JP2010536178A5 - - Google Patents

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JP2010536178A5
JP2010536178A5 JP2010520232A JP2010520232A JP2010536178A5 JP 2010536178 A5 JP2010536178 A5 JP 2010536178A5 JP 2010520232 A JP2010520232 A JP 2010520232A JP 2010520232 A JP2010520232 A JP 2010520232A JP 2010536178 A5 JP2010536178 A5 JP 2010536178A5
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semiconductor
conductive
semiconductor device
semiconductor die
conductive line
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JP2010520232A
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JP5723153B2 (ja
JP2010536178A (ja
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JP2010520232A 2007-08-07 2008-08-01 スルーボディ導電性ビアを備えたパッケージ化された集積回路デバイス、及び、それを製造する方法 Active JP5723153B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/834,765 US7781877B2 (en) 2007-08-07 2007-08-07 Packaged integrated circuit devices with through-body conductive vias, and methods of making same
US11/834,765 2007-08-07
PCT/US2008/071994 WO2009045626A1 (en) 2007-08-07 2008-08-01 Packaged integrated circuit devices with through- body conductive vias, and methods of making same

Publications (3)

Publication Number Publication Date
JP2010536178A JP2010536178A (ja) 2010-11-25
JP2010536178A5 true JP2010536178A5 (enExample) 2011-09-22
JP5723153B2 JP5723153B2 (ja) 2015-05-27

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JP2010520232A Active JP5723153B2 (ja) 2007-08-07 2008-08-01 スルーボディ導電性ビアを備えたパッケージ化された集積回路デバイス、及び、それを製造する方法

Country Status (7)

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US (8) US7781877B2 (enExample)
EP (2) EP2186135A1 (enExample)
JP (1) JP5723153B2 (enExample)
KR (1) KR101722264B1 (enExample)
CN (1) CN101772841B (enExample)
TW (1) TWI437683B (enExample)
WO (1) WO2009045626A1 (enExample)

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