JP2011258793A - ロボットアーム - Google Patents
ロボットアーム Download PDFInfo
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- JP2011258793A JP2011258793A JP2010132695A JP2010132695A JP2011258793A JP 2011258793 A JP2011258793 A JP 2011258793A JP 2010132695 A JP2010132695 A JP 2010132695A JP 2010132695 A JP2010132695 A JP 2010132695A JP 2011258793 A JP2011258793 A JP 2011258793A
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- 210000000245 forearm Anatomy 0.000 claims abstract description 138
- 239000004065 semiconductor Substances 0.000 claims abstract description 22
- 235000012431 wafers Nutrition 0.000 claims description 22
- 230000032258 transport Effects 0.000 claims 1
- 238000011109 contamination Methods 0.000 abstract description 5
- 238000012423 maintenance Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 7
- 239000000314 lubricant Substances 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/0066—Means or methods for maintaining or repairing manipulators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/08—Programme-controlled manipulators characterised by modular constructions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
- B25J9/1065—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S901/00—Robots
- Y10S901/27—Arm part
- Y10S901/28—Joint
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】ロボットアーム100は、半導体ウエハを搬送するロボットアームであり、ハンド2と前腕リンク10と上腕リンク14を備えている。ハンド2は、第1関節20を介して前腕リンク10に連結している。上腕リンク14は、第2関節11を介して前腕リンク10に連結している。ロボットアーム100では、前腕リンク10が、第1関節20と第2関節11の間で分割可能に構成されている。
【選択図】図1
Description
(特徴1)ロボットアームは、第1軸受と第2軸受の軸線が鉛直方向に伸びており、ハンドが水平面内で移動する水平移動型ロボットである。
(特徴2)前腕リンク先端部と後端部がオーバーラップしている部分の厚みは、オーバーラップしている部分に隣接する非オーバーラップ部分の厚みに等しい。
(特徴3)前腕リンク先端部が、前腕リンク後端部の上側に位置している。
(特徴4)前腕リンク先端部と前腕リンク後端部とが複数のボルトによって固定されており、複数のボルトが、前腕リンクの長手方向において位置決めピンの両側に配置されている。
(特徴5)位置決めピンが、前腕リンク後端部に固定されている。従って、前腕リンク先端部と前腕リンク後端部を分割する際、位置決めピンは前腕リンク先端部から外れる。
6:前腕リンク先端部
8:前腕リンク後端部
10:前腕リンク
11:第2関節
14:上腕リンク
20:第1関節
30:位置決めピン
34:第1軸受
100:ロボットハンド
Claims (2)
- 半導体ウエハを搬送するロボットアームであり、
半導体ウエハを把持するためのハンドと、
第1関節を介してハンドに連結している前腕リンクと、
第2関節を介して前腕リンクに連結している上腕リンクと、を備えており、
前腕リンクが、第1関節と第2関節の間で分割可能に構成されていることを特徴とするロボットアーム。 - 上腕リンクに連結している前腕リンク後端部とハンドに連結している前腕リンク先端部とが、前腕リンクの長手方向に直交する方向でオーバーラップしており、
前記後端部と前記先端部とのオーバーラップ部分に、複数の位置決めピンが挿入されていることを特徴とする請求項1に記載のロボットアーム。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010132695A JP5525339B2 (ja) | 2010-06-10 | 2010-06-10 | ロボットアーム |
CN201180028549.6A CN102934215B (zh) | 2010-06-10 | 2011-05-24 | 机械手 |
PCT/JP2011/061828 WO2011155320A1 (ja) | 2010-06-10 | 2011-05-24 | ロボットアーム |
KR1020137000503A KR101423006B1 (ko) | 2010-06-10 | 2011-05-24 | 로봇 아암 |
US13/703,161 US8915693B2 (en) | 2010-06-10 | 2011-05-24 | Robot arm having lower arm link separable into two parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010132695A JP5525339B2 (ja) | 2010-06-10 | 2010-06-10 | ロボットアーム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011258793A true JP2011258793A (ja) | 2011-12-22 |
JP5525339B2 JP5525339B2 (ja) | 2014-06-18 |
Family
ID=45097928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010132695A Active JP5525339B2 (ja) | 2010-06-10 | 2010-06-10 | ロボットアーム |
Country Status (5)
Country | Link |
---|---|
US (1) | US8915693B2 (ja) |
JP (1) | JP5525339B2 (ja) |
KR (1) | KR101423006B1 (ja) |
CN (1) | CN102934215B (ja) |
WO (1) | WO2011155320A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017138651A1 (ja) | 2016-02-10 | 2017-08-17 | 株式会社国際電気通信基礎技術研究所 | 回転構造、アシストシステム、および、ロボット |
JP2018530440A (ja) * | 2015-09-30 | 2018-10-18 | ワルター マシーネンバオ ゲーエムベーハー | 加工片を移送するための移送装置 |
JP2019519913A (ja) * | 2016-05-05 | 2019-07-11 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 亀裂が低減されたロボットサブアセンブリ、エンドエフェクタアセンブリ、及び方法 |
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US8915693B2 (en) | 2014-12-23 |
KR20130041081A (ko) | 2013-04-24 |
JP5525339B2 (ja) | 2014-06-18 |
CN102934215B (zh) | 2015-08-26 |
CN102934215A (zh) | 2013-02-13 |
KR101423006B1 (ko) | 2014-07-23 |
US20130084156A1 (en) | 2013-04-04 |
WO2011155320A1 (ja) | 2011-12-15 |
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