JP2008527748A - 薄膜成長用反応装置 - Google Patents
薄膜成長用反応装置 Download PDFInfo
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- JP2008527748A JP2008527748A JP2007551472A JP2007551472A JP2008527748A JP 2008527748 A JP2008527748 A JP 2008527748A JP 2007551472 A JP2007551472 A JP 2007551472A JP 2007551472 A JP2007551472 A JP 2007551472A JP 2008527748 A JP2008527748 A JP 2008527748A
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- gas
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
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- C30B35/00—Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
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Abstract
Description
本願は、2005年1月18日出願の仮出願第60/645,581号、および2005年2月24日出願の仮出願第60/656,832号に対し、35U.S.C.§119(e)に基づき優先権の利益を主張し、これらの出願の全ての内容は、参照によりその全体が本明細書に組み込まれる。
Claims (32)
- 堆積チャンバ内に画定された空間内において載置されたウエハに薄膜を堆積させるように構成され、前記空間内と連通するガス流入口を含む、前記堆積チャンバと、
前記堆積チャンバのガス流入口にガスを送出するように構成され、前記堆積チャンバの上方に少なくともその一部分が配置されるガスシステムと、
を備え、当該ガスシステムは、
複数のガスの流れを混合するように構成された混合器と、
前記混合器と前記ガス流入口とに流体連通し、前記ガス流入口に入る前にガスを水平方向に拡散させるように形成された水平方向に末広形の一対の壁を含む移送部材と、
を備える原子層堆積(ALD)式薄膜堆積装置。 - 前記移送部材は、第1の部分と、下流の第2の部分と、を含み、前記第1の部分は、第1の角度で末広形になった水平方向に末広形の一対の壁を含み、前記第2の部分は、前記第1の角度よりも大きい第2の角度で末広形になった、水平方向に末広形の一対の壁を含む請求項1に記載のALD式薄膜堆積装置。
- 前記水平方向に末広形の壁は、実質的にまっすぐである請求項1に記載のALD式薄膜堆積装置。
- 前記水平方向に末広形の壁は、湾曲している請求項1に記載のALD式薄膜堆積装置。
- 前記移送部材により画定される前記ガス通路の第1の部分の高さは、実質的に一定である請求項2に記載のALD式薄膜堆積装置。
- 前記移送部材により画定される前記ガス通路の第2の部分の高さは、ガスの流れる方向に低くなる請求項2に記載のALD式薄膜堆積装置。
- 前記移送部材により画定される前記ガス通路の第1の部分の高さは、実質的に一定である請求項6に記載のALD式薄膜堆積装置。
- 前記移送部材を通る流路は、ウエハに実質的に平行である請求項7に記載のALD式薄膜堆積装置。
- 移送部材および前記混合器は、前記堆積チャンバの上方に配置される請求項1に記載のALD式薄膜堆積装置。
- 前記移送部材を通る流路は、ウエハに実質的に平行である請求項1に記載のALD式薄膜堆積装置。
- 前記堆積チャンバ内の空間を通る流路は、前記移送部材を通る流路に実質的に平行でありかつそれと反対側にある請求項10に記載のALD式薄膜堆積装置。
- 前記堆積チャンバの前記ガス流入口は、前記移送部材と連通する縮小部分と、前記堆積チャンバ内の空間と連通する拡大部分と、前記縮小部分と拡大部分との間に位置する幅が狭くなった部分と、を含み、前記縮小部分は、前記プレナムから前記幅が狭くなった部分の方へ前記ガス通路の断面積が狭くなるように形成され、前記拡大部分は、前記幅が狭くなった部分から前記堆積チャンバ内の空間の方へ前記ガス通路の断面積が広くなるように形成される請求項1に記載のALD式薄膜堆積装置。
- 前記混合器と前記堆積部との間の前記ガス通路の断面積は、前記幅が狭くなった部分において最も狭くなる請求項12に記載のALD式薄膜堆積装置。
- 前記堆積チャンバのガス流入口は、前記堆積チャンバ内の空間を通る流路が前記移送部材を通る流路に実質的に平行でありかつその反対側に存在するように、形成される請求項12に記載のALD式薄膜堆積装置。
- 前記堆積チャンバは、トッププレートと、ボトムプレートと、鉛直方向に移動して前記ボトムプレートに対して密閉を行うサセプタとを含み、また、前記ガス流入口は、前記トッププレートに形成される請求項14に記載のALD式薄膜堆積装置。
- 前記堆積チャンバは、トッププレートと、ボトムプレートと、サセプタとを含み、当該サセプタは、第1の部分において前記ボトムプレートの下面に対して密閉を行うように前記ボトムプレートに対して鉛直方向に移動する構成となっている請求項1に記載のALD式薄膜堆積装置。
- 堆積チャンバ内に画定された空間内に載置されたウエハ上に薄膜を堆積させるように構成され、前記空間と連通するガス流入口と、さらに、密閉面を含む密閉部とを備える、前記堆積チャンバと、
前記ウエハを前記空間内において支持するように形成されたサセプタであって、前記サセプタが前記密閉面に対して密閉を行う第1の位置と、前記サセプタが前記密閉面に対して密閉を行わなくなる下方の第2の位置との間を、前記堆積チャンバに対して鉛直方向に移動するように形成された前記サセプタと、
を備え、
前記第1の位置において、前記密閉面と前記サセプタとの間の界面と、前記サセプタ上に配置された前記ウエハとの間の垂直方向の距離が、約2ミリメートル未満である原子層堆積(ALD)式薄膜堆積装置。 - 前記密閉面とサセプタとの間の界面と、前記サセプタ上に配置された前記ウエハとは、垂直方向において実質的に同じ高さに配置される請求項17に記載のALD式薄膜堆積装置。
- 前記密閉面と前記サセプタとの間の界面との間の前記サセプタの上面領域は、実質的に平坦である請求項17に記載のALD式薄膜堆積装置。
- 前記密閉部の端の厚さは、約0.5から約3ミリメートルである請求項17に記載のALD式薄膜堆積装置。
- 前記堆積チャンバは、トッププレートと、ボトムプレートとを備え、前記ボトムプレートは、少なくとも部分的に、前記密閉部を形成し、また、前記トッププレートは、少なくとも部分的に、前記ガス流入口を形成する請求項17に記載のALD式薄膜堆積装置。
- 前記サセプタは、前記ウエハが前記サセプタ上に配置されたとき、前記ウエハの、ガスの流れに対して前の縁が、前記ウエハの後縁と比較して、前記密閉面から、より遠くに配置されるように、形成される請求項17に記載のALD式薄膜堆積装置。
- 前記サセプタの直径は、前記ウエハの直径より約10%〜約25%大きい請求項17に記載のALD式薄膜堆積装置。
- 半導体基板を処理するための基板支持部であって、当該基板支持部は、凹所を有する上面を含み、前記凹所は、前記基板支持部の上面が、前記基板の縁部分に沿ってのみ前記基板に接触するように形成される基板支持部。
- 前記凹所の深さは、約0.2から約0.5ミリメートルである請求項22に記載の基板支持部。
- 前記凹所は、概ね円形である請求項22に記載の基板支持部。
- 前記概ね円形の凹所の中心は、前記支持部の外側の縁に対してずらして配置される請求項24に記載の基板支持部。
- 前記支持部の上面と、前記基板とは、概ね円形の密閉部を形成する請求項22に記載の基板支持部。
- 前記概ね円形の密閉部の中心は、前記支持部の外側の縁に対してずらして配置される請求項28に記載の基板支持部。
- 前記サセプタの縁と前記凹所との間の前記サセプタの上面の領域は、実質的に平坦である請求項22に記載の基板支持部。
- 前記上面の領域は、少なくとも1つのピンを含む請求項30に記載の基板支持部。
- 堆積チャンバ内に画定された空間内に載置されたウエハに薄膜を堆積させるように形成され、前記空間と連通するガス流入口と、さらに、密閉面を含む密閉部とを備える、前記堆積チャンバと、
前記ウエハを前記空間内において支持するように形成されたサセプタであって、前記サセプタが前記密閉面に対して密閉を行う第1の位置と、前記サセプタが前記密閉面に対して密閉を行わなくなる下方の第2の位置との間を、前記堆積チャンバに対して鉛直方向に移動するように形成された前記サセプタと、
を備え、
前記サセプタは、前記第1の位置において、前記ウエハが前記サセプタに配置されるとき、前記ウエハの、ガスの流れに対して前の縁が、前記ウエハの後の縁と比較して、前記密閉面から、より遠くに配置されるように、形成される原子層堆積(ALD)式薄膜堆積装置。
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US64558105P | 2005-01-18 | 2005-01-18 | |
US60/645,581 | 2005-01-18 | ||
US65683205P | 2005-02-24 | 2005-02-24 | |
US60/656,832 | 2005-02-24 | ||
PCT/US2006/001640 WO2006078666A2 (en) | 2005-01-18 | 2006-01-17 | Reaction system for growing a thin film |
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Publication number | Publication date |
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US10468291B2 (en) | 2019-11-05 |
US20160233124A1 (en) | 2016-08-11 |
WO2006078666A2 (en) | 2006-07-27 |
JP4934595B2 (ja) | 2012-05-16 |
JP2012089863A (ja) | 2012-05-10 |
WO2006078666A3 (en) | 2006-10-12 |
KR101463581B1 (ko) | 2014-11-20 |
US9359672B2 (en) | 2016-06-07 |
KR20130027575A (ko) | 2013-03-15 |
TW200701301A (en) | 2007-01-01 |
EP1866465A2 (en) | 2007-12-19 |
US8211230B2 (en) | 2012-07-03 |
KR101332739B1 (ko) | 2013-11-25 |
KR20070100354A (ko) | 2007-10-10 |
US20120266821A1 (en) | 2012-10-25 |
US20060266289A1 (en) | 2006-11-30 |
JP5722753B2 (ja) | 2015-05-27 |
TWI412063B (zh) | 2013-10-11 |
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