JP2008532263A - 基板をウェハ・チャックに保持する方法 - Google Patents

基板をウェハ・チャックに保持する方法 Download PDF

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Publication number
JP2008532263A
JP2008532263A JP2007553122A JP2007553122A JP2008532263A JP 2008532263 A JP2008532263 A JP 2008532263A JP 2007553122 A JP2007553122 A JP 2007553122A JP 2007553122 A JP2007553122 A JP 2007553122A JP 2008532263 A JP2008532263 A JP 2008532263A
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JP
Japan
Prior art keywords
substrate
wafer chuck
force
separation
reducing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007553122A
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English (en)
Japanese (ja)
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JP2008532263A5 (enExample
Inventor
チョイ，ビュン・ジン
チェララ，アンシュマン
バブス，ダニエル・エイ
Original Assignee
モレキュラー・インプリンツ・インコーポレーテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/047,428 external-priority patent/US7798801B2/en
Application filed by モレキュラー・インプリンツ・インコーポレーテッド filed Critical モレキュラー・インプリンツ・インコーポレーテッド
Priority claimed from PCT/US2006/001151 external-priority patent/WO2006083519A2/en
Publication of JP2008532263A publication Critical patent/JP2008532263A/ja
Publication of JP2008532263A5 publication Critical patent/JP2008532263A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49764—Method of mechanical manufacture with testing or indicating
    • Y10T29/49778—Method of mechanical manufacture with testing or indicating with aligning, guiding, or instruction
    • Y10T29/4978—Assisting assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49998—Work holding

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  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Micromachines (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Manipulator (AREA)
JP2007553122A 2005-01-31 2006-01-12 基板をウェハ・チャックに保持する方法 Pending JP2008532263A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/047,499 US7636999B2 (en) 2005-01-31 2005-01-31 Method of retaining a substrate to a wafer chuck
US11/047,428 US7798801B2 (en) 2005-01-31 2005-01-31 Chucking system for nano-manufacturing
US11/108,208 US7635445B2 (en) 2005-01-31 2005-04-18 Method of separating a mold from a solidified layer disposed on a substrate
PCT/US2006/001151 WO2006083519A2 (en) 2005-01-31 2006-01-12 Method of retaining a substrate to a wafer chuck

Publications (2)

Publication Number Publication Date
JP2008532263A true JP2008532263A (ja) 2008-08-14
JP2008532263A5 JP2008532263A5 (enExample) 2009-02-26

Family

ID=39730623

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2007553123A Active JP5247153B2 (ja) 2005-01-31 2006-01-12 基板上に配置された固化層からモールドを分離させる方法
JP2007553122A Pending JP2008532263A (ja) 2005-01-31 2006-01-12 基板をウェハ・チャックに保持する方法
JP2007553121A Active JP4648408B2 (ja) 2005-01-31 2006-01-12 ナノ加工のためのチャッキング・システム

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2007553123A Active JP5247153B2 (ja) 2005-01-31 2006-01-12 基板上に配置された固化層からモールドを分離させる方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2007553121A Active JP4648408B2 (ja) 2005-01-31 2006-01-12 ナノ加工のためのチャッキング・システム

Country Status (4)

Country Link
US (1) US7636999B2 (enExample)
JP (3) JP5247153B2 (enExample)
SG (2) SG159498A1 (enExample)
TW (1) TWI327351B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
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JP2007305895A (ja) * 2006-05-15 2007-11-22 Apic Yamada Corp インプリント方法およびナノ・インプリント装置
JP2010219274A (ja) * 2009-03-17 2010-09-30 Dainippon Printing Co Ltd 基板固定装置
US9272462B2 (en) 2010-03-29 2016-03-01 Fujifilm Corporation Minute convexo-concave pattern forming method and forming device, and transfer substrate producing method and transfer substrate

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US7162035B1 (en) 2000-05-24 2007-01-09 Tracer Detection Technology Corp. Authentication method and system
EP2270592B1 (en) 2000-07-17 2015-09-02 Board of Regents, The University of Texas System Method of forming a pattern on a substrate
US20080160129A1 (en) 2006-05-11 2008-07-03 Molecular Imprints, Inc. Template Having a Varying Thickness to Facilitate Expelling a Gas Positioned Between a Substrate and the Template
US7641840B2 (en) * 2002-11-13 2010-01-05 Molecular Imprints, Inc. Method for expelling gas positioned between a substrate and a mold
FR2869601B1 (fr) * 2004-04-28 2006-06-09 Commissariat Energie Atomique Moule pour la nano-impression, procede de fabrication d'un tel moule et utilisation d'un tel moule
US8334967B2 (en) * 2004-05-28 2012-12-18 Board Of Regents, The University Of Texas System Substrate support system having a plurality of contact lands
WO2005119802A2 (en) * 2004-05-28 2005-12-15 Board Of Regents, The University Of Texas System Adaptive shape substrate support system and method
US20060177532A1 (en) * 2005-02-04 2006-08-10 Molecular Imprints, Inc. Imprint lithography method to control extrusion of a liquid from a desired region on a substrate
US7798801B2 (en) * 2005-01-31 2010-09-21 Molecular Imprints, Inc. Chucking system for nano-manufacturing
US7635263B2 (en) 2005-01-31 2009-12-22 Molecular Imprints, Inc. Chucking system comprising an array of fluid chambers
US20060177535A1 (en) * 2005-02-04 2006-08-10 Molecular Imprints, Inc. Imprint lithography template to facilitate control of liquid movement
JP2007134368A (ja) * 2005-11-08 2007-05-31 Nikon Corp パターン転写装置、露光装置及びパターン転写方法
CN101535021A (zh) 2005-12-08 2009-09-16 分子制模股份有限公司 用于衬底双面图案形成的方法和系统
US7670530B2 (en) 2006-01-20 2010-03-02 Molecular Imprints, Inc. Patterning substrates employing multiple chucks
KR100689843B1 (ko) * 2006-01-03 2007-03-08 삼성전자주식회사 웨이퍼 스테이지 및 이를 이용한 웨이퍼 안착방법
JP2007250685A (ja) * 2006-03-14 2007-09-27 Engineering System Kk ナノインプリント装置の型押し機構
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JP4814682B2 (ja) * 2006-04-18 2011-11-16 株式会社日立ハイテクノロジーズ 微細構造パターンの転写方法及び転写装置
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US8377361B2 (en) * 2006-11-28 2013-02-19 Wei Zhang Imprint lithography with improved substrate/mold separation
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JP5069979B2 (ja) * 2007-09-03 2012-11-07 東芝機械株式会社 離型装置、給排システムおよび離型方法
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US8945444B2 (en) * 2007-12-04 2015-02-03 Canon Nanotechnologies, Inc. High throughput imprint based on contact line motion tracking control
US7995196B1 (en) 2008-04-23 2011-08-09 Tracer Detection Technology Corp. Authentication method and system
JP5517423B2 (ja) * 2008-08-26 2014-06-11 キヤノン株式会社 インプリント装置及びインプリント方法
NL2003380A (en) * 2008-10-17 2010-04-20 Asml Netherlands Bv Imprint lithography apparatus and method.
US8652393B2 (en) 2008-10-24 2014-02-18 Molecular Imprints, Inc. Strain and kinetics control during separation phase of imprint process
US8309008B2 (en) * 2008-10-30 2012-11-13 Molecular Imprints, Inc. Separation in an imprint lithography process
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JP5363165B2 (ja) * 2009-03-31 2013-12-11 富士フイルム株式会社 微細凹凸パターンの形成方法及び形成装置
JP5377053B2 (ja) * 2009-04-17 2013-12-25 株式会社東芝 テンプレート及びその製造方法、並びにパターン形成方法
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CN103958161B (zh) * 2011-09-23 2017-09-08 1366科技公司 用于处理、加热和冷却衬底的方法和装置，在该衬底上由工具在热可流动材料涂层中制得图案，包括衬底运输、工具搁置、工具张紧以及工具退回
JP5759348B2 (ja) 2011-11-30 2015-08-05 株式会社Ｓｃｒｅｅｎホールディングス パターン形成装置およびパターン形成方法
JP6086675B2 (ja) 2011-11-30 2017-03-01 株式会社Ｓｃｒｅｅｎホールディングス 印刷装置および印刷方法
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