JP2010271732A - 半導体素子の接触部及びその製造方法並びに表示装置用薄膜トランジスタ表示板及びその製造方法 - Google Patents
半導体素子の接触部及びその製造方法並びに表示装置用薄膜トランジスタ表示板及びその製造方法 Download PDFInfo
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- 239000010409 thin film Substances 0.000 title claims abstract description 134
- 239000004065 semiconductor Substances 0.000 title claims abstract description 83
- 238000004519 manufacturing process Methods 0.000 title abstract description 40
- 239000010408 film Substances 0.000 claims abstract description 272
- 230000001681 protective effect Effects 0.000 claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 229910052782 aluminium Inorganic materials 0.000 claims description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 19
- 239000011651 chromium Substances 0.000 claims description 16
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 13
- 229910052804 chromium Inorganic materials 0.000 claims description 13
- 239000004020 conductor Substances 0.000 description 64
- 238000003860 storage Methods 0.000 description 50
- 239000003990 capacitor Substances 0.000 description 47
- 238000005530 etching Methods 0.000 description 35
- 229910021417 amorphous silicon Inorganic materials 0.000 description 31
- 239000012535 impurity Substances 0.000 description 28
- 239000004973 liquid crystal related substance Substances 0.000 description 28
- 229910052751 metal Inorganic materials 0.000 description 27
- 239000002184 metal Substances 0.000 description 27
- 238000000034 method Methods 0.000 description 26
- 238000001312 dry etching Methods 0.000 description 16
- 238000007689 inspection Methods 0.000 description 9
- 238000001039 wet etching Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 7
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 6
- 229910052750 molybdenum Inorganic materials 0.000 description 6
- 239000011733 molybdenum Substances 0.000 description 6
- 239000000523 sample Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 229910000838 Al alloy Inorganic materials 0.000 description 5
- 229910001182 Mo alloy Inorganic materials 0.000 description 5
- 238000000059 patterning Methods 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 238000001259 photo etching Methods 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000004380 ashing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- MGRWKWACZDFZJT-UHFFFAOYSA-N molybdenum tungsten Chemical compound [Mo].[W] MGRWKWACZDFZJT-UHFFFAOYSA-N 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910000667 (NH4)2Ce(NO3)6 Inorganic materials 0.000 description 1
- 229910000583 Nd alloy Inorganic materials 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- UBSJOWMHLJZVDJ-UHFFFAOYSA-N aluminum neodymium Chemical compound [Al].[Nd] UBSJOWMHLJZVDJ-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- NJWNEWQMQCGRDO-UHFFFAOYSA-N indium zinc Chemical compound [Zn].[In] NJWNEWQMQCGRDO-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13458—Terminal pads
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- G—PHYSICS
- G02—OPTICS
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
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- H01L27/1259—Multistep manufacturing methods
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- H01L29/41725—Source or drain electrodes for field effect devices
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
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- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42384—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor
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- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4908—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
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- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
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- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136231—Active matrix addressed cells for reducing the number of lithographic steps
- G02F1/136236—Active matrix addressed cells for reducing the number of lithographic steps using a grey or half tone lithographic process
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
- G02F1/13629—Multilayer wirings
Abstract
【解決手段】絶縁基板と、ゲート線と、ゲート絶縁層と、半導体層と、データ線と、前記データ線と分離されているドレーン電極と、前記半導体層を覆っていて前記ドレーン電極を露出する第1接触孔、前記ゲート線の一部を露出する第2接触孔、前記データ線の一部を露出する第3接触孔を有する保護膜と、前記第1接触孔を通じて前記ドレーン電極と連結される画素電極と、前記第2接触孔を通じて前記ゲート線と連結されているゲート接触補助部材と、前記第3接触孔を通じて前記データ線に連結されるデータ接触補助部材とを含み、前記データ接触補助部材は凹凸を有することを特徴とする薄膜トランジスタ表示板を提供する。
【選択図】図20
Description
前記絶縁基板上に形成されているゲート線と、
前記基板上に形成されているゲート絶縁層と、
前記ゲート絶縁層上に形成されている半導体層と、
少なくとも一部は前記半導体層上部に位置するデータ線と、
少なくとも一部は前記半導体層上部に位置し前記データ線と分離されているドレーン電極と、
前記半導体層を覆っていて前記ドレーン電極を露出する第1接触孔、前記ゲート線の一部を露出する第2接触孔、前記データ線の一部を露出する第3接触孔を有する保護膜と、
前記保護膜上に形成されていて前記第1接触孔を通じて前記ドレーン電極と連結される画素電極と、
前記保護膜上に形成されていて前記第2接触孔を通じて前記ゲート線と連結されているゲート接触補助部材と、
前記保護膜上に形成されていて前記第3接触孔を通じて前記データ線に連結されるデータ接触補助部材とを含み、
前記データ接触補助部材は凹凸を有することを特徴とする薄膜トランジスタ表示板を提供する。
絶縁基板と、
前記絶縁基板上に形成されているゲート電極と、
前記ゲート電極上に形成されているゲート絶縁層と、
前記ゲート電極と対応される前記ゲート絶縁層上に形成されている半導体層と、
少なくとも一部が前記半導体層上部に位置し溝を有しているデータ線と、
少なくとも一部は前記半導体層上部に位置し、前記データ線から分離されているドレーン電極と、
前記半導体層を覆っており、前記ドレーン電極を露出する第1接触孔、前記データ線の溝を露出する第2接触孔を有する保護膜と、
前記保護膜上に形成されていて前記第1接触孔を通じて前記ドレーン電極と連結される画素電極と、
前記保護膜上に形成されていて前記第2接触孔を通じて前記データ線に連結されるデータ接触補助部材とを含み、
前記データ接触補助部材は前記データ線の前記溝に沿って連結されることを特徴とする薄膜トランジスタ表示板を提供する。
下部膜121pの縁(輪郭線)は上部膜121qの縁付近に位置し、上部膜121pの縁とほとんど平行である。上部膜121qの縁は下部膜121pの上に位置して、上下の縁の間隔は、何処にあっても、ほとんど同一になっている。これにより、下部膜121pの上側表面が外部に露出されて下部膜121pと上部膜121qの側面が全体的に階段形状をなす。また、下部膜121pと上部膜121qの側面は各々傾いており、その傾斜角が基板110の表面に対して約30〜80゜となるように、エッチング条件を調整する。この条件は、等方性エッチングでは自動的に満足されるが、異方性エッチングでは、薬剤の選定・配合などを実験的に設定する必要がある。
データ線171、ドレーン電極175及び維持蓄電器用導電体177もまた、モリブデン(Mo)、モリブデン合金、クロム(Cr)などの下部膜171p、175p、177pとその上に位置したアルミニウム系列金属である上部膜171q、175q、177qからなる。
(2)チャンネル領域(C)に位置した感光膜の第2部分54を除去、
(3)チャンネル領域(C)に位置した導電体層170及び不純物非晶質シリコン層160のそれぞれ第2部分を除去、そして
(4)配線領域(A)に位置した感光膜の第1部分52を除去。
(2)チャンネル領域(C)に位置した感光膜の第2部分54除去、
(3)その他の領域(B)に位置した不純物非晶質シリコン層160及び真性非晶質シリコン層150の各第3部分を除去、
(4)チャンネル領域(C)に位置した導電体層170の第2部分除去、
(5)配線領域(A)に位置した感光膜の第1部分52除去、そして
(6)チャンネル領域(C)に位置した不純物非晶質シリコン層160の第2部分除去。
44、50、66、68 感光膜
52 感光膜の第1部分
54 感光膜の第2部分
70 基板
72p、121p、171p、174p、175p、177p 下部膜
72q、121q、171q、174q、175q、177q 上部膜
74 絶縁膜
75 接触孔
76 IZO導電体
78 レジスト膜
92、97 接触補助部材
100、200 表示板
110 基板
121 ゲート線
123 ゲート電極
125 ゲート線の端部分
127 拡張部
131 維持電極線
140 ゲート絶縁膜
151、157、154 半導体
160 不純物非晶質シリコン層
161、165、163 抵抗性接触部材
171 データ線
173 ソース電極
174 導電体
175 ドレイン電極
177 維持蓄電器用導電体
179 データ線の端部分
180 保護膜
182、185、187、189 接触孔
186 溝または孔
190 画素電極
270 共通電極
d 接触孔内周と下部膜縁との間隔
Claims (9)
- 絶縁基板と、
前記絶縁基板上に形成されているゲート線と、
前記基板上に形成されているゲート絶縁層と、
前記ゲート絶縁層上に形成されている半導体層と、
少なくとも一部は前記半導体層上部に位置するデータ線と、
少なくとも一部は前記半導体層上部に位置し前記データ線と分離されているドレーン電極と、
前記半導体層を覆っていて前記ドレーン電極を露出する第1接触孔、前記ゲート線の一部を露出する第2接触孔、前記データ線の一部を露出する第3接触孔を有する保護膜と、
前記保護膜上に形成されていて前記第1接触孔を通じて前記ドレーン電極と連結される画素電極と、
前記保護膜上に形成されていて前記第2接触孔を通じて前記ゲート線と連結されているゲート接触補助部材と、
前記保護膜上に形成されていて前記第3接触孔を通じて前記データ線に連結されるデータ接触補助部材とを含み、
前記データ接触補助部材は凹凸を有することを特徴とする薄膜トランジスタ表示板。 - 前記データ線はクロム層と前記クロム層上のアルミニウム層を含むことを特徴とする、請求項1に記載の薄膜トランジスタ表示板。
- 前記データ接触補助部材はIZOを含むことを特徴とする、請求項2に記載の薄膜トランジスタ表示板。
- 前記半導体層と前記データ線及び前記ドレーン電極の間に形成されていて前記データ線及び前記ドレーン電極と実質的に同一な平面模様を有する抵抗性接触部材をさらに含み、
前記半導体層は前記データ線と前記ドレーン電極の間を除けば前記抵抗性接触部材と実質的に同一な平面模様を有することを特徴とする、請求項1に記載の薄膜トランジスタ表示板。 - 絶縁基板と、
前記絶縁基板上に形成されているゲート電極と、
前記ゲート電極上に形成されているゲート絶縁層と、
前記ゲート電極と対応される前記ゲート絶縁層上に形成されている半導体層と、
少なくとも一部が前記半導体層上部に位置し溝を有しているデータ線と、
少なくとも一部は前記半導体層上部に位置し、前記データ線から分離されているドレーン電極と、
前記半導体層を覆っており、前記ドレーン電極を露出する第1接触孔、前記データ線の溝を露出する第2接触孔を有する保護膜と、
前記保護膜上に形成されていて前記第1接触孔を通じて前記ドレーン電極と連結される画素電極と、
前記保護膜上に形成されていて前記第2接触孔を通じて前記データ線に連結されるデータ接触補助部材とを含み、
前記データ接触補助部材は前記データ線の前記溝に沿って連結されることを特徴とする薄膜トランジスタ表示板。 - 前記データ線はクロム層と前記クロム層上のアルミニウム層を含むことを特徴とする、請求項5に記載の薄膜トランジスタ表示板。
- 前記データ接触補助部材はIZOを含むことを特徴とする、請求項6に記載の薄膜トランジスタ表示板。
- 前記アルミニウム層が前記溝を有することを特徴とする、請求項6に記載の薄膜トランジスタ表示板。
- 前記溝は前記基板を露出することを特徴とする、請求項5に記載の薄膜トランジスタ表示板。
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016195280A (ja) * | 2011-02-24 | 2016-11-17 | 株式会社半導体エネルギー研究所 | 半導体装置 |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8514340B2 (en) * | 2002-11-08 | 2013-08-20 | Lg Display Co., Ltd. | Method of fabricating array substrate having double-layered patterns |
JP4802462B2 (ja) * | 2004-07-27 | 2011-10-26 | 三菱電機株式会社 | 薄膜トランジスタアレイ基板の製造方法 |
KR20060016920A (ko) * | 2004-08-19 | 2006-02-23 | 삼성전자주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
KR100699995B1 (ko) * | 2004-09-02 | 2007-03-26 | 삼성에스디아이 주식회사 | 유기 전계 발광 소자 및 그 제조 방법 |
US7859606B2 (en) | 2004-09-15 | 2010-12-28 | Semiconductor Energy Laboratory Co. Ltd. | Semiconductor device |
TWI278090B (en) * | 2004-10-21 | 2007-04-01 | Int Rectifier Corp | Solderable top metal for SiC device |
KR101100883B1 (ko) * | 2004-11-08 | 2012-01-02 | 삼성전자주식회사 | 박막 트랜지스터 표시판 |
US7786742B2 (en) * | 2006-05-31 | 2010-08-31 | Applied Materials, Inc. | Prober for electronic device testing on large area substrates |
US7602199B2 (en) * | 2006-05-31 | 2009-10-13 | Applied Materials, Inc. | Mini-prober for TFT-LCD testing |
KR20080019398A (ko) * | 2006-08-28 | 2008-03-04 | 삼성전자주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
KR101394434B1 (ko) * | 2007-06-29 | 2014-05-15 | 삼성디스플레이 주식회사 | 표시 장치 및 그의 구동 방법 |
KR101072379B1 (ko) * | 2007-07-20 | 2011-10-11 | 엘지디스플레이 주식회사 | 리프트오프 방법 및 이를 이용한 액정표시장치용 어레이기판의 제조방법 |
CN101424837B (zh) * | 2007-11-02 | 2010-08-25 | 上海中航光电子有限公司 | 液晶显示装置阵列基板的制造方法 |
KR20090110485A (ko) * | 2008-04-18 | 2009-10-22 | 삼성전자주식회사 | 표시 기판, 이를 이용한 액정 표시 장치 및 어레이 기판의제조방법 |
CN101261962B (zh) * | 2008-04-24 | 2010-08-18 | 友达光电股份有限公司 | 有源元件阵列基板及其制造方法 |
TWI500159B (zh) * | 2008-07-31 | 2015-09-11 | Semiconductor Energy Lab | 半導體裝置和其製造方法 |
JP5627071B2 (ja) | 2008-09-01 | 2014-11-19 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
CN101930930B (zh) * | 2009-06-26 | 2012-01-25 | 比亚迪股份有限公司 | 一种在氧化铟锡玻璃基板上形成铬铝铬金属走线的方法 |
TWI830077B (zh) * | 2009-08-07 | 2024-01-21 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
CN102034749B (zh) * | 2009-09-25 | 2013-09-04 | 北京京东方光电科技有限公司 | 阵列基板及其制造方法 |
JP5275517B2 (ja) * | 2010-07-21 | 2013-08-28 | シャープ株式会社 | 基板及びその製造方法、表示装置 |
JP5848918B2 (ja) | 2010-09-03 | 2016-01-27 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
KR101750430B1 (ko) * | 2010-11-29 | 2017-06-26 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판의 제조 방법 |
KR20210034703A (ko) * | 2011-01-28 | 2021-03-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제작 방법 및 반도체 장치 |
CN102446732A (zh) * | 2011-11-29 | 2012-05-09 | 上海华力微电子有限公司 | 提高多次曝光稳定性的栅极返工工艺 |
KR20140020565A (ko) * | 2012-08-09 | 2014-02-19 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조방법 |
KR102290801B1 (ko) * | 2013-06-21 | 2021-08-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
JP2015228426A (ja) * | 2014-06-02 | 2015-12-17 | 大日本印刷株式会社 | 配線部材 |
CN104865765B (zh) * | 2015-06-19 | 2018-10-30 | 合肥鑫晟光电科技有限公司 | 阵列基板及制作方法、显示面板及制作方法和显示装置 |
CN105068325A (zh) * | 2015-08-31 | 2015-11-18 | 深圳市华星光电技术有限公司 | Psva型液晶显示面板 |
CN105116642B (zh) * | 2015-09-24 | 2018-07-17 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法、显示装置 |
JP2017143108A (ja) * | 2016-02-08 | 2017-08-17 | 株式会社ジャパンディスプレイ | 薄膜トランジスタ及び薄膜トランジスタの製造方法 |
KR102598970B1 (ko) * | 2016-07-29 | 2023-11-06 | 엘지디스플레이 주식회사 | 유기발광 다이오드 표시장치 |
CN106206324B (zh) * | 2016-08-31 | 2019-03-26 | 深圳市华星光电技术有限公司 | 一种金属绝缘层半导体结构的制造方法 |
CN107037655A (zh) * | 2017-05-26 | 2017-08-11 | 京东方科技集团股份有限公司 | 一种显示基板及其制作方法、显示器件 |
JP7456773B2 (ja) * | 2019-07-16 | 2024-03-27 | 京東方科技集團股▲ふん▼有限公司 | アレイ基板、ディスプレイパネル、表示装置及びアレイ基板の製造方法 |
CN111710652A (zh) * | 2020-06-12 | 2020-09-25 | 信利(仁寿)高端显示科技有限公司 | 一种tft基板的连接孔制作方法及tft基板 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000199917A (ja) * | 1998-10-26 | 2000-07-18 | Sharp Corp | 液晶表示装置の製造方法および液晶表示装置 |
JP2000221542A (ja) * | 1999-01-29 | 2000-08-11 | Fujitsu Ltd | 薄膜トランジスタ基板 |
JP2001066639A (ja) * | 1999-06-03 | 2001-03-16 | Samsung Electronics Co Ltd | 液晶表示装置用薄膜トランジスタ基板及びその製造方法 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04253342A (ja) * | 1991-01-29 | 1992-09-09 | Oki Electric Ind Co Ltd | 薄膜トランジスタアレイ基板 |
TW409194B (en) * | 1995-11-28 | 2000-10-21 | Sharp Kk | Active matrix substrate and liquid crystal display apparatus and method for producing the same |
KR100190023B1 (ko) * | 1996-02-29 | 1999-06-01 | 윤종용 | 박막트랜지스터-액정표시장치 및 그 제조방법 |
KR100392909B1 (ko) * | 1997-08-26 | 2004-03-22 | 엘지.필립스 엘시디 주식회사 | 박막트랜지스터및그의제조방법 |
KR100307385B1 (ko) | 1997-03-05 | 2001-12-15 | 구본준, 론 위라하디락사 | 액정표시장치의구조및그제조방법 |
JP3102392B2 (ja) | 1997-10-28 | 2000-10-23 | 日本電気株式会社 | 半導体デバイスおよびその製造方法 |
KR100316072B1 (ko) | 1997-12-10 | 2002-11-27 | 엘지.필립스 엘시디 주식회사 | 액정 표시 장치 제조 방법 및 그 구조 |
KR100590742B1 (ko) * | 1998-05-11 | 2007-04-25 | 삼성전자주식회사 | 액정 표시 장치용 박막 트랜지스터 기판의 제조 방법 |
US6255130B1 (en) * | 1998-11-19 | 2001-07-03 | Samsung Electronics Co., Ltd. | Thin film transistor array panel and a method for manufacturing the same |
JP2000267595A (ja) * | 1999-03-15 | 2000-09-29 | Toshiba Corp | 表示装置用アレイ基板の製造方法 |
US6218221B1 (en) * | 1999-05-27 | 2001-04-17 | Chi Mei Optoelectronics Corp. | Thin film transistor with a multi-metal structure and a method of manufacturing the same |
KR100333273B1 (ko) * | 1999-08-02 | 2002-04-24 | 구본준, 론 위라하디락사 | 박막트랜지스터형 액정표시장치의 어레이기판과 그 제조방법 |
US6885064B2 (en) * | 2000-01-07 | 2005-04-26 | Samsung Electronics Co., Ltd. | Contact structure of wiring and a method for manufacturing the same |
KR100366768B1 (ko) * | 2000-04-19 | 2003-01-09 | 삼성전자 주식회사 | 배선의 접촉부 및 그의 제조 방법과 이를 포함하는 박막 트랜지스터 기판 및 그 제조 방법 |
JP4630420B2 (ja) * | 2000-05-23 | 2011-02-09 | ティーピーオー ホンコン ホールディング リミテッド | パターン形成方法 |
KR100751185B1 (ko) * | 2000-08-08 | 2007-08-22 | 엘지.필립스 엘시디 주식회사 | 액정표시소자 및 그 제조방법 |
JP4342711B2 (ja) * | 2000-09-20 | 2009-10-14 | 株式会社日立製作所 | 液晶表示装置の製造方法 |
TWI220029B (en) * | 2000-10-12 | 2004-08-01 | Au Optronics Corp | Thin film transistor liquid crystal display and its manufacturing method |
KR100720095B1 (ko) * | 2000-11-07 | 2007-05-18 | 삼성전자주식회사 | 박막 트랜지스터 어레이 기판 및 그 제조 방법 |
KR100729764B1 (ko) | 2000-11-15 | 2007-06-20 | 삼성전자주식회사 | 액정 표시 장치용 박막 트랜지스터 기판의 제조 방법 |
KR100750919B1 (ko) | 2001-02-05 | 2007-08-22 | 삼성전자주식회사 | 액정 표시 장치용 박막 트랜지스터 기판 및 그 제조 방법 |
KR20020083249A (ko) * | 2001-04-26 | 2002-11-02 | 삼성전자 주식회사 | 배선의 접촉 구조 및 그의 제조 방법과 이를 포함하는박막 트랜지스터 기판 및 그 제조 방법 |
KR100412619B1 (ko) * | 2001-12-27 | 2003-12-31 | 엘지.필립스 엘시디 주식회사 | 액정표시장치용 어레이 기판의 제조 방법 |
-
2003
- 2003-09-01 EP EP03019534A patent/EP1394597B1/en not_active Expired - Fee Related
- 2003-09-01 DE DE60336441T patent/DE60336441D1/de not_active Expired - Lifetime
- 2003-09-02 CN CNB031648053A patent/CN100465704C/zh not_active Expired - Fee Related
- 2003-09-02 US US10/653,556 patent/US7294855B2/en not_active Expired - Fee Related
- 2003-09-02 JP JP2003309757A patent/JP2004096115A/ja active Pending
- 2003-09-02 TW TW092124224A patent/TWI293138B/zh not_active IP Right Cessation
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2007
- 2007-10-19 US US11/875,199 patent/US7883942B2/en not_active Expired - Fee Related
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2010
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000199917A (ja) * | 1998-10-26 | 2000-07-18 | Sharp Corp | 液晶表示装置の製造方法および液晶表示装置 |
JP2000221542A (ja) * | 1999-01-29 | 2000-08-11 | Fujitsu Ltd | 薄膜トランジスタ基板 |
JP2001066639A (ja) * | 1999-06-03 | 2001-03-16 | Samsung Electronics Co Ltd | 液晶表示装置用薄膜トランジスタ基板及びその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016195280A (ja) * | 2011-02-24 | 2016-11-17 | 株式会社半導体エネルギー研究所 | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
CN100465704C (zh) | 2009-03-04 |
US7294855B2 (en) | 2007-11-13 |
EP1394597A3 (en) | 2006-06-21 |
EP1394597B1 (en) | 2011-03-23 |
US20040041149A1 (en) | 2004-03-04 |
DE60336441D1 (de) | 2011-05-05 |
JP5302275B2 (ja) | 2013-10-02 |
EP1394597A2 (en) | 2004-03-03 |
US20080044996A1 (en) | 2008-02-21 |
CN1495478A (zh) | 2004-05-12 |
US7883942B2 (en) | 2011-02-08 |
TW200500759A (en) | 2005-01-01 |
TWI293138B (en) | 2008-02-01 |
JP2004096115A (ja) | 2004-03-25 |
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