]
DMAc: N,N−ジメチルアセトアミド
[溶媒(N,N−ジメチルアセトアミド)の純度]
GC分析:
主成分の保持時間(min) 14.28
主成分の面積% 99.9929
短保持時間不純物のピーク面積% 0.0000
長保持時間不純物のピーク面積% 0.0071
不揮発分(質量%) <0.001
光透過率:
400nm光透過率(%) 92
還流後の400nm光透過率(%) 92
金属分:
Na(ppb) 150
Fe(ppb) <2
Cu(ppb) <2
Mo(ppb) <1
窒素ガスで置換した反応容器中にDABAN 2.27g(10ミリモル)を入れ、N,N−ジメチルアセトアミドを、仕込みモノマー総質量(ジアミン成分とカルボン酸成分の総和)が15質量%となる量の25.55gを加え、50℃で2時間攪拌した。この溶液にPMDA−HS 2.23g(10ミリモル)を徐々に加えた。50℃で6時間撹拌し、均一で粘稠なポリイミド前駆体溶液を得た。
ジアミン成分、カルボン酸成分を表4−1に記載した化学組成とし、溶媒のN,N−ジメチルアセトアミドは、それぞれ仕込みモノマー総質量(ジアミン成分とカルボン酸成分の総和)が、15質量%となる量を用いた以外は、実施例1と同様にして、ポリイミド前駆体溶液、ポリイミドフィルムを得た。
窒素ガスで置換した反応容器中にDABAN 2.27g(10ミリモル)を入れ、N,N−ジメチルアセトアミドを、仕込みモノマー総質量(ジアミン成分とカルボン酸成分の総和)が20質量%となる量の21.16gを加え、50℃で2時間攪拌した。この溶液にDNDAxx 2.11g(7ミリモル)とDNDAdx 0.91g(3ミリモル)を徐々に加えた。50℃で6時間撹拌し、均一で粘稠なポリイミド前駆体溶液を得た。そして、実施例1と同様にしてフィルム化を行い、ポリイミドフィルムを得た。
窒素ガスで置換した反応容器中にDABAN 2.27g(10ミリモル)を入れ、N,N−ジメチルアセトアミドを、仕込みモノマー総質量(ジアミン成分とカルボン酸成分の総和)が20質量%となる量の21.16gを加え、50℃で2時間攪拌した。この溶液にDNDAxx 3.02g(10ミリモル)を徐々に加えた。50℃で6時間撹拌し、均一で粘稠なポリイミド前駆体溶液を得た。そして、実施例1と同様にしてフィルム化を行い、ポリイミドフィルムを得た。
窒素ガスで置換した反応容器中にDABAN 2.27g(10ミリモル)を入れ、N,N−ジメチルアセトアミドを、仕込みモノマー総質量(ジアミン成分とカルボン酸成分の総和)が20質量%となる量の18.06gを加え、室温で1時間攪拌した。この溶液にBSA 4.07g(20ミリモル)を加え、室温で3時間攪拌した。次いで、この溶液にPMDA−HS 2.24g(10ミリモル)を徐々に加えた。室温で6時間撹拌し、均一で粘稠なポリイミド前駆体溶液を得た。そして、実施例1と同様にしてフィルム化を行い、ポリイミドフィルムを得た。
窒素ガスで置換した反応容器中にDABAN 2.05g(9ミリモル)とPPD 0.11g(1ミリモル)を入れ、N,N−ジメチルアセトアミドを、仕込みモノマー総質量(ジアミン成分とカルボン酸成分の総和)が20質量%となる量の17.45gを加え、室温で1時間攪拌した。この溶液にPMDA−HS 2.24g(10ミリモル)を徐々に加えた。室温で6時間撹拌し、均一で粘稠なポリイミド前駆体溶液を得た。そして、実施例1と同様にしてフィルム化を行い、ポリイミドフィルムを得た。
窒素ガスで置換した反応容器中にDABAN 2.05g(9ミリモル)とTFMB 0.32g(1ミリモル)を入れ、N,N−ジメチルアセトアミドを、仕込みモノマー総質量(ジアミン成分とカルボン酸成分の総和)が20質量%となる量の18.04gを加え、室温で1時間攪拌した。この溶液にPMDA−HS 2.24g(10ミリモル)を徐々に加えた。室温で6時間撹拌し、均一で粘稠なポリイミド前駆体溶液を得た。そして、実施例1と同様にしてフィルム化を行い、ポリイミドフィルムを得た。
窒素ガスで置換した反応容器中に4−APTP 3.46g(10ミリモル)を入れ、N,N−ジメチルアセトアミドを、仕込みモノマー総質量(ジアミン成分とカルボン酸成分の総和)が20質量%となる量の25.29gを加え、50℃で2時間攪拌した。この溶液にDNDAxx 3.02g(10ミリモル)を徐々に加えた。50℃で6時間撹拌し、均一で粘稠なポリイミド前駆体溶液を得た。そして、実施例1と同様にしてフィルム化を行い、ポリイミドフィルムを得た。
窒素ガスで置換した反応容器中にDABAN 2.27g(10ミリモル)を入れ、N,N−ジメチルアセトアミドを、仕込みモノマー総質量(ジアミン成分とカルボン酸成分の総和)が20質量%となる量の21.16gを加え、50℃で2時間攪拌した。この溶液にDNDAxx 3.02g(10ミリモル)を徐々に加えた。50℃で6時間撹拌し、均一で粘稠なポリイミド前駆体溶液を得た。その溶液にBSA 4.07g(20ミリモル)を加え、12時間攪拌した。そして、実施例1と同様にしてフィルム化を行い、ポリイミドフィルムを得た。
窒素ガスで置換した反応容器中に4−APTP 3.46g(10ミリモル)を入れ、N,N−ジメチルアセトアミドを、仕込みモノマー総質量(ジアミン成分とカルボン酸成分の総和)が15質量%となる量の36.72gを加え、50℃で2時間攪拌した。この溶液にDNDAxx 3.02g(10ミリモル)を徐々に加えた。50℃で6時間撹拌し、均一で粘稠なポリイミド前駆体溶液を得た。その溶液にBSA 2.03g(10ミリモル)を加え、12時間攪拌した。そして、実施例1と同様にしてフィルム化を行い、ポリイミドフィルムを得た。
窒素ガスで置換した反応容器中にDABAN 1.59g(7ミリモル)とPPD 0.32g(3ミリモル)を入れ、N,N−ジメチルアセトアミドを、仕込みモノマー総質量(ジアミン成分とカルボン酸成分の総和)が20質量%となる量の19.85gを加え、室温で1時間攪拌した。この溶液にDNDAxx 3.02g(10ミリモル)を徐々に加えた。室温で6時間撹拌し、均一で粘稠なポリイミド前駆体溶液を得た。そして、実施例1と同様にしてフィルム化を行い、ポリイミドフィルムを得た。
窒素ガスで置換した反応容器中にDABAN 1.59g(7ミリモル)とTFMB 0.96g(3ミリモル)を入れ、N,N−ジメチルアセトアミドを、仕込みモノマー総質量(ジアミン成分とカルボン酸成分の総和)が20質量%となる量の22.59gを加え、室温で1時間攪拌した。この溶液にDNDAxx 3.02g(10ミリモル)を徐々に加えた。室温で6時間撹拌し、均一で粘稠なポリイミド前駆体溶液を得た。そして、実施例1と同様にしてフィルム化を行い、ポリイミドフィルムを得た。
窒素ガスで置換した反応容器中に4−APTP 2.42g(7ミリモル)とPPD 0.32g(3ミリモル)を入れ、N,N−ジメチルアセトアミドを、仕込みモノマー総質量(ジアミン成分とカルボン酸成分の総和)が20質量%となる量の21.79gを加え、室温で1時間攪拌した。この溶液にDNDAxx 3.02g(10ミリモル)を徐々に加えた。室温で6時間撹拌し、均一で粘稠なポリイミド前駆体溶液を得た。そして、実施例1と同様にしてフィルム化を行い、ポリイミドフィルムを得た。
窒素ガスで置換した反応容器中にDABAN 1.59g(7ミリモル)とPPD 0.32g(3ミリモル)を入れ、N,N−ジメチルアセトアミドを、仕込みモノマー総質量(ジアミン成分とカルボン酸成分の総和)が20質量%となる量の19.75gを加え、室温で1時間攪拌した。この溶液にDNDAxx 3.02g(10ミリモル)を徐々に加えた。室温で6時間撹拌し、均一で粘稠なポリイミド前駆体溶液を得た。その溶液にBSA 4.07g(20ミリモル)を加え、12時間攪拌した。そして、実施例1と同様にしてフィルム化を行い、ポリイミドフィルムを得た。
窒素ガスで置換した反応容器中にBABA 3.46g(10ミリモル)を入れ、N,N−ジメチルアセトアミドを、仕込みモノマー総質量(ジアミン成分とカルボン酸成分の総和)が20質量%となる量の25.94gを加え、室温で1時間攪拌した。この溶液にDNDAxx 3.02g(10ミリモル)を徐々に加えた。室温で6時間撹拌し、均一で粘稠なポリイミド前駆体溶液を得た。そして、実施例1と同様にしてフィルム化を行い、ポリイミドフィルムを得た。
ジアミン成分、カルボン酸成分を表4−2に記載した化学組成とし、溶媒のN,N−ジメチルアセトアミドは、それぞれ仕込みモノマー総質量(ジアミン成分とカルボン酸成分の総和)が、比較例1,2では15質量%となる量、比較例3,4では20質量%となる量を用いた以外は、実施例1と同様にして、ポリイミド前駆体溶液、ポリイミドフィルムを得た。
窒素ガスで置換した反応容器中にAZDA 3.84g(10ミリモル)を入れ、N,N−ジメチルアセトアミドを仕込みモノマー(ジアミン成分とカルボン酸成分の総和)が15質量%となる量の34.49gを加え、50℃で2時間攪拌した。
窒素ガスで置換した反応容器中にAZDA 3.84g(10ミリモル)を入れ、N,N−ジメチルアセトアミドを仕込みモノマー(ジアミン成分とカルボン酸成分の総和)が20質量%となる量の27.44gを加え、50℃で2時間攪拌した。
このポリイミド前駆体溶液、ポリイミドフィルムの特性を測定した結果を表5に示す。
窒素ガスで置換した反応容器中にAZDA 3.84g(10ミリモル)を入れ、N,N−ジメチルアセトアミドを仕込みモノマー(ジアミン成分とカルボン酸成分の総和)が20質量%となる量の27.44gを加え、50℃で2時間攪拌した。
窒素ガスで置換した反応容器中にODA 2.00g(10ミリモル)を入れ、N,N−ジメチルアセトアミドを仕込みモノマー(ジアミン成分とカルボン酸成分の総和)が20質量%となる量の16.98gを加え、50℃で2時間攪拌した。
窒素ガスで置換した反応容器中にODA 2.00g(10ミリモル)を入れ、N,N−ジメチルアセトアミドを仕込みモノマー(ジアミン成分とカルボン酸成分の総和)が20質量%となる量の20.08gを加え、50℃で2時間攪拌した。
窒素ガスで置換した反応容器中にODA 2.00g(10ミリモル)を入れ、N,N−ジメチルアセトアミドを仕込みモノマー(ジアミン成分とカルボン酸成分の総和)が20質量%となる量の20.08gを加え、50℃で2時間攪拌した。
Claims (12)
- Bが、下記化学式(4−1)〜(4−4)からなる群から選択される1種以上であることを特徴とする請求項1または2に記載のポリイミド前駆体。
- 全テトラカルボン酸成分100モル%中、化学式(1)で表される繰り返し単位を与えるテトラカルボン酸成分を70モル%以上、それ以外のテトラカルボン酸成分を30モル%以下で含むテトラカルボン酸成分と、全ジアミン成分100モル%中、化学式(1)で表される繰り返し単位を与えるジアミン成分を70モル%以上、それ以外のジアミン成分を30モル%以下で含むジアミン成分とから得られることを特徴とする請求項1〜3のいずれかに記載のポリイミド前駆体。
- 純度(複数の立体異性体を含む場合は、それらを区別せず同一成分と見なした場合の純度)が99%以上のテトラカルボン酸成分と、純度が99%以上のジアミン成分とから得られることを特徴とする請求項1〜4のいずれかに記載のポリイミド前駆体。
- 光透過率が70%以上のテトラカルボン酸成分(但し、テトラカルボン酸成分の光透過率は、2規定水酸化ナトリウム溶液に10質量%の濃度に溶解して得られた溶液に対する波長400nm、光路長1cmの透過率を表す。)と、光透過率が30%以上のジアミン成分(但し、ジアミン成分の光透過率は、メタノール、水、N,N−ジメチルアセトアミド、酢酸もしくはこれらの塩酸溶液に、8質量%の濃度に溶解して得られた溶液に対する波長400nm、光路長1cmの透過率を表す。)とから得られることを特徴とする請求項1〜5のいずれかに記載のポリイミド前駆体。
- N,N−ジメチルホルムアミド、N,N−ジメチルアセトアミド、N−メチル−2−ピロリドン、N−エチル−2−ピロリドン、1,3−ジメチル−2−イミダゾリジノン、ジメチルスルホオキシド及び水より選ばれる溶媒に10質量%の濃度に溶解して得られた溶液に対する波長400nm、光路長1cmの光透過率が40%以上であることを特徴とする請求項1〜6のいずれかに記載のポリイミド前駆体。
- 請求項1〜7のいずれかに記載のポリイミド前駆体が溶媒中に溶解しているポリイミド前駆体溶液組成物であって、
前記溶媒の波長400nm、光路長1cmの光透過率が89%以上であることを特徴とするポリイミド前駆体溶液組成物。 - 前記化学式(5)中のAは、脂肪族の4価の基であり、Bは、化学構造中に少なくとも一つの前記化学式(2)の化学構造を有する2価の基であって、酸素指数が22%(体積分率)以上であることを特徴とする請求項9に記載のポリイミド。
- 脂肪族テトラカルボン酸成分とジアミン成分とを反応して得られたポリイミドであって、酸素指数が22%(体積分率)以上であることを特徴とするポリイミド。
- 請求項8に記載のポリイミド前駆体溶液組成物を用いて得られたポリイミド、又は請求項9〜11のいずれかに記載のポリイミドによって形成されたことを特徴とするディスプレイ用、タッチパネル用、または太陽電池用の基板。
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011054845 | 2011-03-11 | ||
JP2011054845 | 2011-03-11 | ||
JP2011079396 | 2011-03-31 | ||
JP2011079396 | 2011-03-31 | ||
JP2012010540 | 2012-01-20 | ||
JP2012010529 | 2012-01-20 | ||
JP2012010540 | 2012-01-20 | ||
JP2012010529 | 2012-01-20 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013504724A Division JP5920337B2 (ja) | 2011-03-11 | 2012-03-12 | ポリイミド前駆体及びポリイミド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016164271A true JP2016164271A (ja) | 2016-09-08 |
JP6164331B2 JP6164331B2 (ja) | 2017-07-19 |
Family
ID=46830733
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013504724A Active JP5920337B2 (ja) | 2011-03-11 | 2012-03-12 | ポリイミド前駆体及びポリイミド |
JP2016076388A Active JP6164331B2 (ja) | 2011-03-11 | 2016-04-06 | ポリイミド前駆体及びポリイミド |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013504724A Active JP5920337B2 (ja) | 2011-03-11 | 2012-03-12 | ポリイミド前駆体及びポリイミド |
Country Status (6)
Country | Link |
---|---|
US (2) | US20140066571A1 (ja) |
JP (2) | JP5920337B2 (ja) |
KR (2) | KR101941413B1 (ja) |
CN (4) | CN103534294B (ja) |
TW (2) | TWI534177B (ja) |
WO (1) | WO2012124664A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020158744A (ja) * | 2019-03-19 | 2020-10-01 | 三菱ケミカル株式会社 | ポリイミド及びポリイミドフィルム |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103874723B (zh) * | 2011-08-12 | 2015-10-21 | 宇部兴产株式会社 | 聚酰亚胺前体,聚酰亚胺,聚酰亚胺膜,和用于制造其的三嗪化合物的制备方法 |
WO2013024849A1 (ja) * | 2011-08-18 | 2013-02-21 | 東レ株式会社 | ポリアミド酸樹脂組成物、ポリイミド樹脂組成物およびポリイミドオキサゾール樹脂組成物ならびにそれらを含有するフレキシブル基板 |
US9556312B2 (en) | 2012-05-14 | 2017-01-31 | National University Corporation Iwate University | Polyimide precursor, polyimide, polyimide film, polyimide metal laminate, and polyimide solution |
TWI612077B (zh) | 2012-09-10 | 2018-01-21 | 宇部興產股份有限公司 | 聚醯亞胺前驅體、聚醯亞胺、清漆、聚醯亞胺薄膜及基板 |
US20150284513A1 (en) * | 2012-09-10 | 2015-10-08 | Ube Industries, Ltd. | Polyimide precursor, polyimide, varnish, polyimide film, and substrate |
KR101579645B1 (ko) * | 2013-04-10 | 2015-12-22 | 코오롱인더스트리 주식회사 | 폴리이미드 커버기판 |
JP6350526B2 (ja) * | 2013-06-27 | 2018-07-04 | 宇部興産株式会社 | ポリイミド前駆体、及びポリイミド |
TWI473838B (zh) | 2013-11-13 | 2015-02-21 | 財團法人工業技術研究院 | 聚醯胺酸、聚亞醯胺、及石墨片的製作方法 |
WO2015080156A1 (ja) * | 2013-11-27 | 2015-06-04 | 宇部興産株式会社 | ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板 |
KR102410839B1 (ko) * | 2014-04-23 | 2022-06-21 | 에네오스 가부시키가이샤 | 테트라카르복실산 이무수물, 폴리아미드산, 폴리이미드 및 그들의 제조 방법, 및 폴리아미드산 용액 |
CN106463706B (zh) * | 2014-06-05 | 2019-06-18 | 宇部兴产株式会社 | 电极的制造方法 |
CN110684195B (zh) * | 2014-10-23 | 2022-09-27 | 宇部兴产株式会社 | 聚酰亚胺膜、聚酰亚胺前体和聚酰亚胺 |
JP2016121295A (ja) * | 2014-12-25 | 2016-07-07 | 富士ゼロックス株式会社 | ポリイミド前駆体組成物、ポリイミド成形体、及びポリイミド成形体の製造方法 |
EP3354676B1 (en) | 2015-09-25 | 2024-05-15 | Mitsubishi Gas Chemical Company, Inc. | Polyimide resin and polyimide film |
US10011903B2 (en) * | 2015-12-31 | 2018-07-03 | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude | Manganese-containing film forming compositions, their synthesis, and use in film deposition |
JP6768234B2 (ja) * | 2016-05-09 | 2020-10-14 | 三菱瓦斯化学株式会社 | ポリイミド及びポリイミドフィルム |
KR102347037B1 (ko) | 2016-05-31 | 2022-01-05 | 우베 고산 가부시키가이샤 | 폴리이미드 전구체, 폴리이미드, 폴리이미드 필름 및 기판, 그리고 폴리이미드의 제조에 사용되는 테트라카르복실산 이무수물 |
US10370495B2 (en) * | 2016-08-11 | 2019-08-06 | Sk Innovation Co., Ltd. | Polyamic acid resin, polyamideimide film, and method for preparing the same |
CN106589415B (zh) * | 2016-11-21 | 2019-03-08 | 无锡高拓新材料股份有限公司 | 一种聚酰胺酸溶液的制备方法 |
JP7011231B2 (ja) * | 2016-11-24 | 2022-01-26 | 日産化学株式会社 | フレキシブルデバイス基板形成用組成物 |
TWI788364B (zh) | 2017-06-23 | 2023-01-01 | 美商陶氏科技投資有限公司 | 氫甲醯化反應製程 |
JP2019012165A (ja) * | 2017-06-30 | 2019-01-24 | 大日本印刷株式会社 | 表示装置用部材 |
JP2019151719A (ja) * | 2018-03-02 | 2019-09-12 | 三菱ケミカル株式会社 | ポリイミドフィルム、その製造方法および光硬化樹脂層付きポリイミドフィルム |
TWI661022B (zh) * | 2018-05-30 | 2019-06-01 | 律勝科技股份有限公司 | 接著劑組成物及其接著劑與硬化物 |
CN108753244A (zh) * | 2018-06-27 | 2018-11-06 | 中国地质大学(北京) | 一种高固体含量聚酰亚胺涂层胶及其制备方法和用途 |
KR102505739B1 (ko) * | 2018-09-27 | 2023-03-03 | 주식회사 엘지화학 | 이무수물 분석 방법 |
CN109627438A (zh) * | 2018-11-05 | 2019-04-16 | 广东丹邦科技有限公司 | 聚酰胺酸溶液的制备方法及透明聚酰亚胺薄膜的制备方法 |
KR102097431B1 (ko) * | 2019-05-13 | 2020-04-07 | 에스케이씨코오롱피아이 주식회사 | 폴리이미드 및 이의 제조 방법 |
JP7346146B2 (ja) | 2019-08-06 | 2023-09-19 | 三菱瓦斯化学株式会社 | ポリイミド及びポリイミドフィルム |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05313169A (ja) * | 1992-05-08 | 1993-11-26 | Fuji Photo Film Co Ltd | 液晶配向膜 |
WO2001002466A1 (fr) * | 1999-06-30 | 2001-01-11 | Nissan Chemical Industries, Ltd. | Derive diaminobenzene, polyimide obtenu a partir dudit derive, et film d'orientation pour cristaux liquides |
JP2010085615A (ja) * | 2008-09-30 | 2010-04-15 | Fujifilm Corp | 液晶表示装置用基板 |
JP2012098715A (ja) * | 2010-10-06 | 2012-05-24 | Hitachi Displays Ltd | 配向膜、配向膜形成用組成物、および液晶表示装置 |
WO2013024849A1 (ja) * | 2011-08-18 | 2013-02-21 | 東レ株式会社 | ポリアミド酸樹脂組成物、ポリイミド樹脂組成物およびポリイミドオキサゾール樹脂組成物ならびにそれらを含有するフレキシブル基板 |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0723339B2 (ja) * | 1987-10-08 | 1995-03-15 | 日立化成工業株式会社 | 新規なジシクロヘキシル―3,4,3′,4′―テトラカルボン酸二無水物及びその製造法 |
JPH081497B2 (ja) * | 1988-02-23 | 1996-01-10 | 日産化学工業株式会社 | 液晶セル用配向処理剤 |
JPH0813886B2 (ja) * | 1988-03-01 | 1996-02-14 | 三菱化学株式会社 | アゾ基含有重合体の製造法 |
JPH05203952A (ja) | 1992-01-23 | 1993-08-13 | Japan Synthetic Rubber Co Ltd | 液晶配向剤 |
JP3138993B2 (ja) | 1992-07-30 | 2001-02-26 | ジェイエスアール株式会社 | 液晶配向剤および液晶表示素子 |
JPH06282071A (ja) | 1993-01-27 | 1994-10-07 | Japan Synthetic Rubber Co Ltd | 感放射線性樹脂組成物 |
JPH07304868A (ja) | 1994-05-09 | 1995-11-21 | Maruzen Petrochem Co Ltd | ポリイミド |
US6497969B2 (en) * | 1997-09-05 | 2002-12-24 | Nessdisplay Co., Ltd. | Electroluminescent device having an organic layer including polyimide |
JP2000289167A (ja) * | 1999-02-03 | 2000-10-17 | Ube Ind Ltd | 化学メッキ用ベ−スフィルム及びメッキフィルム |
JP2001072770A (ja) * | 1999-06-30 | 2001-03-21 | Nissan Chem Ind Ltd | ジアミノベンゼン誘導体及びそれを用いたポリイミド並びに液晶配向膜 |
JP4665331B2 (ja) * | 2000-04-07 | 2011-04-06 | チッソ株式会社 | 新規なジアミノ化合物、該ジアミノ化合物を用いて合成された重合体、並びに該重合体を用いたワニス、配向膜及び液晶表示素子 |
JP2002114907A (ja) | 2000-08-04 | 2002-04-16 | Toray Ind Inc | 熱硬化性樹脂溶液組成物、その製造方法およびカラーフィルターならびに液晶表示装置 |
JP2002069179A (ja) | 2000-08-29 | 2002-03-08 | Ube Ind Ltd | 可溶性、透明なポリイミドおよびその製造法 |
JP2002146021A (ja) | 2000-11-10 | 2002-05-22 | Ube Ind Ltd | 可溶性、透明なポリイミドおよびその製造法 |
JP2003168800A (ja) | 2001-11-30 | 2003-06-13 | Mitsubishi Gas Chem Co Inc | 薄膜トランジスタ基板 |
US6962756B2 (en) | 2001-11-02 | 2005-11-08 | Mitsubishi Gas Chemical Company, Inc. | Transparent electrically-conductive film and its use |
US7687113B2 (en) * | 2004-09-10 | 2010-03-30 | Ube Industries, Inc. | Modified polyimide resin and curable resin composition |
JP2007002023A (ja) | 2005-06-21 | 2007-01-11 | Fujifilm Holdings Corp | フィルムおよび画像表示装置 |
CN101674923B (zh) * | 2007-05-24 | 2013-01-09 | 三菱瓦斯化学株式会社 | 无色透明树脂薄膜的制备方法及制备装置 |
JP5407261B2 (ja) * | 2007-12-11 | 2014-02-05 | Jnc株式会社 | 液晶配向剤、液晶配向膜および液晶表示素子 |
JP2009167235A (ja) * | 2008-01-11 | 2009-07-30 | Ube Ind Ltd | ポリイミドフィルムの製造方法 |
US8796411B2 (en) | 2008-02-25 | 2014-08-05 | Hitachi Chemical Dupont Microsystems, Ltd. | Polyimide precursor composition, polyimide film, and transparent flexible film |
JP2009263654A (ja) | 2008-03-31 | 2009-11-12 | Jsr Corp | ポリイミド、ポリイミドフィルム、及びそれらの製造方法 |
JP5050269B2 (ja) * | 2008-04-28 | 2012-10-17 | 独立行政法人 宇宙航空研究開発機構 | 末端変性イミドオリゴマーおよびワニス並びにその高弾性率硬化物 |
JP5325460B2 (ja) | 2008-05-27 | 2013-10-23 | 和光純薬工業株式会社 | 新規な(1r,2s,4s,5r)‐シクロヘキサンテトラカルボン酸二無水物及びその利用 |
JP5168009B2 (ja) * | 2008-07-28 | 2013-03-21 | 宇部興産株式会社 | ポリイミドおよびその製造法 |
JP2010150379A (ja) | 2008-12-25 | 2010-07-08 | Jsr Corp | ポリイミド系材料、フィルム及び組成物、並びにその製造方法 |
JP2010267691A (ja) * | 2009-05-13 | 2010-11-25 | Ube Ind Ltd | メタライジング用ポリイミドフィルムおよび金属積層ポリイミドフィルム |
JP5564684B2 (ja) * | 2009-07-14 | 2014-07-30 | 国立大学法人岩手大学 | 芳香族ジアミン及びその製造方法並びに樹脂 |
CN101831175A (zh) * | 2010-04-01 | 2010-09-15 | 辽宁科技大学 | 一种无色透明的聚酰亚胺纳米复合材料膜及其制备方法 |
JP2011257731A (ja) * | 2010-05-10 | 2011-12-22 | Jnc Corp | ジアミン、液晶配向剤および液晶表示素子 |
-
2012
- 2012-03-12 TW TW101108335A patent/TWI534177B/zh active
- 2012-03-12 CN CN201280022772.4A patent/CN103534294B/zh active Active
- 2012-03-12 WO PCT/JP2012/056310 patent/WO2012124664A1/ja active Application Filing
- 2012-03-12 US US14/004,362 patent/US20140066571A1/en not_active Abandoned
- 2012-03-12 CN CN201510532821.4A patent/CN105254885A/zh active Pending
- 2012-03-12 CN CN201510532464.1A patent/CN105254884B/zh active Active
- 2012-03-12 TW TW105108915A patent/TWI563017B/zh active
- 2012-03-12 CN CN201510532461.8A patent/CN105254883B/zh active Active
- 2012-03-12 KR KR1020187003440A patent/KR101941413B1/ko active IP Right Grant
- 2012-03-12 JP JP2013504724A patent/JP5920337B2/ja active Active
- 2012-03-12 KR KR1020137026687A patent/KR101850174B1/ko active IP Right Grant
-
2015
- 2015-08-07 US US14/821,380 patent/US9758623B2/en active Active
-
2016
- 2016-04-06 JP JP2016076388A patent/JP6164331B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05313169A (ja) * | 1992-05-08 | 1993-11-26 | Fuji Photo Film Co Ltd | 液晶配向膜 |
WO2001002466A1 (fr) * | 1999-06-30 | 2001-01-11 | Nissan Chemical Industries, Ltd. | Derive diaminobenzene, polyimide obtenu a partir dudit derive, et film d'orientation pour cristaux liquides |
JP2010085615A (ja) * | 2008-09-30 | 2010-04-15 | Fujifilm Corp | 液晶表示装置用基板 |
JP2012098715A (ja) * | 2010-10-06 | 2012-05-24 | Hitachi Displays Ltd | 配向膜、配向膜形成用組成物、および液晶表示装置 |
WO2013024849A1 (ja) * | 2011-08-18 | 2013-02-21 | 東レ株式会社 | ポリアミド酸樹脂組成物、ポリイミド樹脂組成物およびポリイミドオキサゾール樹脂組成物ならびにそれらを含有するフレキシブル基板 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020158744A (ja) * | 2019-03-19 | 2020-10-01 | 三菱ケミカル株式会社 | ポリイミド及びポリイミドフィルム |
Also Published As
Publication number | Publication date |
---|---|
TWI563017B (en) | 2016-12-21 |
KR20180017212A (ko) | 2018-02-20 |
CN105254885A (zh) | 2016-01-20 |
CN105254884B (zh) | 2018-05-29 |
TWI534177B (zh) | 2016-05-21 |
KR101941413B1 (ko) | 2019-01-22 |
KR20140016322A (ko) | 2014-02-07 |
CN103534294B (zh) | 2015-09-30 |
US20140066571A1 (en) | 2014-03-06 |
CN105254883B (zh) | 2018-02-02 |
CN105254884A (zh) | 2016-01-20 |
KR101850174B1 (ko) | 2018-04-18 |
JP5920337B2 (ja) | 2016-05-18 |
US9758623B2 (en) | 2017-09-12 |
WO2012124664A1 (ja) | 2012-09-20 |
CN103534294A (zh) | 2014-01-22 |
JP6164331B2 (ja) | 2017-07-19 |
US20160032056A1 (en) | 2016-02-04 |
TW201300440A (zh) | 2013-01-01 |
TW201623373A (zh) | 2016-07-01 |
CN105254883A (zh) | 2016-01-20 |
JPWO2012124664A1 (ja) | 2014-07-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6164331B2 (ja) | ポリイミド前駆体及びポリイミド | |
JP6531812B2 (ja) | ポリイミド前駆体及びポリイミド | |
JP6721070B2 (ja) | ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板 | |
JP6060695B2 (ja) | ポリイミド前駆体及びポリイミド | |
JP6283954B2 (ja) | ポリイミド前駆体、ポリイミド、ワニス、ポリイミドフィルム、及び基板 | |
JP5978288B2 (ja) | ポリイミド前駆体、ポリイミド、ポリイミドフィルム、ワニス、及び基板 | |
JP6607193B2 (ja) | ポリイミド前駆体、ポリイミド、及びポリイミドフィルム | |
JP6283953B2 (ja) | ポリイミド前駆体、ポリイミド、ワニス、ポリイミドフィルム、および基板 | |
WO2015053312A1 (ja) | ポリイミド前駆体、ポリイミド、ポリイミドフィルム、ワニス、及び基板 | |
JP6086139B2 (ja) | ポリイミド前駆体及びポリイミド | |
WO2015080139A1 (ja) | ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板 | |
JP5845918B2 (ja) | ポリイミド前駆体及びポリイミド | |
WO2015080156A1 (ja) | ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170207 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170407 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170523 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170605 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6164331 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R157 | Certificate of patent or utility model (correction) |
Free format text: JAPANESE INTERMEDIATE CODE: R157 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |