CN102934215A - 机械手 - Google Patents
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- CN102934215A CN102934215A CN2011800285496A CN201180028549A CN102934215A CN 102934215 A CN102934215 A CN 102934215A CN 2011800285496 A CN2011800285496 A CN 2011800285496A CN 201180028549 A CN201180028549 A CN 201180028549A CN 102934215 A CN102934215 A CN 102934215A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
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- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/0066—Means or methods for maintaining or repairing manipulators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/08—Programme-controlled manipulators characterised by modular constructions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
- B25J9/1065—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
本申请的机械手用于输送半导体晶圆。该机械手包括手部、前臂连杆以及上臂连杆。手部经由第1关节而连结于前臂连杆。上臂连杆经由第2关节而连结于前臂连杆。在本申请的机械手中,前臂连杆能够在第1关节与第2关节之间的位置分开。
Description
技术领域
本申请基于2010年6月10日提出申请的日本特许出愿第2010-132695号要求优先权。以参照的方式在本说明书中引用该申请的所有内容。本申请涉及一种机械手。尤其是涉及一种用于输送半导体晶圆的机械手。
背景技术
公知有用于输送半导体晶圆的机械手。具体地,该机械手将半导体晶圆插入到处理室(process chamber),或者将半导体晶圆从处理室中取出。传送室(transfer chamber)连结于处理室。机械手配置在该传送室内。利用机械手使半导体晶圆在传送室与处理室之间移动。传送室相当于小的无尘室。传送室防止灰尘等杂质附着于半导体晶圆。在传送室内保持空气(或者气体)清洁。另外,传送室内有时被保持为真空。要求使在传送室内工作的机械手不产生杂质的方法。
输送半导体晶圆的机械手通常具有两个以上的自由度。这种机械手典型地由两个连杆和手部构成。在本说明书中,将两个连杆称作上臂连杆和前臂连杆。典型地,上臂连杆的一端连结于电机的输出轴,上臂连杆的另一端连结于前臂连杆的一端。而且,前臂连杆的另一端连结于手部。上臂连杆和前臂连杆经由关节而连结。前臂连杆和手部也经由关节而连结。在各个关节处安装有轴承,以便使连杆顺畅地旋转。在日本特开2000-150617号公报和日本特开2000-195923号公报中公开了这种机械手的一例。在输送半导体晶圆的机械手中,为了不污染传送室内而屏蔽(shield)安装于关节的轴承。
半导体晶圆有时在处理室内暴露在高温中。因此,机械手有时输送高温的半导体晶圆。若高温的半导体晶圆与手部接触,则手部的温度上升,并且配置在前臂连杆与手部之间的关节的温度也上升。由此,安装于关节的轴承的温度上升。轴承的温度上升促进该轴承内的润滑剂的劣化。因此,与配置在上臂连杆与前臂连杆之间的关节的轴承相比,配置在前臂连杆和手部之间的关节的轴承的维护频率较高。
发明内容
如上所述,机械手配置在内部保持清洁的传送室内。为了对关节的轴承进行维护而需要拆开关节。若在传送室内对关节的轴承进行维护,则会污染传送室内。本说明书所公开的技术提供一种能够在进行轴承的维护时抑制传送室内的污染的机械手。
本说明书所公开的机械手用于输送半导体晶圆,其包括手部、前臂连杆以及上臂连杆。用于把持半导体晶圆的手部经由关节而连结于前臂连杆。上臂连杆经由关节而连结于前臂连杆。在以下的说明中,将连接手部和前臂连杆的关节称作第1关节,将连接前臂连杆和上臂连杆的关节称作第2关节。在本说明书所公开的机械手中,前臂连杆构成为能够在第1关节与第2关节之间的位置分开。
在上述的机械手中,通过使前臂连杆分开而能够在维持手部与前臂连杆之间的连结的状态下从传送室内取出手部和前臂连杆。能够不拆开第1关节地将第1关节从传送室取出。之后,能够在传送室外进行第1关节内的轴承的维护作业。根据本说明书所公开的技术,能够抑制传送室内的污染。此外,可以预先准备通过组装前臂连杆的顶端部、第1关节以及手部而成的更换部件,在进行维护作业时与传送室内的顶端部进行更换。
如上所述,在本说明书所公开的机械手中,前臂连杆构成为能够在第1关节与第2关节之间的位置分开。在以下的说明中,将连结于上臂连杆的前臂连杆称作前臂连杆后端部,将连结于手部的前臂连杆称作前臂连杆顶端部。在本说明书所公开的机械手中,前臂连杆后端部和前臂连杆顶端部在与前臂连杆的长度方向正交的方向上重叠即可。在该情况下,优选的是,在前臂连杆后端部与前臂连杆顶端部的重叠部分插入有多个定位销。在再次组装前臂连杆后端部和前臂连杆顶端部时,能够利用多个定位销准确地对前臂连杆后端部和前臂连杆顶端部这两者进行定位。
本说明书所公开的技术能够实现一种能够抑制传送室内的污染的机械手。
附图说明
图1表示机械手的俯视图。
图2表示机械手的侧视图。
图3表示沿着图1的III-III线的剖视图。
图4表示用于说明将前臂连杆顶端部安装于前臂连杆后端部的顺序的剖视图。
具体实施方式
以下简单记录实施例所说明的机械手的技术特征。
(特征1)机械手是第1轴承和第2轴承的轴线沿铅垂方向延伸、且手部在水平面内移动的水平移动型机器人。
(特征2)前臂连杆顶端部和后端部重叠的部分的厚度与邻接于重叠部分的非重叠部分的厚度相等。
(特征3)前臂连杆顶端部位于前臂连杆后端部的上侧。
(特征4)前臂连杆顶端部和前臂连杆后端部由多个螺栓固定,多个螺栓在前臂连杆的长度方向上配置在定位销的两侧。
(特征5)定位销固定在前臂连杆后端部。因而,在分开前臂连杆顶端部与前臂连杆后端部时,定位销从前臂连杆顶端部脱落。
参照图1和图2说明机械手100。机械手100包括上臂连杆14、前臂连杆10以及手部2。机械手100安装于支承箱22。上臂连杆14由第1上臂连杆14a和第2上臂连杆14b构成。用于驱动第2上臂连杆14b的电机配置在支承箱22内。
前臂连杆10由第1前臂连杆10a和第2前臂连杆10b构成。第1前臂连杆10a和第2前臂连杆10b一直维持平行。前臂连杆10(第1前臂连杆10a和第2前臂连杆10b)的一端经由第1关节20而连结于手部2。前臂连杆10的另一端经由第2关节11而连接于上臂连杆14。
第1前臂连杆10a由第1前臂连杆后端部8a和第1前臂连杆顶端部6a构成。第2前臂连杆10b由第2前臂连杆后端部8b和第2前臂连杆顶端部6b构成。在以下的说明中,有时将第1前臂连杆后端部8a和第2前臂连杆后端部8b仅称作前臂连杆后端部8。有时将第1前臂连杆顶端部6a和第2前臂连杆顶端部6b仅称作前臂连杆顶端部6。
在第2关节11中配置有第2轴承(省略图示)。第2轴承使前臂连杆10相对于上臂连杆14顺畅地旋转。在第1关节20中配置有第1轴承。第1轴承使手部2相对于前臂连杆10顺畅地旋转。
第1上臂连杆14a和第2上臂连杆14b一直维持平行。第1上臂连杆14a的一端连结于支承箱。第2上臂连杆14b的一端16连结于电机(省略图示)。图1的附图标记17表示第2上臂连杆14b的旋转轴。电机使第2上臂连杆14b进行旋转。能够将第2上臂连杆14b视为被电机驱动的驱动连杆。另外,能够将第1上臂连杆14a视为伴随着驱动连杆(第2上臂连杆14b)的动作而动作的从动连杆。电机驱动第2上臂连杆14b,从而使上臂连杆14在水平面内移动。由此,能够使手部2在水平面内沿图1的X方向移动。机械手100具备调整连杆12。虽然省略详细的说明,但是调整连杆12由多个连杆组构成,且使上臂连杆14和前臂连杆10相连接。调整连杆12将电机的旋转转换为手部2的直进运动。机械手100能够使手部2在水平面内移动,因此有时称作水平移动型机械手。
机械手100配置在传送室(省略图示)内,用于输送半导体晶圆。有时在手部2上载置高温的半导体晶圆。若高温的半导体晶圆与手部2接触,则手部2的温度上升。
如上所述,前臂连杆10由前臂连杆后端部8和前臂连杆顶端部6构成。前臂连杆后端部8和前臂连杆顶端部6能够在第1关节20与第2关节11之间的位置分开。具体地,前臂连杆后端部8和前臂连杆顶端部6能够在第1关节20与第2关节11的大致中间点分开。如上所述,前臂连杆10的另一端(前臂连杆顶端部6)经由第1关节20而连结于手部2。因此,能够在利用第1关节20连接前臂连杆顶端部6和手部2的状态下将上述构件从传送室内取出。在以下的说明中,有时将前臂连杆顶端部6、第1关节20以及手部2一并称作臂顶端单元4。通过使机械手100的前臂连杆后端部8与前臂连杆顶端部6分开,能够从传送室内取出臂顶端单元4。
参照图3说明前臂连杆后端部8和臂顶端单元4。如上所述,臂顶端单元4由前臂连杆顶端部6、第1关节20以及手部2构成。第1关节20包括基部23和固定于基部23的圆柱部24(24a、24b)。在圆柱部24与前臂连杆顶端部6(6a、6b)之间配置有一对第1轴承34。第1轴承34为圆柱滚子轴承。此外,第1前臂连杆顶端部6a经由第1轴承34a将圆柱部24a支承为能够旋转。第2前臂连杆顶端部6b经由第1轴承34b将圆柱部24b支承为能够旋转。圆柱部24a和圆柱部24b沿着手部2进行往返移动(直进运动)的方向X配置。
如上所述,若高温的半导体晶圆与手部2相接触,则手部2的温度上升。伴随着手部2的温度上升,第1关节20的温度上升。另外,基于来自半导体晶圆、处理室等的辐射热,手部2或第1关节20附近的温度也会上升。基于半导体晶圆的温度,第1关节20附近的温度有时上升至200℃以上。有时第1轴承34的温度也上升,导致第1轴承34内的润滑剂劣化。在机械手100中,能够在连结前臂连杆顶端部6和手部2的状态下从前臂连杆后端部8拆卸臂顶端单元4。因此,能够在从传送室取出臂顶端单元4之后拆开第1关节20来对第1轴承34进行维护。即,不需要在传送室内进行第1轴承34的维护作业。与以往的机械手相比,机械手100能够抑制传送室内的污染。
在机械手100中,从传送室内取出臂顶端单元4,在传送室外进行第1轴承34的维护。将进行维护之后的臂顶端单元4安装于前臂连杆后端部8。由于不在传送室内进行第1轴承34的维护,因而第1轴承34内的润滑剂等不会向传送室内飞散。此外,也可以预先准备从前臂连杆后端部8卸除的臂顶端单元4之外的其它臂顶端单元4。而且,也可以在拆除臂顶端单元4的作业之后将已完成维护的其它臂顶端单元4安装于前臂连杆后端部8。能够缩短臂顶端单元4的更换时间。
在以往的机械手中,只要向传送室外取出机械手整体,也能够不污染传送室内地进行轴承的维护。如上所述,第1轴承34的润滑材料的劣化伴随着用于把持高温晶圆的手部2的温度上升而产生。第2关节11内的第2轴承距离手部2的距离比第1轴承34距离手部2的距离远。因此,第2关节11内的第2轴承进行维护的频率小于第1轴承34的频率即可。在以往的机械手中,为了在传送室外进行第1轴承的维护,甚至需要将无需进行维护的零件(上臂连杆、第2轴承等)也取出到传送室外。但是,在机械手100中,能够在将第2轴承(第2关节11)留在传送室内的状态下将第1轴承34(第1关节20)取出到传送室外。因此,与以往的机械手相比,能够容易地进行维护作业。
对机械手100的另一特征进行说明。如图3所示,前臂连杆后端部8的一部分(前臂连杆后端部8之中的靠近手部2的部分)和前臂连杆顶端部6的一部分(前臂连杆顶端部6之中的远离手部2的部分)在范围7内重叠。在以下的说明中,有时将范围7称作重叠部分7。在重叠部分7中,前臂连杆顶端部6和前臂连杆后端部8在与前臂连杆10的长度方向正交的方向上重叠。更准确地说,前臂连杆顶端部6和前臂连杆后端部8在与手部2移动的平面(水平面)正交的方向上重叠。即,在俯视机械手100时,前臂连杆顶端部6的一部分和前臂连杆后端部8的一部分重叠。在机械手100中,前臂连杆顶端部6位于比前臂连杆后端部8靠上侧的位置。因此,在从机械手100拆卸臂顶端单元4时容易进行作业。同样地,将臂顶端单元4安装于前臂连杆后端部8时也容易进行作业。
在重叠部分7中,两个定位销30嵌入前臂连杆后端部8和前臂连杆顶端部6这两者。利用定位销30抑制前臂连杆后端部8和前臂连杆顶端部6的位置偏移。换言之,能够利用定位销30抑制前臂连杆后端部8与前臂连杆顶端部6的相对角度发生变化。
在重叠部分7中的前臂连杆后端部8的厚度T 78约为与重叠部分7相邻的位置(非重叠部分)处的前臂连杆后端部8的厚度T8的一半。另外,在重叠部分7中的前臂连杆顶端部6的厚度T 76约为非重叠部分的前臂连杆顶端部6的厚度T6的一半。厚度T8与厚度T6相等。因此,在与供手部2移动的平面正交的方向上,厚度T8、厚度T6以及重叠部分7的厚度相等。即,在前臂连杆10的长度方向上,前臂连杆10的厚度恒定。根据该特征,在手部2进行往返移动时,能够防止前臂连杆10与其他的连杆发生干扰。此外,与供手部2移动的平面正交的方向相当于铅垂方向。
如图4所示,定位销30固定于前臂连杆后端部8。因而,若使前臂连杆后端部8与前臂连杆顶端部6(臂顶端单元4)分开,则定位销30从前臂连杆顶端部6脱离。因此,在将前臂连杆顶端部6(臂顶端单元4)安装于前臂连杆后端部8时,能够一边目视定位销30的位置一边安装前臂连杆顶端部6(臂顶端单元4)。在前臂连杆顶端部6上设有销贯通孔42。通过将定位销30嵌入销贯通孔42内来确定前臂连杆顶端部6(臂顶端单元4)相对于前臂连杆后端部8的位置。
在前臂连杆10的长度方向上,两个螺栓槽44形成于前臂连杆后端部8。两个螺栓槽44形成在定位销的两侧。在前臂连杆顶端部6,两个螺栓孔40形成在销贯通孔42的两侧。在将臂顶端单元4安装于前臂连杆后端部8时,在将定位销30插入销贯通孔42之后将螺栓32固定于螺栓槽44。若将臂顶端单元4安装于前臂连杆后端部8,则如图3所示,两个螺栓32在前臂连杆10的长度方向上位于定位销30的两侧。因此,即使手部2在机械手100的使用过程中扭曲,也能够抑制向定位销30施力的情况。由于抑制了定位销30进行变形,因而即使反复进行第1轴承34的维护,也能够抑制手部2的位置偏移。
以上,虽详细说明了本发明的具体例,但这些只不过是例示,并不限定权利要求的范围。在权利要求书所记载的技术中包括对以上例示的具体例进行各种变形、变更而得到的技术。在本说明书或附图中说明的技术要素单独或者通过各种组合而发挥技术方面的实用性,且不限定于提出申请时的权利要求所记载的组合。另外,在本说明书或附图中例示的技术同时达到多个目的,达到其中一个目的本身具有技术实用性。
Claims (5)
1.一种用于输送半导体晶圆的机械手,其特征在于,
该机械手包括:
手部,其用于把持半导体晶圆;
前臂连杆,其经由第1关节而连结于手部;以及
上臂连杆,其经由第2关节而连结于前臂连杆;
前臂连杆构成为能够在第1关节与第2关节之间的位置分开。
2.根据权利要求1所述的机械手,其特征在于,
连结于上臂连杆的前臂连杆后端部和连结于手部的前臂连杆顶端部在与前臂连杆的长度方向正交的方向上重叠,
在上述后端部与上述顶端部的重叠部分插入有多个定位销。
3.根据权利要求2所述的机械手,其特征在于,
前臂连杆顶端部和前臂连杆后端部由多个螺栓固定,
上述多个螺栓在前臂连杆的长度方向上配置在定位销的两侧。
4.根据权利要求2或3所述的机械手,其特征在于,
前臂连杆顶端部位于前臂连杆后端部的上侧。
5.根据权利要求2~4中任一项所述的机械手,其特征在于,
定位销固定于前臂连杆后端部,定位销与前臂连杆顶端部构成为能够分开。
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Also Published As
Publication number | Publication date |
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KR101423006B1 (ko) | 2014-07-23 |
US20130084156A1 (en) | 2013-04-04 |
JP5525339B2 (ja) | 2014-06-18 |
US8915693B2 (en) | 2014-12-23 |
CN102934215B (zh) | 2015-08-26 |
WO2011155320A1 (ja) | 2011-12-15 |
KR20130041081A (ko) | 2013-04-24 |
JP2011258793A (ja) | 2011-12-22 |
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