JP2014057056A - 半導体装置およびその作製方法 - Google Patents
半導体装置およびその作製方法 Download PDFInfo
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- JP2014057056A JP2014057056A JP2013165071A JP2013165071A JP2014057056A JP 2014057056 A JP2014057056 A JP 2014057056A JP 2013165071 A JP2013165071 A JP 2013165071A JP 2013165071 A JP2013165071 A JP 2013165071A JP 2014057056 A JP2014057056 A JP 2014057056A
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- oxide semiconductor
- layer
- semiconductor layer
- transistor
- oxide
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
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Abstract
【解決手段】酸化物半導体層を含むトランジスタにおいて、非晶質構造を有する第1の酸化物半導体層上に結晶構造を有する第2の酸化物半導体層を積層し、第2の酸化物半導体層上に第3の酸化物半導体層を少なくとも含む多層構造のトランジスタを提供する。結晶構造を有する第2の酸化物半導体層としては、インジウム亜鉛酸化物層を設け、トランジスタの主なキャリアパスとする。また、第1の酸化物半導体層及び第3の酸化物半導体層は、酸化物半導体積層に接する絶縁層との界面に形成される界面準位の影響が、トランジスタのキャリアパスへと及ぶことを抑制するためのバリア層、及び/又は、該絶縁層の構成元素が、第2の酸化物半導体層へ混入することを抑制するためのバリア層として機能する。
【選択図】図1
Description
本実施の形態では、本発明の一態様の半導体装置に含有される積層構造について、図1を用いて説明する。
本実施の形態では、実施の形態1に示した積層構造を有する半導体装置の一例として、トランジスタを例に説明する。
本実施の形態では、第2の酸化物半導体層、又は第2の酸化物半導体層及び第3の酸化物半導体層として適用可能な結晶構造を有する酸化物半導体層の一例として、CAAC−OS層について、詳細に説明する。
本発明の一態様に係る半導体装置の一例として、論理回路であるNOR型回路の回路図の一例を図6(A)に示す。図6(B)はNAND型回路の回路図である。
本実施の形態では、実施の形態2に示すトランジスタを使用し、電力が供給されない状況でも記憶内容の保持が可能で、かつ、書き込み回数にも制限が無い半導体装置(記憶装置)の一例を、図面を用いて説明する。
本実施の形態では、先の実施の形態で示した半導体装置を携帯電話、スマートフォン、電子書籍などの電子機器に応用した場合の例を図8乃至図11を用いて説明する。
10b スパッタ装置
10c スパッタ装置
11 基板供給室
12a ロードロック室
12b ロードロック室
13 搬送室
14 カセットポート
15 基板加熱室
16 基板加熱室
104 絶縁層
104a 絶縁層
104b 絶縁層
108 酸化物半導体積層
108a 第1の酸化物半導体層
108b 第2の酸化物半導体層
108c 第3の酸化物半導体層
112 絶縁層
112a 絶縁層
112b 絶縁層
250 メモリセル
251 メモリセルアレイ
251a メモリセルアレイ
251b メモリセルアレイ
253 周辺回路
254 容量素子
260 トランジスタ
262 トランジスタ
264 容量素子
310 トランジスタ
320 トランジスタ
330 トランジスタ
340 トランジスタ
350 トランジスタ
360 トランジスタ
370 トランジスタ
400 基板
402 ゲート電極層
404 絶縁層
404a 絶縁層
404b 絶縁層
408 酸化物半導体積層
408a 第1の酸化物半導体層
408b 第2の酸化物半導体層
408c 第3の酸化物半導体層
410a ソース電極層
410b ドレイン電極層
412 ゲート絶縁層
412a ゲート絶縁層
412b ゲート絶縁層
414 絶縁層
414a 絶縁層
414b 絶縁層
416 ゲート電極層
520 トランジスタ
801 トランジスタ
802 トランジスタ
803 トランジスタ
804 トランジスタ
811 トランジスタ
812 トランジスタ
813 トランジスタ
814 トランジスタ
901 RF回路
902 アナログベースバンド回路
903 デジタルベースバンド回路
904 バッテリー
905 電源回路
906 アプリケーションプロセッサ
907 CPU
908 DSP
910 フラッシュメモリ
911 ディスプレイコントローラ
912 メモリ回路
913 ディスプレイ
914 表示部
915 ソースドライバ
916 ゲートドライバ
917 音声回路
918 キーボード
919 タッチセンサ
950 メモリ回路
951 メモリコントローラ
952 メモリ
953 メモリ
954 スイッチ
955 スイッチ
956 ディスプレイコントローラ
957 ディスプレイ
1001 バッテリー
1002 電源回路
1003 マイクロプロセッサ
1004 フラッシュメモリ
1005 音声回路
1006 キーボード
1007 メモリ回路
1008 タッチパネル
1009 ディスプレイ
1010 ディスプレイコントローラ
9033 留め具
9034 スイッチ
9035 電源スイッチ
9036 スイッチ
9038 操作スイッチ
9630 筐体
9631a 表示部
9631b 表示部
9632a 領域
9632b 領域
9633 太陽電池
9634 充放電制御回路
9635 バッテリー
9636 DCDCコンバータ
9638 操作キー
9639 ボタン
Claims (5)
- 酸化物半導体積層と、
前記酸化物半導体積層と重畳するゲート電極層と、
前記酸化物半導体積層と前記ゲート電極層との間のゲート絶縁層と、
前記酸化物半導体積層と電気的に接続するソース電極層及びドレイン電極層と、を有し、
前記酸化物半導体積層は、少なくとも、非晶質構造を有する第1の酸化物半導体層と、前記第1の酸化物半導体層上の結晶構造を有する第2の酸化物半導体層と、前記第2の酸化物半導体層上の第3の酸化物半導体層と、を含み、
前記第1の酸化物半導体層及び前記第3の酸化物半導体層として、InMXZnYOZ(X≧1、Y>1、Z>0、Mは、Ga、Mg、Hf、Al、Sn、Zr、La、Ce、Pr、Nd、Sm、Eu、Gd、Tb、Dy、Ho、Er、Tm、Yb、Luから選択された一又は複数の金属元素)で表記される層をそれぞれ含み、
前記第2の酸化物半導体層として、インジウム亜鉛酸化物層を含む半導体装置。 - 酸化物半導体積層と、
前記酸化物半導体積層と重畳するゲート電極層と、
前記酸化物半導体積層と前記ゲート電極層との間のゲート絶縁層と、
前記酸化物半導体積層と電気的に接続するソース電極層及びドレイン電極層と、を有し、
前記酸化物半導体積層は、少なくとも非晶質構造を有する第1の酸化物半導体層と、前記第1の酸化物半導体層上の結晶構造を有する第2の酸化物半導体層と、前記第2の酸化物半導体層上の非晶質構造を有する第3の酸化物半導体層と、を含み、
前記第1の酸化物半導体層及び前記第3の酸化物半導体層として、InMXZnYOZ(X≧1、Y>1、Z>0、Mは、Ga、Mg、Hf、Al、Sn、Zr、La、Ce、Pr、Nd、Sm、Eu、Gd、Tb、Dy、Ho、Er、Tm、Yb、Luから選択された一又は複数の金属元素)で表記される層をそれぞれ含み、
前記第2の酸化物半導体層として、インジウム亜鉛酸化物層を含む半導体装置。 - 酸化物半導体積層と、
前記酸化物半導体積層と重畳するゲート電極層と、
前記酸化物半導体積層と前記ゲート電極層との間のゲート絶縁層と、
前記酸化物半導体積層と電気的に接続するソース電極層及びドレイン電極層と、を有し、
前記酸化物半導体積層は、少なくとも非晶質構造を有する第1の酸化物半導体層と、前記第1の酸化物半導体層上の結晶構造を有する第2の酸化物半導体層と、前記第2の酸化物半導体層上の結晶構造を有する第3の酸化物半導体層と、を含み、
前記第1の酸化物半導体層及び前記第3の酸化物半導体層として、InMXZnYOZ(X≧1、Y>1、Z>0、Mは、Ga、Mg、Hf、Al、Sn、Zr、La、Ce、Pr、Nd、Sm、Eu、Gd、Tb、Dy、Ho、Er、Tm、Yb、Luから選択された一又は複数の金属元素)で表記される層をそれぞれ含み、
前記第2の酸化物半導体層として、インジウム亜鉛酸化物層を含む半導体装置。 - 請求項1乃至3のいずれか一において、
前記第1の酸化物半導体層又は前記第3の酸化物半導体層に含まれるシリコンの濃度は、3×1018/cm3以下である半導体装置。 - 請求項1乃至4のいずれか一において、
前記第1の酸化物半導体層又は前記第3の酸化物半導体層に含まれる炭素の濃度は、3×1018/cm3以下である半導体装置。
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Families Citing this family (64)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2014046222A1 (en) | 2012-09-24 | 2014-03-27 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
KR102094568B1 (ko) | 2012-10-17 | 2020-03-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그의 제작 방법 |
KR102220279B1 (ko) | 2012-10-19 | 2021-02-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 산화물 반도체막을 포함하는 다층막 및 반도체 장치의 제작 방법 |
JP6204145B2 (ja) | 2012-10-23 | 2017-09-27 | 株式会社半導体エネルギー研究所 | 半導体装置 |
WO2014065343A1 (en) | 2012-10-24 | 2014-05-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
TWI605593B (zh) | 2012-11-15 | 2017-11-11 | 半導體能源研究所股份有限公司 | 半導體裝置 |
TWI624949B (zh) | 2012-11-30 | 2018-05-21 | 半導體能源研究所股份有限公司 | 半導體裝置 |
DE112013006219T5 (de) | 2012-12-25 | 2015-09-24 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung und deren Herstellungsverfahren |
KR102370239B1 (ko) | 2012-12-28 | 2022-03-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
US9190527B2 (en) | 2013-02-13 | 2015-11-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method of semiconductor device |
US9368636B2 (en) | 2013-04-01 | 2016-06-14 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a semiconductor device comprising a plurality of oxide semiconductor layers |
KR102264971B1 (ko) | 2013-05-20 | 2021-06-16 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
JP6400336B2 (ja) | 2013-06-05 | 2018-10-03 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US9312349B2 (en) | 2013-07-08 | 2016-04-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
JP6322503B2 (ja) | 2013-07-16 | 2018-05-09 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JP2015053477A (ja) | 2013-08-05 | 2015-03-19 | 株式会社半導体エネルギー研究所 | 半導体装置および半導体装置の作製方法 |
JP6401977B2 (ja) | 2013-09-06 | 2018-10-10 | 株式会社半導体エネルギー研究所 | 半導体装置 |
TWI646690B (zh) | 2013-09-13 | 2019-01-01 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
US9716003B2 (en) | 2013-09-13 | 2017-07-25 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
JP6386323B2 (ja) * | 2013-10-04 | 2018-09-05 | 株式会社半導体エネルギー研究所 | 半導体装置 |
KR102258374B1 (ko) * | 2013-10-18 | 2021-06-01 | 삼성디스플레이 주식회사 | 박막 트랜지스터, 이를 포함하는 표시 패널 및 이의 제조 방법 |
KR20220047897A (ko) * | 2013-12-02 | 2022-04-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
TWI721409B (zh) | 2013-12-19 | 2021-03-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
KR102306200B1 (ko) * | 2014-01-24 | 2021-09-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
US9653487B2 (en) | 2014-02-05 | 2017-05-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, manufacturing method thereof, module, and electronic device |
TWI663726B (zh) | 2014-05-30 | 2019-06-21 | Semiconductor Energy Laboratory Co., Ltd. | 半導體裝置、模組及電子裝置 |
CN104319279B (zh) * | 2014-11-10 | 2017-11-14 | 京东方科技集团股份有限公司 | 阵列基板及其制造方法、显示装置 |
WO2016092427A1 (en) | 2014-12-10 | 2016-06-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
US9818880B2 (en) | 2015-02-12 | 2017-11-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including the semiconductor device |
US9653613B2 (en) * | 2015-02-27 | 2017-05-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
DE112016001033T5 (de) * | 2015-03-03 | 2017-12-21 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung, Verfahren zum Herstellen derselben oder Anzeigevorrichtung mit derselben |
KR20160114511A (ko) | 2015-03-24 | 2016-10-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제작 방법 |
US9842938B2 (en) | 2015-03-24 | 2017-12-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including semiconductor device |
US9806200B2 (en) | 2015-03-27 | 2017-10-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US20160308067A1 (en) * | 2015-04-17 | 2016-10-20 | Ishiang Shih | Metal oxynitride transistor devices |
CN106206743B (zh) * | 2015-05-04 | 2020-04-28 | 清华大学 | 薄膜晶体管及其制备方法、薄膜晶体管面板以及显示装置 |
US10714633B2 (en) | 2015-12-15 | 2020-07-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device |
US9917207B2 (en) | 2015-12-25 | 2018-03-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
KR20180123028A (ko) | 2016-03-11 | 2018-11-14 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장비, 상기 반도체 장치의 제작 방법, 및 상기 반도체 장치를 포함하는 표시 장치 |
US11302717B2 (en) * | 2016-04-08 | 2022-04-12 | Semiconductor Energy Laboratory Co., Ltd. | Transistor and method for manufacturing the same |
WO2017199128A1 (en) * | 2016-05-20 | 2017-11-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device or display device including the same |
TWI726026B (zh) * | 2016-06-27 | 2021-05-01 | 日商半導體能源硏究所股份有限公司 | 電晶體以及半導體裝置 |
TW201813095A (zh) * | 2016-07-11 | 2018-04-01 | 半導體能源硏究所股份有限公司 | 半導體裝置 |
CN109478514A (zh) | 2016-07-26 | 2019-03-15 | 株式会社半导体能源研究所 | 半导体装置 |
US10411003B2 (en) | 2016-10-14 | 2019-09-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
CN112582466A (zh) * | 2020-11-20 | 2021-03-30 | 华南理工大学 | 一种金属氧化物半导体及薄膜晶体管与应用 |
US20220123240A1 (en) * | 2019-02-08 | 2022-04-21 | Georgia Tech Research Corporation | High Sensitivity Stable Sensors And Methods For Manufacturing Same |
KR20210010700A (ko) * | 2019-07-17 | 2021-01-28 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
CN110797395A (zh) * | 2019-09-18 | 2020-02-14 | 华南理工大学 | 掺杂型金属氧化物半导体及薄膜晶体管与应用 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010021555A (ja) * | 2008-07-14 | 2010-01-28 | Samsung Electronics Co Ltd | トランジスタ |
JP2011086923A (ja) * | 2009-09-16 | 2011-04-28 | Semiconductor Energy Lab Co Ltd | トランジスタ及び表示装置 |
JP2011124360A (ja) * | 2009-12-10 | 2011-06-23 | Fujifilm Corp | 薄膜トランジスタおよびその製造方法、並びにその薄膜トランジスタを備えた装置 |
JP2011135066A (ja) * | 2009-11-28 | 2011-07-07 | Semiconductor Energy Lab Co Ltd | 積層酸化物材料、半導体装置、および半導体装置の作製方法 |
JP2011135063A (ja) * | 2009-11-28 | 2011-07-07 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
JP2011138934A (ja) * | 2009-12-28 | 2011-07-14 | Sony Corp | 薄膜トランジスタ、表示装置および電子機器 |
JP2011243745A (ja) * | 2010-05-18 | 2011-12-01 | Fujifilm Corp | 薄膜トランジスタの製造方法、並びに、薄膜トランジスタ、イメージセンサー、x線センサー及びx線デジタル撮影装置 |
JP2012134470A (ja) * | 2010-11-30 | 2012-07-12 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
Family Cites Families (126)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60198861A (ja) | 1984-03-23 | 1985-10-08 | Fujitsu Ltd | 薄膜トランジスタ |
JPH0244256B2 (ja) | 1987-01-28 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn2o5deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
JPH0244258B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn3o6deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
JPH0244260B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn5o8deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
JPS63210023A (ja) | 1987-02-24 | 1988-08-31 | Natl Inst For Res In Inorg Mater | InGaZn↓4O↓7で示される六方晶系の層状構造を有する化合物およびその製造法 |
JPH0244262B2 (ja) | 1987-02-27 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn6o9deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
JPH0244263B2 (ja) | 1987-04-22 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn7o10deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
JPH05251705A (ja) | 1992-03-04 | 1993-09-28 | Fuji Xerox Co Ltd | 薄膜トランジスタ |
JP3479375B2 (ja) | 1995-03-27 | 2003-12-15 | 科学技術振興事業団 | 亜酸化銅等の金属酸化物半導体による薄膜トランジスタとpn接合を形成した金属酸化物半導体装置およびそれらの製造方法 |
EP0820644B1 (en) | 1995-08-03 | 2005-08-24 | Koninklijke Philips Electronics N.V. | Semiconductor device provided with transparent switching element |
JP3625598B2 (ja) | 1995-12-30 | 2005-03-02 | 三星電子株式会社 | 液晶表示装置の製造方法 |
JP4170454B2 (ja) | 1998-07-24 | 2008-10-22 | Hoya株式会社 | 透明導電性酸化物薄膜を有する物品及びその製造方法 |
JP2000150861A (ja) | 1998-11-16 | 2000-05-30 | Tdk Corp | 酸化物薄膜 |
JP3276930B2 (ja) | 1998-11-17 | 2002-04-22 | 科学技術振興事業団 | トランジスタ及び半導体装置 |
TW460731B (en) | 1999-09-03 | 2001-10-21 | Ind Tech Res Inst | Electrode structure and production method of wide viewing angle LCD |
JP4089858B2 (ja) | 2000-09-01 | 2008-05-28 | 国立大学法人東北大学 | 半導体デバイス |
KR20020038482A (ko) | 2000-11-15 | 2002-05-23 | 모리시타 요이찌 | 박막 트랜지스터 어레이, 그 제조방법 및 그것을 이용한표시패널 |
JP3997731B2 (ja) | 2001-03-19 | 2007-10-24 | 富士ゼロックス株式会社 | 基材上に結晶性半導体薄膜を形成する方法 |
JP2002289859A (ja) | 2001-03-23 | 2002-10-04 | Minolta Co Ltd | 薄膜トランジスタ |
JP3925839B2 (ja) | 2001-09-10 | 2007-06-06 | シャープ株式会社 | 半導体記憶装置およびその試験方法 |
JP4090716B2 (ja) | 2001-09-10 | 2008-05-28 | 雅司 川崎 | 薄膜トランジスタおよびマトリクス表示装置 |
EP1443130B1 (en) | 2001-11-05 | 2011-09-28 | Japan Science and Technology Agency | Natural superlattice homologous single crystal thin film, method for preparation thereof, and device using said single crystal thin film |
JP4164562B2 (ja) | 2002-09-11 | 2008-10-15 | 独立行政法人科学技術振興機構 | ホモロガス薄膜を活性層として用いる透明薄膜電界効果型トランジスタ |
JP4083486B2 (ja) | 2002-02-21 | 2008-04-30 | 独立行政法人科学技術振興機構 | LnCuO(S,Se,Te)単結晶薄膜の製造方法 |
US7049190B2 (en) | 2002-03-15 | 2006-05-23 | Sanyo Electric Co., Ltd. | Method for forming ZnO film, method for forming ZnO semiconductor layer, method for fabricating semiconductor device, and semiconductor device |
JP3933591B2 (ja) | 2002-03-26 | 2007-06-20 | 淳二 城戸 | 有機エレクトロルミネッセント素子 |
US7339187B2 (en) | 2002-05-21 | 2008-03-04 | State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University | Transistor structures |
US6933241B2 (en) * | 2002-06-06 | 2005-08-23 | Nec Corporation | Method for forming pattern of stacked film |
JP2004022625A (ja) | 2002-06-13 | 2004-01-22 | Murata Mfg Co Ltd | 半導体デバイス及び該半導体デバイスの製造方法 |
US7105868B2 (en) | 2002-06-24 | 2006-09-12 | Cermet, Inc. | High-electron mobility transistor with zinc oxide |
US7067843B2 (en) | 2002-10-11 | 2006-06-27 | E. I. Du Pont De Nemours And Company | Transparent oxide semiconductor thin film transistors |
JP4166105B2 (ja) | 2003-03-06 | 2008-10-15 | シャープ株式会社 | 半導体装置およびその製造方法 |
JP2004273732A (ja) | 2003-03-07 | 2004-09-30 | Sharp Corp | アクティブマトリクス基板およびその製造方法 |
JP4108633B2 (ja) | 2003-06-20 | 2008-06-25 | シャープ株式会社 | 薄膜トランジスタおよびその製造方法ならびに電子デバイス |
US7262463B2 (en) | 2003-07-25 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | Transistor including a deposited channel region having a doped portion |
US7282782B2 (en) | 2004-03-12 | 2007-10-16 | Hewlett-Packard Development Company, L.P. | Combined binary oxide semiconductor device |
CN102856390B (zh) | 2004-03-12 | 2015-11-25 | 独立行政法人科学技术振兴机构 | 包含薄膜晶体管的lcd或有机el显示器的转换组件 |
US7297977B2 (en) | 2004-03-12 | 2007-11-20 | Hewlett-Packard Development Company, L.P. | Semiconductor device |
US7145174B2 (en) | 2004-03-12 | 2006-12-05 | Hewlett-Packard Development Company, Lp. | Semiconductor device |
US7211825B2 (en) | 2004-06-14 | 2007-05-01 | Yi-Chi Shih | Indium oxide-based thin film transistors and circuits |
JP2006100760A (ja) | 2004-09-02 | 2006-04-13 | Casio Comput Co Ltd | 薄膜トランジスタおよびその製造方法 |
US7285501B2 (en) | 2004-09-17 | 2007-10-23 | Hewlett-Packard Development Company, L.P. | Method of forming a solution processed device |
US7298084B2 (en) | 2004-11-02 | 2007-11-20 | 3M Innovative Properties Company | Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes |
US7453065B2 (en) | 2004-11-10 | 2008-11-18 | Canon Kabushiki Kaisha | Sensor and image pickup device |
JP5126729B2 (ja) | 2004-11-10 | 2013-01-23 | キヤノン株式会社 | 画像表示装置 |
EP2453480A2 (en) | 2004-11-10 | 2012-05-16 | Canon Kabushiki Kaisha | Amorphous oxide and field effect transistor |
US7791072B2 (en) | 2004-11-10 | 2010-09-07 | Canon Kabushiki Kaisha | Display |
US7829444B2 (en) | 2004-11-10 | 2010-11-09 | Canon Kabushiki Kaisha | Field effect transistor manufacturing method |
US7868326B2 (en) | 2004-11-10 | 2011-01-11 | Canon Kabushiki Kaisha | Field effect transistor |
EP1810335B1 (en) | 2004-11-10 | 2020-05-27 | Canon Kabushiki Kaisha | Light-emitting device |
US7863611B2 (en) | 2004-11-10 | 2011-01-04 | Canon Kabushiki Kaisha | Integrated circuits utilizing amorphous oxides |
US7579224B2 (en) | 2005-01-21 | 2009-08-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a thin film semiconductor device |
TWI562380B (en) | 2005-01-28 | 2016-12-11 | Semiconductor Energy Lab Co Ltd | Semiconductor device, electronic device, and method of manufacturing semiconductor device |
US7608531B2 (en) | 2005-01-28 | 2009-10-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, electronic device, and method of manufacturing semiconductor device |
US7858451B2 (en) | 2005-02-03 | 2010-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device, semiconductor device and manufacturing method thereof |
US7948171B2 (en) | 2005-02-18 | 2011-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
US20060197092A1 (en) | 2005-03-03 | 2006-09-07 | Randy Hoffman | System and method for forming conductive material on a substrate |
US8681077B2 (en) | 2005-03-18 | 2014-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, and display device, driving method and electronic apparatus thereof |
US7544967B2 (en) | 2005-03-28 | 2009-06-09 | Massachusetts Institute Of Technology | Low voltage flexible organic/transparent transistor for selective gas sensing, photodetecting and CMOS device applications |
US7645478B2 (en) | 2005-03-31 | 2010-01-12 | 3M Innovative Properties Company | Methods of making displays |
US8300031B2 (en) | 2005-04-20 | 2012-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising transistor having gate and drain connected through a current-voltage conversion element |
JP2006344849A (ja) | 2005-06-10 | 2006-12-21 | Casio Comput Co Ltd | 薄膜トランジスタ |
US7402506B2 (en) | 2005-06-16 | 2008-07-22 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
US7691666B2 (en) | 2005-06-16 | 2010-04-06 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
US7507618B2 (en) | 2005-06-27 | 2009-03-24 | 3M Innovative Properties Company | Method for making electronic devices using metal oxide nanoparticles |
KR100711890B1 (ko) | 2005-07-28 | 2007-04-25 | 삼성에스디아이 주식회사 | 유기 발광표시장치 및 그의 제조방법 |
JP2007059128A (ja) | 2005-08-23 | 2007-03-08 | Canon Inc | 有機el表示装置およびその製造方法 |
JP5116225B2 (ja) | 2005-09-06 | 2013-01-09 | キヤノン株式会社 | 酸化物半導体デバイスの製造方法 |
JP4850457B2 (ja) | 2005-09-06 | 2012-01-11 | キヤノン株式会社 | 薄膜トランジスタ及び薄膜ダイオード |
JP4280736B2 (ja) | 2005-09-06 | 2009-06-17 | キヤノン株式会社 | 半導体素子 |
JP2007073705A (ja) | 2005-09-06 | 2007-03-22 | Canon Inc | 酸化物半導体チャネル薄膜トランジスタおよびその製造方法 |
JP5078246B2 (ja) | 2005-09-29 | 2012-11-21 | 株式会社半導体エネルギー研究所 | 半導体装置、及び半導体装置の作製方法 |
EP3614442A3 (en) | 2005-09-29 | 2020-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having oxide semiconductor layer and manufactoring method thereof |
JP5037808B2 (ja) | 2005-10-20 | 2012-10-03 | キヤノン株式会社 | アモルファス酸化物を用いた電界効果型トランジスタ、及び該トランジスタを用いた表示装置 |
CN101667544B (zh) | 2005-11-15 | 2012-09-05 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
TWI292281B (en) | 2005-12-29 | 2008-01-01 | Ind Tech Res Inst | Pixel structure of active organic light emitting diode and method of fabricating the same |
US7867636B2 (en) | 2006-01-11 | 2011-01-11 | Murata Manufacturing Co., Ltd. | Transparent conductive film and method for manufacturing the same |
JP4977478B2 (ja) | 2006-01-21 | 2012-07-18 | 三星電子株式会社 | ZnOフィルム及びこれを用いたTFTの製造方法 |
US7576394B2 (en) | 2006-02-02 | 2009-08-18 | Kochi Industrial Promotion Center | Thin film transistor including low resistance conductive thin films and manufacturing method thereof |
US7977169B2 (en) | 2006-02-15 | 2011-07-12 | Kochi Industrial Promotion Center | Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof |
KR20070101595A (ko) | 2006-04-11 | 2007-10-17 | 삼성전자주식회사 | ZnO TFT |
US20070252928A1 (en) | 2006-04-28 | 2007-11-01 | Toppan Printing Co., Ltd. | Structure, transmission type liquid crystal display, reflection type display and manufacturing method thereof |
JP5028033B2 (ja) | 2006-06-13 | 2012-09-19 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
JP4609797B2 (ja) | 2006-08-09 | 2011-01-12 | Nec液晶テクノロジー株式会社 | 薄膜デバイス及びその製造方法 |
JP4999400B2 (ja) | 2006-08-09 | 2012-08-15 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
JP4332545B2 (ja) | 2006-09-15 | 2009-09-16 | キヤノン株式会社 | 電界効果型トランジスタ及びその製造方法 |
JP4274219B2 (ja) | 2006-09-27 | 2009-06-03 | セイコーエプソン株式会社 | 電子デバイス、有機エレクトロルミネッセンス装置、有機薄膜半導体装置 |
JP5164357B2 (ja) | 2006-09-27 | 2013-03-21 | キヤノン株式会社 | 半導体装置及び半導体装置の製造方法 |
US7622371B2 (en) | 2006-10-10 | 2009-11-24 | Hewlett-Packard Development Company, L.P. | Fused nanocrystal thin film semiconductor and method |
US7772021B2 (en) | 2006-11-29 | 2010-08-10 | Samsung Electronics Co., Ltd. | Flat panel displays comprising a thin-film transistor having a semiconductive oxide in its channel and methods of fabricating the same for use in flat panel displays |
JP2008140684A (ja) | 2006-12-04 | 2008-06-19 | Toppan Printing Co Ltd | カラーelディスプレイおよびその製造方法 |
KR101303578B1 (ko) | 2007-01-05 | 2013-09-09 | 삼성전자주식회사 | 박막 식각 방법 |
US8207063B2 (en) | 2007-01-26 | 2012-06-26 | Eastman Kodak Company | Process for atomic layer deposition |
KR100851215B1 (ko) | 2007-03-14 | 2008-08-07 | 삼성에스디아이 주식회사 | 박막 트랜지스터 및 이를 이용한 유기 전계 발광표시장치 |
US7795613B2 (en) | 2007-04-17 | 2010-09-14 | Toppan Printing Co., Ltd. | Structure with transistor |
KR101325053B1 (ko) | 2007-04-18 | 2013-11-05 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 이의 제조 방법 |
KR20080094300A (ko) | 2007-04-19 | 2008-10-23 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조 방법과 박막 트랜지스터를포함하는 평판 디스플레이 |
KR101334181B1 (ko) | 2007-04-20 | 2013-11-28 | 삼성전자주식회사 | 선택적으로 결정화된 채널층을 갖는 박막 트랜지스터 및 그제조 방법 |
CN101663762B (zh) | 2007-04-25 | 2011-09-21 | 佳能株式会社 | 氧氮化物半导体 |
KR101345376B1 (ko) | 2007-05-29 | 2013-12-24 | 삼성전자주식회사 | ZnO 계 박막 트랜지스터 및 그 제조방법 |
US8202365B2 (en) | 2007-12-17 | 2012-06-19 | Fujifilm Corporation | Process for producing oriented inorganic crystalline film, and semiconductor device using the oriented inorganic crystalline film |
US8586979B2 (en) | 2008-02-01 | 2013-11-19 | Samsung Electronics Co., Ltd. | Oxide semiconductor transistor and method of manufacturing the same |
KR100941850B1 (ko) | 2008-04-03 | 2010-02-11 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를구비하는 평판 표시 장치 |
JP5345456B2 (ja) | 2008-08-14 | 2013-11-20 | 富士フイルム株式会社 | 薄膜電界効果型トランジスタ |
JP4623179B2 (ja) | 2008-09-18 | 2011-02-02 | ソニー株式会社 | 薄膜トランジスタおよびその製造方法 |
JP5451280B2 (ja) | 2008-10-09 | 2014-03-26 | キヤノン株式会社 | ウルツ鉱型結晶成長用基板およびその製造方法ならびに半導体装置 |
JP5504008B2 (ja) | 2009-03-06 | 2014-05-28 | 株式会社半導体エネルギー研究所 | 半導体装置 |
CN103794612B (zh) | 2009-10-21 | 2018-09-07 | 株式会社半导体能源研究所 | 半导体装置 |
KR101921619B1 (ko) | 2009-12-28 | 2018-11-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제작 방법 |
CN110620156A (zh) | 2010-04-02 | 2019-12-27 | 株式会社半导体能源研究所 | 半导体装置 |
US8779433B2 (en) | 2010-06-04 | 2014-07-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
SG11201504734VA (en) * | 2011-06-17 | 2015-07-30 | Semiconductor Energy Lab | Semiconductor device and method for manufacturing the same |
KR20130007426A (ko) | 2011-06-17 | 2013-01-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
WO2013179922A1 (en) | 2012-05-31 | 2013-12-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
KR102316107B1 (ko) | 2012-05-31 | 2021-10-21 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
US8901557B2 (en) | 2012-06-15 | 2014-12-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US9153699B2 (en) | 2012-06-15 | 2015-10-06 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor with multiple oxide semiconductor layers |
JP6310194B2 (ja) | 2012-07-06 | 2018-04-11 | 株式会社半導体エネルギー研究所 | 半導体装置 |
KR20140009023A (ko) | 2012-07-13 | 2014-01-22 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
US20140027762A1 (en) | 2012-07-27 | 2014-01-30 | Semiconductor Energy Laboratory Co. Ltd. | Semiconductor device |
CN104584229B (zh) | 2012-08-10 | 2018-05-15 | 株式会社半导体能源研究所 | 半导体装置及其制造方法 |
JP6220597B2 (ja) | 2012-08-10 | 2017-10-25 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US9245958B2 (en) | 2012-08-10 | 2016-01-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
KR102099261B1 (ko) | 2012-08-10 | 2020-04-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
US9929276B2 (en) | 2012-08-10 | 2018-03-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
TWI661553B (zh) | 2012-11-16 | 2019-06-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
-
2013
- 2013-07-26 KR KR1020130088550A patent/KR102171650B1/ko active IP Right Grant
- 2013-08-06 US US13/959,914 patent/US9293602B2/en active Active
- 2013-08-08 JP JP2013165071A patent/JP6226625B2/ja not_active Expired - Fee Related
-
2016
- 2016-03-21 US US15/075,671 patent/US9660104B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010021555A (ja) * | 2008-07-14 | 2010-01-28 | Samsung Electronics Co Ltd | トランジスタ |
JP2011086923A (ja) * | 2009-09-16 | 2011-04-28 | Semiconductor Energy Lab Co Ltd | トランジスタ及び表示装置 |
JP2011135066A (ja) * | 2009-11-28 | 2011-07-07 | Semiconductor Energy Lab Co Ltd | 積層酸化物材料、半導体装置、および半導体装置の作製方法 |
JP2011135063A (ja) * | 2009-11-28 | 2011-07-07 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
JP2011124360A (ja) * | 2009-12-10 | 2011-06-23 | Fujifilm Corp | 薄膜トランジスタおよびその製造方法、並びにその薄膜トランジスタを備えた装置 |
JP2011138934A (ja) * | 2009-12-28 | 2011-07-14 | Sony Corp | 薄膜トランジスタ、表示装置および電子機器 |
JP2011243745A (ja) * | 2010-05-18 | 2011-12-01 | Fujifilm Corp | 薄膜トランジスタの製造方法、並びに、薄膜トランジスタ、イメージセンサー、x線センサー及びx線デジタル撮影装置 |
JP2012134470A (ja) * | 2010-11-30 | 2012-07-12 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11581440B2 (en) | 2014-03-28 | 2023-02-14 | Semiconductor Energy Laboratory Co., Ltd. | Transistor and semiconductor device |
US10566460B2 (en) | 2014-03-28 | 2020-02-18 | Semiconductor Energy Laboratory Co., Ltd. | Transistor and semiconductor device |
US11888073B2 (en) | 2014-03-28 | 2024-01-30 | Semiconductor Energy Laboratory Co., Ltd. | Transistor and semiconductor device |
JP2015195380A (ja) * | 2014-03-28 | 2015-11-05 | 株式会社半導体エネルギー研究所 | トランジスタおよび半導体装置 |
US11177392B2 (en) | 2014-03-28 | 2021-11-16 | Semiconductor Energy Laboratory Co., Ltd. | Transistor and semiconductor device |
US10833203B2 (en) | 2014-03-28 | 2020-11-10 | Semiconductor Energy Laboratory Co., Ltd. | Transistor and semiconductor device |
US10236392B2 (en) | 2014-03-28 | 2019-03-19 | Semiconductor Energy Laboratory Co., Ltd. | Transistor and semiconductor device |
KR102596645B1 (ko) * | 2014-05-15 | 2023-10-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 이 반도체 장치를 포함하는 표시 장치 |
KR20210148041A (ko) * | 2014-05-15 | 2021-12-07 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 이 반도체 장치를 포함하는 표시 장치 |
US11594642B2 (en) | 2014-05-15 | 2023-02-28 | Semiconductor Energy Laboratory Co., Ltd. | Thin film semiconductor device including back gate comprising oxide semiconductor material |
JP2020021957A (ja) * | 2014-05-15 | 2020-02-06 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US10998448B2 (en) | 2014-05-15 | 2021-05-04 | Semiconductor Energy Laboratory Co., Ltd. | Thin film semiconductor device including back gate comprising oxide semiconductor material |
JP2016015484A (ja) * | 2014-06-13 | 2016-01-28 | 株式会社半導体エネルギー研究所 | 半導体装置、該半導体装置の作製方法および該半導体装置を含む電子機器 |
US9985136B2 (en) | 2015-09-10 | 2018-05-29 | Toshiba Memory Corporation | Semiconductor device |
JP2017054981A (ja) * | 2015-09-10 | 2017-03-16 | 株式会社東芝 | 半導体装置 |
JP7130085B2 (ja) | 2016-03-04 | 2022-09-02 | 株式会社半導体エネルギー研究所 | トランジスタ及び酸化物半導体 |
JP2021119616A (ja) * | 2016-03-04 | 2021-08-12 | 株式会社半導体エネルギー研究所 | トランジスタ及び酸化物半導体 |
JP2022169759A (ja) * | 2016-06-27 | 2022-11-09 | 株式会社半導体エネルギー研究所 | トランジスタ及び半導体装置 |
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KR102171650B1 (ko) | 2020-10-29 |
JP6226625B2 (ja) | 2017-11-08 |
US20140042437A1 (en) | 2014-02-13 |
US9293602B2 (en) | 2016-03-22 |
US9660104B2 (en) | 2017-05-23 |
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US20160240693A1 (en) | 2016-08-18 |
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