JP6276090B2 - 搬送装置、搬送システム - Google Patents
搬送装置、搬送システム Download PDFInfo
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- JP6276090B2 JP6276090B2 JP2014071917A JP2014071917A JP6276090B2 JP 6276090 B2 JP6276090 B2 JP 6276090B2 JP 2014071917 A JP2014071917 A JP 2014071917A JP 2014071917 A JP2014071917 A JP 2014071917A JP 6276090 B2 JP6276090 B2 JP 6276090B2
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- 229910001220 stainless steel Inorganic materials 0.000 description 3
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/06—Programme-controlled manipulators characterised by multi-articulated arms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J5/00—Manipulators mounted on wheels or on carriages
- B25J5/02—Manipulators mounted on wheels or on carriages travelling along a guideway
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Machine Tool Units (AREA)
Description
図1〜図4を用いて、本発明の第1実施形態について説明する。
図5、図6を用いて、本発明の第1実施形態の第1変形例について説明する。
図7、図8を用いて、本発明の第1実施形態の第2変形例について説明する。
図9を用いて、本発明の第1実施形態の第3変形例について説明する。
図10を用いて、本発明の第1実施形態の第4変形例について説明する。
図11、図12を用いて、本発明の第2実施形態について説明する。
100,101,102,103,104,200 搬送装置
18A 第1カント面
18B 第2カント面
2 ガイド機構
2A 第1ガイド部
2B 第2ガイド部
4 移動体
41A 第1支持体
411A 第1係合部
413A 第1取付板
414A 支持箇所
415A 第1間座
416A 第1中間部材
417A,418A 第1カント面
419A 第1段差部
41B 第2支持体
411B 第2係合部
413B 第2取付板
414B 支持箇所
415B 第2間座
416B 第2中間部材
417B,418B 第2カント面
419B 第2段差部
45 保持部
451 ホルダ
453 エンドエフェクタ
6A 第1軸受
6B 第2軸受
7 胴体
800 搬送システム
830 ワーク収容機構
831,832 ワーク格納装置
89 ワーク
M11,M21 モーメント
M12 第1逆方向モーメント
M22 第2逆方向モーメント
N1,N2,Z1,Z2 方向
X 第1方向
Y 第2方向
Claims (12)
- ガイド機構と、前記ガイド機構にガイドされて移動する移動体と、を備え、
前記移動体は、
前記ガイド機構に係合している第1係合部を有し、第1方向に沿って移動可能に前記ガイド機構に支持された第1支持体と、
前記ガイド機構に係合している第2係合部を有し、前記第1方向に沿って移動可能に前記ガイド機構に支持された第2支持体と、
前記第1支持体および前記第2支持体に支持された、ワークを保持するための保持部と、を含み、
前記第1係合部には、前記移動体の変形によって、第1逆方向モーメントが負荷され、
前記第1逆方向モーメントは、前記ワークが前記保持部に保持されている場合に前記ワークの荷重によって前記第1係合部に負荷されるモーメントとは、逆方向のモーメントである、搬送装置。 - 前記第2係合部には、前記移動体の変形によって、第2逆方向モーメントが負荷され、
前記第2逆方向モーメントは、前記ワークが前記保持部に保持されている場合に前記ワークの荷重によって前記第2係合部に負荷されるモーメントとは、逆方向のモーメントである、請求項1に記載の搬送装置。 - 前記移動体は、弾性変形した状態で保持されている、請求項1または請求項2に記載の搬送装置。
- 前記ガイド機構は、各々が前記第1方向に沿って延びている第1ガイド部および第2ガイド部を含み、
前記第1ガイド部および前記第2ガイド部は、前記第1方向に直交する第2方向に互いに離間しており、
前記第1ガイド部は、前記第1係合部に係合しており、前記第2ガイド部は、前記第2係合部に係合している、請求項1ないし請求項3のいずれかに記載の搬送装置。 - 前記第1支持体における前記保持部の支持箇所は、重力方向上方から重力方向下方を見た場合、前記第1係合部とは異なる位置に位置しており、
前記第2支持体における前記保持部の支持箇所は、重力方向上方から重力方向下方を見た場合、前記第2係合部とは異なる位置に位置している、請求項1ないし請求項4のいずれかに記載の搬送装置。 - 前記ガイド機構は、前記第1方向に沿って延びている第1ガイド部を含み、
前記第1係合部および前記第2係合部はいずれも、前記第1ガイド部に係合している、請求項1ないし請求項3のいずれかに記載の搬送装置。 - 前記第1支持体は、第1取付板と、第1間座と、を有し、前記第2支持体は、第2取付板と、第2間座と、を有し、
前記第1取付板は、前記第1係合部に取り付けられており、
前記第1間座は、前記保持部を支持し、且つ、重力方向上方から重力方向下方を見た場合、前記第1係合部とは異なる位置にて前記第1取付板に取り付けられており、
前記第2取付板は、前記第2係合部に取り付けられており、
前記第2間座は、前記保持部を支持し、且つ、重力方向上方から重力方向下方を見た場合、前記第2係合部とは異なる位置にて前記第2取付板に取り付けられている、請求項1ないし請求項6のいずれかに記載の搬送装置。 - 前記第1係合部および前記ガイド機構の間に介在する第1軸受と、
前記第2係合部および前記ガイド機構の間に介在する第2軸受と、を更に備える、請求項1ないし請求項7のいずれかに記載の搬送装置。 - 前記ガイド機構を支持する基体を更に備え、
前記第1係合部と前記保持部との間、あるいは、前記ガイド機構と前記基体との間には、第1カント面が形成され、
前記第2係合部と前記保持部との間、あるいは、前記ガイド機構と前記基体との間には第2カント面が形成されている、請求項1ないし請求項8のいずれかに記載の搬送装置。 - 前記ガイド機構を支持する基体を更に備え、
前記第1係合部と前記保持部との間、あるいは、前記ガイド機構と前記基体との間には、第1段差部が形成され、
前記第2係合部と前記保持部との間、あるいは、前記ガイド機構と前記基体との間には第2段差部が形成されている、請求項1ないし請求項8のいずれかに記載の搬送装置。 - 前記保持部は、ホルダと、前記ワークを保持するエンドエフェクタを有し、
前記ホルダは、前記第1支持体および前記第2支持体に支持されており、
前記エンドエフェクタは、前記ホルダにつながり、且つ、前記第1方向に沿って延びている、請求項1ないし請求項10のいずれかに記載の搬送装置。 - 請求項1ないし請求項11のいずれかに記載の搬送装置と、
前記搬送装置によって搬送されたワークを収容するワーク収容機構と、を備える、搬送システム。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014071917A JP6276090B2 (ja) | 2014-03-31 | 2014-03-31 | 搬送装置、搬送システム |
TW104106177A TWI628131B (zh) | 2014-03-31 | 2015-02-26 | Handling device, handling system |
KR1020150033358A KR102229722B1 (ko) | 2014-03-31 | 2015-03-10 | 반송 장치 및 반송 시스템 |
US14/670,741 US9550296B2 (en) | 2014-03-31 | 2015-03-27 | Conveying apparatus and conveying system with cant surfaces |
CN201510143784.8A CN104944160B (zh) | 2014-03-31 | 2015-03-30 | 输送装置和输送系统 |
US15/378,254 US10160118B2 (en) | 2014-03-31 | 2016-12-14 | Conveying apparatus and conveying system with two support regions |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2014071917A JP6276090B2 (ja) | 2014-03-31 | 2014-03-31 | 搬送装置、搬送システム |
Publications (2)
Publication Number | Publication Date |
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JP2015195257A JP2015195257A (ja) | 2015-11-05 |
JP6276090B2 true JP6276090B2 (ja) | 2018-02-07 |
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Country | Link |
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US (2) | US9550296B2 (ja) |
JP (1) | JP6276090B2 (ja) |
KR (1) | KR102229722B1 (ja) |
CN (1) | CN104944160B (ja) |
TW (1) | TWI628131B (ja) |
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TWI637418B (zh) * | 2017-03-31 | 2018-10-01 | 群光電子股份有限公司 | 插件機之抓取裝置與插件方法 |
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JP4971063B2 (ja) * | 2007-07-27 | 2012-07-11 | 株式会社ダイヘン | 搬送装置 |
JP4688004B2 (ja) * | 2008-04-22 | 2011-05-25 | 株式会社ダイフク | 物品搬送装置 |
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2014
- 2014-03-31 JP JP2014071917A patent/JP6276090B2/ja active Active
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2015
- 2015-02-26 TW TW104106177A patent/TWI628131B/zh active
- 2015-03-10 KR KR1020150033358A patent/KR102229722B1/ko active IP Right Grant
- 2015-03-27 US US14/670,741 patent/US9550296B2/en active Active
- 2015-03-30 CN CN201510143784.8A patent/CN104944160B/zh active Active
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2016
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US20150273699A1 (en) | 2015-10-01 |
KR20150113833A (ko) | 2015-10-08 |
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US20170087727A1 (en) | 2017-03-30 |
TW201604110A (zh) | 2016-02-01 |
US9550296B2 (en) | 2017-01-24 |
KR102229722B1 (ko) | 2021-03-18 |
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US10160118B2 (en) | 2018-12-25 |
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