JP5247153B2 - 基板上に配置された固化層からモールドを分離させる方法 - Google Patents

基板上に配置された固化層からモールドを分離させる方法 Download PDF

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JP5247153B2
JP5247153B2 JP2007553123A JP2007553123A JP5247153B2 JP 5247153 B2 JP5247153 B2 JP 5247153B2 JP 2007553123 A JP2007553123 A JP 2007553123A JP 2007553123 A JP2007553123 A JP 2007553123A JP 5247153 B2 JP5247153 B2 JP 5247153B2
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Prior art keywords
substrate
force
template
region
separation
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Japanese (ja)
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JP2008537513A (ja
JP2008537513A5 (enExample
Inventor
チョイ，ビュン−ジン
チェララ，アンシュマン
チョイ，ヨン−ジュン
メイッスル，マリオ・ジェイ
スリニーヴァッサン，シトルガタ・ヴイ
シューメーカー，ノーマン・イー
ル，シャオミン
マックマッキン，イアン・エム
バブス，ダニエル・エイ
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モレキュラー・インプリンツ・インコーポレーテッド
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Priority claimed from US11/047,428 external-priority patent/US7798801B2/en
Application filed by モレキュラー・インプリンツ・インコーポレーテッド filed Critical モレキュラー・インプリンツ・インコーポレーテッド
Priority claimed from PCT/US2006/001160 external-priority patent/WO2006083520A2/en
Publication of JP2008537513A publication Critical patent/JP2008537513A/ja
Publication of JP2008537513A5 publication Critical patent/JP2008537513A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49764—Method of mechanical manufacture with testing or indicating
    • Y10T29/49778—Method of mechanical manufacture with testing or indicating with aligning, guiding, or instruction
    • Y10T29/4978—Assisting assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49998—Work holding

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  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Micromachines (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manipulator (AREA)
JP2007553123A 2005-01-31 2006-01-12 基板上に配置された固化層からモールドを分離させる方法 Active JP5247153B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US11/047,428 US7798801B2 (en) 2005-01-31 2005-01-31 Chucking system for nano-manufacturing
US11/047,499 2005-01-31
US11/047,428 2005-01-31
US11/047,499 US7636999B2 (en) 2005-01-31 2005-01-31 Method of retaining a substrate to a wafer chuck
US11/108,208 US7635445B2 (en) 2005-01-31 2005-04-18 Method of separating a mold from a solidified layer disposed on a substrate
US11/108,208 2005-04-18
PCT/US2006/001160 WO2006083520A2 (en) 2005-01-31 2006-01-12 Method of separating a mold from a solidified layer disposed on a substrate

Publications (3)

Publication Number Publication Date
JP2008537513A JP2008537513A (ja) 2008-09-18
JP2008537513A5 JP2008537513A5 (enExample) 2009-03-05
JP5247153B2 true JP5247153B2 (ja) 2013-07-24

Family

ID=39730623

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2007553121A Active JP4648408B2 (ja) 2005-01-31 2006-01-12 ナノ加工のためのチャッキング・システム
JP2007553123A Active JP5247153B2 (ja) 2005-01-31 2006-01-12 基板上に配置された固化層からモールドを分離させる方法
JP2007553122A Pending JP2008532263A (ja) 2005-01-31 2006-01-12 基板をウェハ・チャックに保持する方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2007553121A Active JP4648408B2 (ja) 2005-01-31 2006-01-12 ナノ加工のためのチャッキング・システム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2007553122A Pending JP2008532263A (ja) 2005-01-31 2006-01-12 基板をウェハ・チャックに保持する方法

Country Status (4)

Country Link
US (1) US7636999B2 (enExample)
JP (3) JP4648408B2 (enExample)
SG (2) SG159498A1 (enExample)
TW (1) TWI327351B (enExample)

Cited By (1)

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JP2017092396A (ja) * 2015-11-16 2017-05-25 キヤノン株式会社 インプリント装置、及び物品の製造方法

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KR102238990B1 (ko) * 2015-11-16 2021-04-13 캐논 가부시끼가이샤 임프린트 장치 및 물품 제조 방법

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