JP2011515851A - Ledデバイスの低屈折率スペーサ層 - Google Patents
Ledデバイスの低屈折率スペーサ層 Download PDFInfo
- Publication number
- JP2011515851A JP2011515851A JP2011500788A JP2011500788A JP2011515851A JP 2011515851 A JP2011515851 A JP 2011515851A JP 2011500788 A JP2011500788 A JP 2011500788A JP 2011500788 A JP2011500788 A JP 2011500788A JP 2011515851 A JP2011515851 A JP 2011515851A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- light
- spacer layer
- led chip
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 title claims abstract description 65
- 239000010410 layer Substances 0.000 claims abstract description 134
- 239000002346 layers by function Substances 0.000 claims abstract description 35
- 238000006243 chemical reaction Methods 0.000 claims abstract description 31
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims description 25
- 238000000149 argon plasma sintering Methods 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 8
- 239000011230 binding agent Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 claims 1
- NWAIGJYBQQYSPW-UHFFFAOYSA-N azanylidyneindigane Chemical compound [In]#N NWAIGJYBQQYSPW-UHFFFAOYSA-N 0.000 claims 1
- 239000011247 coating layer Substances 0.000 claims 1
- 238000000605 extraction Methods 0.000 abstract description 13
- 238000002161 passivation Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 22
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 9
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910004283 SiO 4 Inorganic materials 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 4
- 238000001429 visible spectrum Methods 0.000 description 4
- 229910052727 yttrium Inorganic materials 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 229910052693 Europium Inorganic materials 0.000 description 2
- 229910052688 Gadolinium Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000295 emission spectrum Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- -1 region Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 229910052765 Lutetium Inorganic materials 0.000 description 1
- 229910004122 SrSi Inorganic materials 0.000 description 1
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000001017 electron-beam sputter deposition Methods 0.000 description 1
- 238000001652 electrophoretic deposition Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 229910003480 inorganic solid Inorganic materials 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000002211 ultraviolet spectrum Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
【選択図】 図1
Description
Tb3−xRExO12:Ce(TAG)、
RE=Y,Gd,La,Lu、または
Sr2−x−yBaxCaySiO4:Eu
SrxCa1−xS:Eu,Y、Y=ハロゲン化物
CaSiAlN3:Eu、または
Sr2−yCaySiO4:Eu
SrGa2S4:Eu、
Sr2−yBaySiO4:Eu、または
SrSi2O2N2:Eu
黄色/緑色
(Sr,Ca,Ba)(Al,Ga)2S4:Eu2+
Ba2(Mg,Zn)Si2O7:Eu2+
Gd0.46Sr0.31Al1.23OxF1.38:Eu2+ 0.06
(Ba1−x−ySrxCay)SiO4:Eu
Ba2SiO4:Eu2+
赤色
Lu2O3:Eu3+
(Sr2−xLax)(Ce1−xEux)O4
Sr2Ce1−xEuxO4
Sr2−xEuxCeO4
SrTiO3:Pr3+,Ga3+
CaAlSiN3:Eu2+
Sr2Si5N8:Eu2+
Claims (12)
- 実装面に配設されており、粗面化された発光面を有し、第1の屈折率を持つ発光ダイオード(LED)チップと、
前記LEDチップに配設されており、前記発光面を被覆しており、前記第1の屈折率よりも低い第2の屈折率を持つスペーサ層と、
前記スペーサ層に配設されている少なくとも1つの機能層と
を備えるLEDデバイス。 - 前記少なくとも1つの機能層は、波長変換層を有する請求項1に記載のLEDデバイス。
- 前記波長変換層は、
前記第2の屈折率よりも高い第3の屈折率を持つバインダ材料と、
前記バインダ材料中に分散させられている複数の蛍光体粒子と
を含む請求項2に記載のLEDデバイス。 - 前記少なくとも1つの機能層はさらに、第1の波長範囲の光を透過させて、第2の波長範囲の光を反射するフィルタ層を有し、前記フィルタ層は、前記スペーサ層と前記波長変換層との間に挟持されている請求項2に記載のLEDデバイス。
- 前記少なくとも1つの機能層は、光散乱部材を有する請求項1に記載のLEDデバイス。
- 前記スペーサ層は、前記LEDチップとは反対側に、略平坦な面を有する請求項1に記載のLEDデバイス。
- 前記機能層は、反射防止コーティング層を有する請求項1に記載のLEDデバイス。
- 前記スペーサ層は、厚みが約1から25マイクロメートルである請求項1に記載のLEDデバイス。
- 前記実装面に配設されており、前記LEDチップを被覆している半球状筐体をさらに備える請求項1に記載のLEDデバイス。
- 前記LEDチップは、窒化アルミニウムガリウムインジウム(AlGaInN)半導体層を有する請求項1に記載のLEDデバイス。
- 前記スペーサ層は、前記LEDチップから前記機能層を熱的に絶縁する請求項1に記載のLEDデバイス。
- 前記スペーサ層は、前記LEDチップを保護する請求項1に記載のLEDデバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/077,638 US8637883B2 (en) | 2008-03-19 | 2008-03-19 | Low index spacer layer in LED devices |
US12/077,638 | 2008-03-19 | ||
PCT/US2009/001572 WO2009117067A1 (en) | 2008-03-19 | 2009-03-11 | Low index spacer layer in led devices |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2011515851A true JP2011515851A (ja) | 2011-05-19 |
Family
ID=40794733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011500788A Pending JP2011515851A (ja) | 2008-03-19 | 2009-03-11 | Ledデバイスの低屈折率スペーサ層 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8637883B2 (ja) |
EP (1) | EP2266148A1 (ja) |
JP (1) | JP2011515851A (ja) |
KR (1) | KR20100129766A (ja) |
CN (1) | CN102037577B (ja) |
WO (1) | WO2009117067A1 (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013183751A1 (ja) * | 2012-06-07 | 2013-12-12 | シャープ株式会社 | 蛍光体基板、発光デバイス、表示装置、及び照明装置 |
JP2014139998A (ja) * | 2013-01-21 | 2014-07-31 | Toshiba Corp | 半導体発光装置 |
JP2015111659A (ja) * | 2013-10-28 | 2015-06-18 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
JP2016001720A (ja) * | 2014-05-21 | 2016-01-07 | 日亜化学工業株式会社 | 発光装置の製造方法 |
JP2017515310A (ja) * | 2014-04-30 | 2017-06-08 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | 照明装置および照明装置を製造する方法 |
JP2018128617A (ja) * | 2017-02-10 | 2018-08-16 | 信越化学工業株式会社 | 波長変換部材及びled発光装置 |
KR20190074371A (ko) * | 2017-12-20 | 2019-06-28 | 엘지디스플레이 주식회사 | 발광 소자 및 조명 장치 |
JP2020184544A (ja) * | 2015-02-04 | 2020-11-12 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツングMerck Patent Gesellschaft mit beschraenkter Haftung | 電子素子における半導体粒子 |
Families Citing this family (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8718437B2 (en) | 2006-03-07 | 2014-05-06 | Qd Vision, Inc. | Compositions, optical component, system including an optical component, devices, and other products |
US9874674B2 (en) | 2006-03-07 | 2018-01-23 | Samsung Electronics Co., Ltd. | Compositions, optical component, system including an optical component, devices, and other products |
US9951438B2 (en) | 2006-03-07 | 2018-04-24 | Samsung Electronics Co., Ltd. | Compositions, optical component, system including an optical component, devices, and other products |
US8836212B2 (en) | 2007-01-11 | 2014-09-16 | Qd Vision, Inc. | Light emissive printed article printed with quantum dot ink |
KR101672553B1 (ko) | 2007-06-25 | 2016-11-03 | 큐디 비젼, 인크. | 조성물 및 나노물질의 침착을 포함하는 방법 |
WO2009014707A2 (en) | 2007-07-23 | 2009-01-29 | Qd Vision, Inc. | Quantum dot light enhancement substrate and lighting device including same |
US8128249B2 (en) | 2007-08-28 | 2012-03-06 | Qd Vision, Inc. | Apparatus for selectively backlighting a material |
US10008637B2 (en) | 2011-12-06 | 2018-06-26 | Cree, Inc. | Light emitter devices and methods with reduced dimensions and improved light output |
JP5665160B2 (ja) * | 2008-03-26 | 2015-02-04 | パナソニックIpマネジメント株式会社 | 発光装置および照明器具 |
JP2011524064A (ja) * | 2008-05-06 | 2011-08-25 | キユーデイー・ビジヨン・インコーポレーテツド | 量子閉じ込め半導体ナノ粒子を含有する固体照明装置 |
US9207385B2 (en) | 2008-05-06 | 2015-12-08 | Qd Vision, Inc. | Lighting systems and devices including same |
WO2009137053A1 (en) | 2008-05-06 | 2009-11-12 | Qd Vision, Inc. | Optical components, systems including an optical component, and devices |
KR100993045B1 (ko) * | 2009-10-23 | 2010-11-08 | 엘지이노텍 주식회사 | 발광소자 칩 및 발광소자 패키지 |
US8692274B2 (en) * | 2009-02-24 | 2014-04-08 | Industrial Technology Research Institute | Light emitting diode package structure |
CN102803129B (zh) | 2009-04-28 | 2016-08-03 | Qd视光有限公司 | 光学材料、光学部件和方法 |
WO2011020098A1 (en) | 2009-08-14 | 2011-02-17 | Qd Vision, Inc. | Lighting devices, an optical component for a lighting device, and methods |
JP2013508895A (ja) | 2009-10-17 | 2013-03-07 | キユーデイー・ビジヨン・インコーポレーテツド | 光学部品、これを含む製品およびこれを作製する方法 |
KR101039930B1 (ko) | 2009-10-23 | 2011-06-09 | 엘지이노텍 주식회사 | 발광소자 패키지 및 그 제조방법 |
DE102009054840A1 (de) * | 2009-12-17 | 2011-06-22 | Poly-Tech Service GmbH, 67681 | Leuchtmittel mit einer Mehrzahl von Leuchtdioden |
KR100999779B1 (ko) * | 2010-02-01 | 2010-12-08 | 엘지이노텍 주식회사 | 발광소자, 발광소자의 제조방법 및 발광소자 패키지 |
US20110215348A1 (en) * | 2010-02-03 | 2011-09-08 | Soraa, Inc. | Reflection Mode Package for Optical Devices Using Gallium and Nitrogen Containing Materials |
US9991427B2 (en) * | 2010-03-08 | 2018-06-05 | Cree, Inc. | Photonic crystal phosphor light conversion structures for light emitting devices |
US8384105B2 (en) * | 2010-03-19 | 2013-02-26 | Micron Technology, Inc. | Light emitting diodes with enhanced thermal sinking and associated methods of operation |
PL2705545T3 (pl) * | 2011-05-06 | 2020-09-21 | Signify Holding B.V. | Urządzenie oświetleniowe wzbogacone luminoforem, zmodernizowana żarówka i rura świetlna ze zmniejszoną obecnością barwy |
US10211380B2 (en) | 2011-07-21 | 2019-02-19 | Cree, Inc. | Light emitting devices and components having improved chemical resistance and related methods |
WO2013013154A2 (en) | 2011-07-21 | 2013-01-24 | Cree, Inc. | Light emitter device packages, components, and methods for improved chemical resistance and related methods |
US10686107B2 (en) | 2011-07-21 | 2020-06-16 | Cree, Inc. | Light emitter devices and components with improved chemical resistance and related methods |
EP2587560A1 (en) * | 2011-10-26 | 2013-05-01 | Forschungsverbund Berlin e.V. | Light emitting diode |
WO2013069924A1 (en) | 2011-11-08 | 2013-05-16 | Lg Innotek Co., Ltd. | Light emitting device |
KR101338704B1 (ko) * | 2011-12-18 | 2013-12-06 | 엘지이노텍 주식회사 | 발광장치 |
KR101969334B1 (ko) | 2011-11-16 | 2019-04-17 | 엘지이노텍 주식회사 | 발광 소자 및 이를 구비한 발광 장치 |
CN102437276A (zh) | 2011-11-25 | 2012-05-02 | 四川新力光源有限公司 | 一种led器件及其制作方法 |
US9496466B2 (en) | 2011-12-06 | 2016-11-15 | Cree, Inc. | Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction |
US9240530B2 (en) | 2012-02-13 | 2016-01-19 | Cree, Inc. | Light emitter devices having improved chemical and physical resistance and related methods |
US9343441B2 (en) | 2012-02-13 | 2016-05-17 | Cree, Inc. | Light emitter devices having improved light output and related methods |
DE102012101663B4 (de) * | 2012-02-29 | 2019-12-24 | Osram Opto Semiconductors Gmbh | Konversionselement, Leuchtmittel und Verfahren zur Herstellung eines Konversionselements |
CN102646674A (zh) * | 2012-04-26 | 2012-08-22 | 南通脉锐光电科技有限公司 | 白光led发光装置 |
US9450152B2 (en) | 2012-05-29 | 2016-09-20 | Micron Technology, Inc. | Solid state transducer dies having reflective features over contacts and associated systems and methods |
US9929325B2 (en) | 2012-06-05 | 2018-03-27 | Samsung Electronics Co., Ltd. | Lighting device including quantum dots |
EP2940743A4 (en) * | 2012-12-28 | 2016-07-27 | Konica Minolta Inc | LIGHT-EMITTING DEVICE |
TW201438936A (zh) * | 2013-04-03 | 2014-10-16 | Hon Hai Prec Ind Co Ltd | 車燈系統 |
JPWO2014174618A1 (ja) * | 2013-04-24 | 2017-02-23 | 日立マクセル株式会社 | 光源装置および車両用灯具 |
TWI557962B (zh) * | 2013-08-23 | 2016-11-11 | 鴻海精密工業股份有限公司 | 有機發光二極體封裝結構及其製造方法 |
US9784427B2 (en) * | 2015-01-09 | 2017-10-10 | GM Global Technology Operations LLC | Backlit illuminated device with lighting through decorative plated surfaces |
CN107209419B (zh) * | 2015-02-04 | 2022-08-12 | 默克专利股份有限公司 | 电光切换元件和显示器件 |
DE102015105893A1 (de) * | 2015-04-17 | 2016-10-20 | Osram Gmbh | Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils |
DE102015105896B4 (de) * | 2015-04-17 | 2023-03-09 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils |
DE102015105897A1 (de) * | 2015-04-17 | 2016-10-20 | Osram Gmbh | Optoelektronisches Bauteil |
KR20160149363A (ko) | 2015-06-17 | 2016-12-28 | 삼성전자주식회사 | 반도체 발광소자 |
KR20170003182A (ko) * | 2015-06-30 | 2017-01-09 | 서울반도체 주식회사 | 발광 다이오드 |
US20170338387A1 (en) * | 2015-06-30 | 2017-11-23 | Seoul Semiconductor Co., Ltd. | Light emitting diode |
US9443904B1 (en) * | 2015-09-07 | 2016-09-13 | Mikro Mesa Technology Co., Ltd. | Light-emitting diode display and manufacturing method thereof |
US10193031B2 (en) * | 2016-03-11 | 2019-01-29 | Rohinni, LLC | Method for applying phosphor to light emitting diodes and apparatus thereof |
DE102017101729A1 (de) * | 2017-01-30 | 2018-08-02 | Osram Opto Semiconductors Gmbh | Strahlungsemittierende Vorrichtung |
WO2018155731A1 (ko) * | 2017-02-22 | 2018-08-30 | (주)라이타이저코리아 | 컨벡스 칩 스케일 패키지 및 그의 제조 방법 |
WO2018159883A1 (ko) * | 2017-03-03 | 2018-09-07 | (주)라이타이저코리아 | 컨벡스 칩 스케일 패키지 및 그의 제조 방법 |
US10879420B2 (en) | 2018-07-09 | 2020-12-29 | University Of Iowa Research Foundation | Cascaded superlattice LED system |
US11861941B1 (en) | 2019-02-06 | 2024-01-02 | Apple Inc. | Eye camera systems with polarized light |
US11326763B1 (en) * | 2019-02-06 | 2022-05-10 | Apple Inc. | Light-emitting diodes with optical filters |
CN111190307A (zh) * | 2019-12-13 | 2020-05-22 | 深圳市隆利科技股份有限公司 | 直下式背光装置及显示设备 |
CN113337894A (zh) * | 2021-05-21 | 2021-09-03 | 中国科学院上海光学精密机械研究所 | 一种掺铈钇铝石榴石闪烁晶体表面蛾眼式微结构及其制备方法 |
US20240304609A1 (en) * | 2023-03-06 | 2024-09-12 | Creeled, Inc. | Multiple-layered cover structure for beamshaping for light-emitting diode devices |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003069086A (ja) * | 2001-06-11 | 2003-03-07 | Lumileds Lighting Us Llc | コンフォーマルに被覆された蛍光変換発光半導体構造を製造するための電気泳動の使用 |
JP2003532298A (ja) * | 2000-04-26 | 2003-10-28 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 発光半導体素子 |
JP2005244226A (ja) * | 2004-02-23 | 2005-09-08 | Lumileds Lighting Us Llc | 波長変換型半導体発光素子 |
JP2005251875A (ja) * | 2004-03-02 | 2005-09-15 | Toshiba Corp | 半導体発光装置 |
WO2005104247A1 (ja) * | 2004-04-19 | 2005-11-03 | Matsushita Electric Industrial Co., Ltd. | Led照明光源の製造方法およびled照明光源 |
JP2006278567A (ja) * | 2005-03-28 | 2006-10-12 | Matsushita Electric Works Ltd | Ledユニット |
JP2006278751A (ja) * | 2005-03-29 | 2006-10-12 | Mitsubishi Cable Ind Ltd | GaN系半導体発光素子 |
JP2006324672A (ja) * | 2005-05-19 | 2006-11-30 | Samsung Electro Mech Co Ltd | 光抽出効率が改善された垂直構造窒化物半導体発光素子 |
JP2007035882A (ja) * | 2005-07-26 | 2007-02-08 | Matsushita Electric Works Ltd | Led照明装置 |
JP2007053358A (ja) * | 2005-08-04 | 2007-03-01 | Jung-Chieh Su | 発光素子 |
JP2007067420A (ja) * | 2005-08-26 | 2007-03-15 | Philips Lumileds Lightng Co Llc | 色変換型発光ダイオード |
JP2007116131A (ja) * | 2005-09-21 | 2007-05-10 | Sanyo Electric Co Ltd | Led発光装置 |
JP2007258701A (ja) * | 2006-03-20 | 2007-10-04 | Chi Lin Technology Co Ltd | 発光ダイオードのパッケージ構造及びその製造方法 |
JP2010521060A (ja) * | 2006-12-22 | 2010-06-17 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | フィルタを含む発光デバイス |
Family Cites Families (155)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4476620A (en) * | 1979-10-19 | 1984-10-16 | Matsushita Electric Industrial Co., Ltd. | Method of making a gallium nitride light-emitting diode |
US4733335A (en) | 1984-12-28 | 1988-03-22 | Koito Manufacturing Co., Ltd. | Vehicular lamp |
US4811082A (en) * | 1986-11-12 | 1989-03-07 | International Business Machines Corporation | High performance integrated circuit packaging structure |
US4866005A (en) | 1987-10-26 | 1989-09-12 | North Carolina State University | Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide |
US4935665A (en) | 1987-12-24 | 1990-06-19 | Mitsubishi Cable Industries Ltd. | Light emitting diode lamp |
CA1337918C (en) | 1988-03-16 | 1996-01-16 | Norihisa Osaka | Phosphor paste compositions and phosphor coatings obtained therefrom |
US5027168A (en) | 1988-12-14 | 1991-06-25 | Cree Research, Inc. | Blue light emitting diode formed in silicon carbide |
US4918497A (en) | 1988-12-14 | 1990-04-17 | Cree Research, Inc. | Blue light emitting diode formed in silicon carbide |
US5075253A (en) * | 1989-04-12 | 1991-12-24 | Advanced Micro Devices, Inc. | Method of coplanar integration of semiconductor IC devices |
US4990462A (en) * | 1989-04-12 | 1991-02-05 | Advanced Micro Devices, Inc. | Method for coplanar integration of semiconductor ic devices |
US4966862A (en) | 1989-08-28 | 1990-10-30 | Cree Research, Inc. | Method of production of light emitting diodes |
US4946547A (en) | 1989-10-13 | 1990-08-07 | Cree Research, Inc. | Method of preparing silicon carbide surfaces for crystal growth |
US5210051A (en) | 1990-03-27 | 1993-05-11 | Cree Research, Inc. | High efficiency light emitting diodes from bipolar gallium nitride |
US5200022A (en) | 1990-10-03 | 1993-04-06 | Cree Research, Inc. | Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product |
FR2704690B1 (fr) | 1993-04-27 | 1995-06-23 | Thomson Csf | Procédé d'encapsulation de pastilles semi-conductrices, dispositif obtenu par ce procédé et application à l'interconnexion de pastilles en trois dimensions. |
US5416342A (en) * | 1993-06-23 | 1995-05-16 | Cree Research, Inc. | Blue light-emitting diode with high external quantum efficiency |
US5338944A (en) | 1993-09-22 | 1994-08-16 | Cree Research, Inc. | Blue light-emitting diode with degenerate junction structure |
US5393993A (en) | 1993-12-13 | 1995-02-28 | Cree Research, Inc. | Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices |
US5380681A (en) * | 1994-03-21 | 1995-01-10 | United Microelectronics Corporation | Three-dimensional multichip package and methods of fabricating |
US5604135A (en) * | 1994-08-12 | 1997-02-18 | Cree Research, Inc. | Method of forming green light emitting diode in silicon carbide |
US5523589A (en) * | 1994-09-20 | 1996-06-04 | Cree Research, Inc. | Vertical geometry light emitting diode with group III nitride active layer and extended lifetime |
US5631190A (en) * | 1994-10-07 | 1997-05-20 | Cree Research, Inc. | Method for producing high efficiency light-emitting diodes and resulting diode structures |
DE19509262C2 (de) | 1995-03-15 | 2001-11-29 | Siemens Ag | Halbleiterbauelement mit Kunststoffumhüllung und Verfahren zu dessen Herstellung |
US5614131A (en) * | 1995-05-01 | 1997-03-25 | Motorola, Inc. | Method of making an optoelectronic device |
US5739554A (en) * | 1995-05-08 | 1998-04-14 | Cree Research, Inc. | Double heterojunction light emitting diode with gallium nitride active layer |
US5766987A (en) * | 1995-09-22 | 1998-06-16 | Tessera, Inc. | Microelectronic encapsulation methods and equipment |
DE19536438A1 (de) * | 1995-09-29 | 1997-04-03 | Siemens Ag | Halbleiterbauelement und Herstellverfahren |
US6002177A (en) * | 1995-12-27 | 1999-12-14 | International Business Machines Corporation | High density integrated circuit packaging with chip stacking and via interconnections |
JP2947156B2 (ja) * | 1996-02-29 | 1999-09-13 | 双葉電子工業株式会社 | 蛍光体の製造方法 |
US6001671A (en) | 1996-04-18 | 1999-12-14 | Tessera, Inc. | Methods for manufacturing a semiconductor package having a sacrificial layer |
US5803579A (en) * | 1996-06-13 | 1998-09-08 | Gentex Corporation | Illuminator assembly incorporating light emitting diodes |
EP1441395B9 (de) | 1996-06-26 | 2012-08-15 | OSRAM Opto Semiconductors GmbH | Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
DE19638667C2 (de) | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
TW383508B (en) | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
US5833903A (en) | 1996-12-10 | 1998-11-10 | Great American Gumball Corporation | Injection molding encapsulation for an electronic device directly onto a substrate |
US6583444B2 (en) | 1997-02-18 | 2003-06-24 | Tessera, Inc. | Semiconductor packages having light-sensitive chips |
JP3351706B2 (ja) * | 1997-05-14 | 2002-12-03 | 株式会社東芝 | 半導体装置およびその製造方法 |
US5813753A (en) * | 1997-05-27 | 1998-09-29 | Philips Electronics North America Corporation | UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light |
FR2764111A1 (fr) * | 1997-06-03 | 1998-12-04 | Sgs Thomson Microelectronics | Procede de fabrication de boitiers semi-conducteurs comprenant un circuit integre |
JP3920461B2 (ja) | 1998-06-15 | 2007-05-30 | 大日本印刷株式会社 | レンズおよびその製造方法 |
US6201262B1 (en) * | 1997-10-07 | 2001-03-13 | Cree, Inc. | Group III nitride photonic devices on silicon carbide substrates with conductive buffer interlay structure |
TW408497B (en) | 1997-11-25 | 2000-10-11 | Matsushita Electric Works Ltd | LED illuminating apparatus |
US6252254B1 (en) * | 1998-02-06 | 2001-06-26 | General Electric Company | Light emitting device with phosphor composition |
US6329224B1 (en) | 1998-04-28 | 2001-12-11 | Tessera, Inc. | Encapsulation of microelectronic assemblies |
US6213376B1 (en) * | 1998-06-17 | 2001-04-10 | International Business Machines Corp. | Stacked chip process carrier |
US5959316A (en) | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
US6404125B1 (en) | 1998-10-21 | 2002-06-11 | Sarnoff Corporation | Method and apparatus for performing wavelength-conversion using phosphors with light emitting diodes |
US6184465B1 (en) * | 1998-11-12 | 2001-02-06 | Micron Technology, Inc. | Semiconductor package |
US6429583B1 (en) | 1998-11-30 | 2002-08-06 | General Electric Company | Light emitting device with ba2mgsi2o7:eu2+, ba2sio4:eu2+, or (srxcay ba1-x-y)(a1zga1-z)2sr:eu2+phosphors |
US6271059B1 (en) * | 1999-01-04 | 2001-08-07 | International Business Machines Corporation | Chip interconnection structure using stub terminals |
US6461895B1 (en) * | 1999-01-05 | 2002-10-08 | Intel Corporation | Process for making active interposer for high performance packaging applications |
US6229216B1 (en) * | 1999-01-11 | 2001-05-08 | Intel Corporation | Silicon interposer and multi-chip-module (MCM) with through substrate vias |
JP4256968B2 (ja) | 1999-01-14 | 2009-04-22 | スタンレー電気株式会社 | 発光ダイオードの製造方法 |
DE19918370B4 (de) | 1999-04-22 | 2006-06-08 | Osram Opto Semiconductors Gmbh | LED-Weißlichtquelle mit Linse |
EP1059678A2 (en) | 1999-06-09 | 2000-12-13 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device |
US6243272B1 (en) * | 1999-06-18 | 2001-06-05 | Intel Corporation | Method and apparatus for interconnecting multiple devices on a circuit board |
JP3675234B2 (ja) | 1999-06-28 | 2005-07-27 | 豊田合成株式会社 | 半導体発光素子の製造方法 |
US6696703B2 (en) | 1999-09-27 | 2004-02-24 | Lumileds Lighting U.S., Llc | Thin film phosphor-converted light emitting diode device |
US6338813B1 (en) | 1999-10-15 | 2002-01-15 | Advanced Semiconductor Engineering, Inc. | Molding method for BGA semiconductor chip package |
KR20010044907A (ko) | 1999-11-01 | 2001-06-05 | 김순택 | 저전압 구동용 고휘도 형광체막 및 그 제조 방법 |
DE19964252A1 (de) | 1999-12-30 | 2002-06-06 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares Bauelement für eine LED-Weißlichtquelle |
DE10010638A1 (de) | 2000-03-03 | 2001-09-13 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines lichtabstrahlenden Halbleiterkörpers mit Lumineszenzkonversionselement |
US6793371B2 (en) * | 2000-03-09 | 2004-09-21 | Mongo Light Co. Inc. | LED lamp assembly |
US6522065B1 (en) | 2000-03-27 | 2003-02-18 | General Electric Company | Single phosphor for creating white light with high luminosity and high CRI in a UV led device |
TW200529308A (en) | 2000-03-31 | 2005-09-01 | Toyoda Gosei Kk | Method for dicing semiconductor wafer into chips |
US6653765B1 (en) * | 2000-04-17 | 2003-11-25 | General Electric Company | Uniform angular light distribution from LEDs |
US6501100B1 (en) | 2000-05-15 | 2002-12-31 | General Electric Company | White light emitting phosphor blend for LED devices |
US6621211B1 (en) | 2000-05-15 | 2003-09-16 | General Electric Company | White light emitting phosphor blends for LED devices |
GB0013394D0 (en) | 2000-06-01 | 2000-07-26 | Microemissive Displays Ltd | A method of creating a color optoelectronic device |
JP2002009097A (ja) * | 2000-06-22 | 2002-01-11 | Oki Electric Ind Co Ltd | 半導体装置とその製造方法 |
DE10033502A1 (de) * | 2000-07-10 | 2002-01-31 | Osram Opto Semiconductors Gmbh | Optoelektronisches Modul, Verfahren zu dessen Herstellung und dessen Verwendung |
JP2002050799A (ja) | 2000-08-04 | 2002-02-15 | Stanley Electric Co Ltd | Ledランプおよびその製造方法 |
US6614103B1 (en) | 2000-09-01 | 2003-09-02 | General Electric Company | Plastic packaging of LED arrays |
US6355501B1 (en) * | 2000-09-21 | 2002-03-12 | International Business Machines Corporation | Three-dimensional chip stacking assembly |
JP3466144B2 (ja) * | 2000-09-22 | 2003-11-10 | 士郎 酒井 | 半導体の表面を荒くする方法 |
US6650044B1 (en) | 2000-10-13 | 2003-11-18 | Lumileds Lighting U.S., Llc | Stenciling phosphor layers on light emitting diodes |
DE10051242A1 (de) * | 2000-10-17 | 2002-04-25 | Philips Corp Intellectual Pty | Lichtemittierende Vorrichtung mit beschichtetem Leuchtstoff |
US7015516B2 (en) * | 2000-11-16 | 2006-03-21 | Gelcore Llc | Led packages having improved light extraction |
JP3614776B2 (ja) | 2000-12-19 | 2005-01-26 | シャープ株式会社 | チップ部品型ledとその製造方法 |
JP5110744B2 (ja) | 2000-12-21 | 2012-12-26 | フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー | 発光装置及びその製造方法 |
US6734571B2 (en) | 2001-01-23 | 2004-05-11 | Micron Technology, Inc. | Semiconductor assembly encapsulation mold |
US6891200B2 (en) | 2001-01-25 | 2005-05-10 | Matsushita Electric Industrial Co., Ltd. | Light-emitting unit, light-emitting unit assembly, and lighting apparatus produced using a plurality of light-emitting units |
US6791119B2 (en) | 2001-02-01 | 2004-09-14 | Cree, Inc. | Light emitting diodes including modifications for light extraction |
KR100364635B1 (ko) * | 2001-02-09 | 2002-12-16 | 삼성전자 주식회사 | 칩-레벨에 형성된 칩 선택용 패드를 포함하는 칩-레벨3차원 멀티-칩 패키지 및 그 제조 방법 |
EP1398839B1 (en) * | 2001-04-23 | 2012-03-28 | Panasonic Corporation | Light emitting device comprising light emitting diode chip |
EP1386357A1 (en) | 2001-04-23 | 2004-02-04 | Plasma Ireland Limited | Illuminator |
US6958497B2 (en) | 2001-05-30 | 2005-10-25 | Cree, Inc. | Group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures |
US6642652B2 (en) | 2001-06-11 | 2003-11-04 | Lumileds Lighting U.S., Llc | Phosphor-converted light emitting device |
DE10131698A1 (de) | 2001-06-29 | 2003-01-30 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares strahlungsemittierendes Bauelement und Verfahren zu dessen Herstellung |
TW511303B (en) * | 2001-08-21 | 2002-11-21 | Wen-Jr He | A light mixing layer and method |
WO2003021668A1 (fr) | 2001-08-31 | 2003-03-13 | Hitachi Chemical Co.,Ltd. | Tableau de connexions, dispositif a semi-conducteur et leur procede de production |
CN100423296C (zh) | 2001-09-03 | 2008-10-01 | 松下电器产业株式会社 | 半导体发光元件、发光装置及半导体发光元件的制造方法 |
US6759266B1 (en) | 2001-09-04 | 2004-07-06 | Amkor Technology, Inc. | Quick sealing glass-lidded package fabrication method |
TW517356B (en) | 2001-10-09 | 2003-01-11 | Delta Optoelectronics Inc | Package structure of display device and its packaging method |
US6531328B1 (en) * | 2001-10-11 | 2003-03-11 | Solidlite Corporation | Packaging of light-emitting diode |
JP4055405B2 (ja) | 2001-12-03 | 2008-03-05 | ソニー株式会社 | 電子部品及びその製造方法 |
TW518775B (en) | 2002-01-29 | 2003-01-21 | Chi-Hsing Hsu | Immersion cooling type light emitting diode and its packaging method |
US6924514B2 (en) | 2002-02-19 | 2005-08-02 | Nichia Corporation | Light-emitting device and process for producing thereof |
JP4269709B2 (ja) | 2002-02-19 | 2009-05-27 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
JP3801931B2 (ja) | 2002-03-05 | 2006-07-26 | ローム株式会社 | Ledチップを使用した発光装置の構造及び製造方法 |
US6949389B2 (en) | 2002-05-02 | 2005-09-27 | Osram Opto Semiconductors Gmbh | Encapsulation for organic light emitting diodes devices |
US6841802B2 (en) | 2002-06-26 | 2005-01-11 | Oriol, Inc. | Thin film light emitting diode |
KR101030068B1 (ko) | 2002-07-08 | 2011-04-19 | 니치아 카가쿠 고교 가부시키가이샤 | 질화물 반도체 소자의 제조방법 및 질화물 반도체 소자 |
DE10237084A1 (de) | 2002-08-05 | 2004-02-19 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines elektrischen Leiterrahmens und Verfahren zum Herstellen eines oberflächenmontierbaren Halbleiterbauelements |
JP2004083653A (ja) * | 2002-08-23 | 2004-03-18 | Sharp Corp | 発光装置ならびに蛍光体およびその製造方法 |
US20040038442A1 (en) | 2002-08-26 | 2004-02-26 | Kinsman Larry D. | Optically interactive device packages and methods of assembly |
EP2149906A3 (en) | 2002-08-29 | 2014-05-07 | Seoul Semiconductor Co., Ltd. | Light-emitting device having light-emitting diodes |
US7078737B2 (en) | 2002-09-02 | 2006-07-18 | Matsushita Electric Industrial Co., Ltd. | Light-emitting device |
US7264378B2 (en) | 2002-09-04 | 2007-09-04 | Cree, Inc. | Power surface mount light emitting die package |
EP1540747B1 (en) | 2002-09-19 | 2012-01-25 | Cree, Inc. | Phosphor-coated light emitting diodes including tapered sidewalls, and fabrication methods therefor |
DE10258193B4 (de) | 2002-12-12 | 2014-04-10 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen von Leuchtdioden-Lichtquellen mit Lumineszenz-Konversionselement |
JP4303550B2 (ja) | 2003-09-30 | 2009-07-29 | 豊田合成株式会社 | 発光装置 |
US6921929B2 (en) | 2003-06-27 | 2005-07-26 | Lockheed Martin Corporation | Light-emitting diode (LED) with amorphous fluoropolymer encapsulant and lens |
US7200009B2 (en) | 2003-07-01 | 2007-04-03 | Nokia Corporation | Integrated electromechanical arrangement and method of production |
DE102004034166B4 (de) * | 2003-07-17 | 2015-08-20 | Toyoda Gosei Co., Ltd. | Lichtemittierende Vorrichtung |
US7029935B2 (en) | 2003-09-09 | 2006-04-18 | Cree, Inc. | Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same |
US7183587B2 (en) | 2003-09-09 | 2007-02-27 | Cree, Inc. | Solid metal block mounting substrates for semiconductor light emitting devices |
US6972438B2 (en) * | 2003-09-30 | 2005-12-06 | Cree, Inc. | Light emitting diode with porous SiC substrate and method for fabricating |
US20050082562A1 (en) * | 2003-10-15 | 2005-04-21 | Epistar Corporation | High efficiency nitride based light emitting device |
KR100587328B1 (ko) | 2003-10-16 | 2006-06-08 | 엘지전자 주식회사 | Led 면광원 |
WO2005064666A1 (en) * | 2003-12-09 | 2005-07-14 | The Regents Of The University Of California | Highly efficient gallium nitride based light emitting diodes via surface roughening |
DE112005000370T5 (de) | 2004-02-18 | 2006-12-07 | Showa Denko K.K. | Leuchtstoff, Verfahren zur Herstellung desselben und lichtmittierende Vorrichtung unter Verwendung des Leuchtstoffs |
US7569863B2 (en) | 2004-02-19 | 2009-08-04 | Panasonic Corporation | Semiconductor light emitting device |
US20050211991A1 (en) * | 2004-03-26 | 2005-09-29 | Kyocera Corporation | Light-emitting apparatus and illuminating apparatus |
US7517728B2 (en) | 2004-03-31 | 2009-04-14 | Cree, Inc. | Semiconductor light emitting devices including a luminescent conversion element |
US20050280894A1 (en) | 2004-04-02 | 2005-12-22 | David Hartkop | Apparatus for creating a scanning-column backlight in a scanning aperture display device |
US7868343B2 (en) | 2004-04-06 | 2011-01-11 | Cree, Inc. | Light-emitting devices having multiple encapsulation layers with at least one of the encapsulation layers including nanoparticles and methods of forming the same |
JP2007535149A (ja) * | 2004-04-23 | 2007-11-29 | ライト プレスクリプションズ イノベーターズ エルエルシー | 発光ダイオード用光学マニホールド |
EP1759145A1 (en) | 2004-05-28 | 2007-03-07 | Tir Systems Ltd. | Luminance enhancement apparatus and method |
US7534633B2 (en) | 2004-07-02 | 2009-05-19 | Cree, Inc. | LED with substrate modifications for enhanced light extraction and method of making same |
CN100433383C (zh) * | 2004-08-31 | 2008-11-12 | 丰田合成株式会社 | 光发射装置及其制造方法和光发射元件 |
US7217583B2 (en) | 2004-09-21 | 2007-05-15 | Cree, Inc. | Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension |
US7372198B2 (en) * | 2004-09-23 | 2008-05-13 | Cree, Inc. | Semiconductor light emitting devices including patternable films comprising transparent silicone and phosphor |
DE102004060358A1 (de) | 2004-09-30 | 2006-04-13 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen von Lumineszenzdiodenchips und Lumineszenzdiodenchip |
US8134292B2 (en) | 2004-10-29 | 2012-03-13 | Ledengin, Inc. | Light emitting device with a thermal insulating and refractive index matching material |
US7195944B2 (en) | 2005-01-11 | 2007-03-27 | Semileds Corporation | Systems and methods for producing white-light emitting diodes |
US7221044B2 (en) | 2005-01-21 | 2007-05-22 | Ac Led Lighting, L.L.C. | Heterogeneous integrated high voltage DC/AC light emitter |
KR101047683B1 (ko) | 2005-05-17 | 2011-07-08 | 엘지이노텍 주식회사 | 와이어 본딩이 불필요한 발광소자 패키징 방법 |
US20070001182A1 (en) | 2005-06-30 | 2007-01-04 | 3M Innovative Properties Company | Structured phosphor tape article |
KR100665219B1 (ko) * | 2005-07-14 | 2007-01-09 | 삼성전기주식회사 | 파장변환형 발광다이오드 패키지 |
JP4778745B2 (ja) * | 2005-07-27 | 2011-09-21 | パナソニック株式会社 | 半導体発光装置及びその製造方法 |
US7365371B2 (en) * | 2005-08-04 | 2008-04-29 | Cree, Inc. | Packages for semiconductor light emitting devices utilizing dispensed encapsulants |
US8563339B2 (en) | 2005-08-25 | 2013-10-22 | Cree, Inc. | System for and method for closed loop electrophoretic deposition of phosphor materials on semiconductor devices |
DE102005062514A1 (de) * | 2005-09-28 | 2007-03-29 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
US7344952B2 (en) | 2005-10-28 | 2008-03-18 | Philips Lumileds Lighting Company, Llc | Laminating encapsulant film containing phosphor over LEDs |
US7511771B2 (en) * | 2005-10-31 | 2009-03-31 | Symbol Technologies, Inc. | Color image projection system and method |
KR100723247B1 (ko) | 2006-01-10 | 2007-05-29 | 삼성전기주식회사 | 칩코팅형 led 패키지 및 그 제조방법 |
TWI308401B (en) | 2006-07-04 | 2009-04-01 | Epistar Corp | High efficient phosphor-converted light emitting diode |
WO2008003176A1 (en) | 2006-07-06 | 2008-01-10 | Tir Technology Lp | Lighting device package |
JP2008166782A (ja) * | 2006-12-26 | 2008-07-17 | Seoul Semiconductor Co Ltd | 発光素子 |
US9024349B2 (en) | 2007-01-22 | 2015-05-05 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
JP2010532104A (ja) * | 2007-06-27 | 2010-09-30 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 高効率白色発光ダイオードのための光学設計 |
TWI419355B (zh) * | 2007-09-21 | 2013-12-11 | Nat Univ Chung Hsing | 高光取出率的發光二極體晶片及其製造方法 |
CN101821866B (zh) * | 2007-10-08 | 2012-05-23 | 3M创新有限公司 | 具有粘接的半导体波长转换器的发光二极管 |
US9634191B2 (en) * | 2007-11-14 | 2017-04-25 | Cree, Inc. | Wire bond free wafer level LED |
-
2008
- 2008-03-19 US US12/077,638 patent/US8637883B2/en active Active
-
2009
- 2009-03-11 JP JP2011500788A patent/JP2011515851A/ja active Pending
- 2009-03-11 WO PCT/US2009/001572 patent/WO2009117067A1/en active Application Filing
- 2009-03-11 EP EP09722318A patent/EP2266148A1/en not_active Ceased
- 2009-03-11 CN CN200980118291.1A patent/CN102037577B/zh active Active
- 2009-03-11 KR KR1020107022975A patent/KR20100129766A/ko not_active Application Discontinuation
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003532298A (ja) * | 2000-04-26 | 2003-10-28 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 発光半導体素子 |
JP2003069086A (ja) * | 2001-06-11 | 2003-03-07 | Lumileds Lighting Us Llc | コンフォーマルに被覆された蛍光変換発光半導体構造を製造するための電気泳動の使用 |
JP2005244226A (ja) * | 2004-02-23 | 2005-09-08 | Lumileds Lighting Us Llc | 波長変換型半導体発光素子 |
JP2005251875A (ja) * | 2004-03-02 | 2005-09-15 | Toshiba Corp | 半導体発光装置 |
WO2005104247A1 (ja) * | 2004-04-19 | 2005-11-03 | Matsushita Electric Industrial Co., Ltd. | Led照明光源の製造方法およびled照明光源 |
JP2006278567A (ja) * | 2005-03-28 | 2006-10-12 | Matsushita Electric Works Ltd | Ledユニット |
JP2006278751A (ja) * | 2005-03-29 | 2006-10-12 | Mitsubishi Cable Ind Ltd | GaN系半導体発光素子 |
JP2006324672A (ja) * | 2005-05-19 | 2006-11-30 | Samsung Electro Mech Co Ltd | 光抽出効率が改善された垂直構造窒化物半導体発光素子 |
JP2007035882A (ja) * | 2005-07-26 | 2007-02-08 | Matsushita Electric Works Ltd | Led照明装置 |
JP2007053358A (ja) * | 2005-08-04 | 2007-03-01 | Jung-Chieh Su | 発光素子 |
JP2007067420A (ja) * | 2005-08-26 | 2007-03-15 | Philips Lumileds Lightng Co Llc | 色変換型発光ダイオード |
JP2007116131A (ja) * | 2005-09-21 | 2007-05-10 | Sanyo Electric Co Ltd | Led発光装置 |
JP2007258701A (ja) * | 2006-03-20 | 2007-10-04 | Chi Lin Technology Co Ltd | 発光ダイオードのパッケージ構造及びその製造方法 |
JP2010521060A (ja) * | 2006-12-22 | 2010-06-17 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | フィルタを含む発光デバイス |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013183751A1 (ja) * | 2012-06-07 | 2013-12-12 | シャープ株式会社 | 蛍光体基板、発光デバイス、表示装置、及び照明装置 |
JP2014139998A (ja) * | 2013-01-21 | 2014-07-31 | Toshiba Corp | 半導体発光装置 |
JP2015111659A (ja) * | 2013-10-28 | 2015-06-18 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
JP2017515310A (ja) * | 2014-04-30 | 2017-06-08 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | 照明装置および照明装置を製造する方法 |
US10374196B2 (en) | 2014-04-30 | 2019-08-06 | Osram Opto Semiconductors Gmbh | Lighting device with color scattering layer and method for producing a lighting device |
JP2016001720A (ja) * | 2014-05-21 | 2016-01-07 | 日亜化学工業株式会社 | 発光装置の製造方法 |
JP2020184544A (ja) * | 2015-02-04 | 2020-11-12 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツングMerck Patent Gesellschaft mit beschraenkter Haftung | 電子素子における半導体粒子 |
JP2018128617A (ja) * | 2017-02-10 | 2018-08-16 | 信越化学工業株式会社 | 波長変換部材及びled発光装置 |
KR20190074371A (ko) * | 2017-12-20 | 2019-06-28 | 엘지디스플레이 주식회사 | 발광 소자 및 조명 장치 |
KR102513102B1 (ko) | 2017-12-20 | 2023-03-22 | 엘지디스플레이 주식회사 | 발광 소자 및 조명 장치 |
Also Published As
Publication number | Publication date |
---|---|
KR20100129766A (ko) | 2010-12-09 |
EP2266148A1 (en) | 2010-12-29 |
US20090236621A1 (en) | 2009-09-24 |
WO2009117067A1 (en) | 2009-09-24 |
US8637883B2 (en) | 2014-01-28 |
CN102037577A (zh) | 2011-04-27 |
CN102037577B (zh) | 2014-08-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2011515851A (ja) | Ledデバイスの低屈折率スペーサ層 | |
EP2113949B1 (en) | Encapsulation for phosphor-converted white light emitting diode | |
JP5951180B2 (ja) | 飽和変換材料を有するエミッタパッケージ | |
TWI506831B (zh) | 發光裝置 | |
JP2009510744A (ja) | 放射放出オプトエレクトロニクス素子 | |
US11081626B2 (en) | Light emitting diode packages | |
EP3782207A1 (en) | Light-emitting diode package with light-altering material | |
US20220165923A1 (en) | Cover structure arrangements for light emitting diode packages | |
US10283681B2 (en) | Phosphor-converted light emitting device | |
US11688832B2 (en) | Light-altering material arrangements for light-emitting devices | |
TWI515928B (zh) | 輻射發射組件 | |
EP4264685A1 (en) | Light emitting diode packages with support structure | |
US20230080947A1 (en) | Cover structure arrangements for light emitting diode packages | |
US10879424B2 (en) | Radiation-emitting semiconductor chip, optoelectronic component comprising a radiation-emitting semiconductor chip, and method of coating a radiation-emitting semiconductor chip | |
US11367810B2 (en) | Light-altering particle arrangements for light-emitting devices | |
US20220254962A1 (en) | Optical arrangements in cover structures for light emitting diode packages and related methods | |
US11705542B2 (en) | Binder materials for light-emitting devices | |
US12051770B2 (en) | Integration of secondary optics into chip covers for improved optical emission of high intensity light-emitting diodes | |
US20240213401A1 (en) | Textured lumiphore layer to improve light extraction for light-emitting diode chips and related methods |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120529 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120531 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120829 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20121001 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20121022 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20121211 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130311 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20130702 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131105 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20131112 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20131206 |