JP2008513985A5 - - Google Patents

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Publication number
JP2008513985A5
JP2008513985A5 JP2007531632A JP2007531632A JP2008513985A5 JP 2008513985 A5 JP2008513985 A5 JP 2008513985A5 JP 2007531632 A JP2007531632 A JP 2007531632A JP 2007531632 A JP2007531632 A JP 2007531632A JP 2008513985 A5 JP2008513985 A5 JP 2008513985A5
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JP
Japan
Prior art keywords
workpiece
current
pulse
current pulse
process according
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JP2007531632A
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English (en)
Japanese (ja)
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JP5078142B2 (ja
JP2008513985A (ja
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Priority claimed from DE102004045451A external-priority patent/DE102004045451B4/de
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Publication of JP2008513985A5 publication Critical patent/JP2008513985A5/ja
Application granted granted Critical
Publication of JP5078142B2 publication Critical patent/JP5078142B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2007531632A 2004-09-20 2005-08-30 スルーホールに金属を充填するための電気処理、とりわけプリント基板のスルーホールに銅を充填するための電気処理 Expired - Lifetime JP5078142B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102004045451A DE102004045451B4 (de) 2004-09-20 2004-09-20 Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer
DE102004045451.5 2004-09-20
PCT/EP2005/009332 WO2006032346A1 (en) 2004-09-20 2005-08-30 Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper

Publications (3)

Publication Number Publication Date
JP2008513985A JP2008513985A (ja) 2008-05-01
JP2008513985A5 true JP2008513985A5 (enExample) 2008-08-28
JP5078142B2 JP5078142B2 (ja) 2012-11-21

Family

ID=35447785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007531632A Expired - Lifetime JP5078142B2 (ja) 2004-09-20 2005-08-30 スルーホールに金属を充填するための電気処理、とりわけプリント基板のスルーホールに銅を充填するための電気処理

Country Status (10)

Country Link
US (2) US9445510B2 (enExample)
EP (1) EP1810554B1 (enExample)
JP (1) JP5078142B2 (enExample)
KR (1) KR101222627B1 (enExample)
CN (1) CN101053286B (enExample)
AT (1) ATE417492T1 (enExample)
DE (2) DE102004045451B4 (enExample)
MY (1) MY145344A (enExample)
TW (1) TWI370715B (enExample)
WO (1) WO2006032346A1 (enExample)

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ATE484943T1 (de) * 2006-03-30 2010-10-15 Atotech Deutschland Gmbh Elektrolytisches verfahren zum füllen von löchern und vertiefungen mit metallen
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JP6161863B2 (ja) * 2010-12-28 2017-07-12 株式会社荏原製作所 電気めっき方法
EP2518187A1 (en) 2011-04-26 2012-10-31 Atotech Deutschland GmbH Aqueous acidic bath for electrolytic deposition of copper
JP5980735B2 (ja) 2012-08-07 2016-08-31 株式会社荏原製作所 スルーホールの電気めっき方法及び電気めっき装置
KR20140034529A (ko) 2012-09-12 2014-03-20 삼성전기주식회사 전기 동도금 장치
JP6114527B2 (ja) * 2012-10-05 2017-04-12 新光電気工業株式会社 配線基板及びその製造方法
CN102877098B (zh) * 2012-10-29 2015-06-17 东莞市若美电子科技有限公司 一种多波段输出的脉冲电镀方法
CN104053311A (zh) * 2013-03-13 2014-09-17 欣兴电子股份有限公司 导通孔的制作方法
JP2015106653A (ja) * 2013-11-29 2015-06-08 イビデン株式会社 プリント配線板の製造方法
CN104159420A (zh) * 2014-09-04 2014-11-19 深圳恒宝士线路板有限公司 带盲孔且具有四层线路的电路板制造方法
EP3029178A1 (en) * 2014-12-05 2016-06-08 ATOTECH Deutschland GmbH Method and apparatus for electroplating a metal onto a substrate
EP3570645B1 (en) * 2018-05-17 2023-01-25 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with only partially filled thermal through-hole
US11716819B2 (en) * 2018-06-21 2023-08-01 Averatek Corporation Asymmetrical electrolytic plating for a conductive pattern
KR102662860B1 (ko) * 2019-05-29 2024-05-03 삼성전기주식회사 인쇄회로기판
KR102748951B1 (ko) 2019-06-25 2025-01-02 삼성전기주식회사 인쇄회로기판 도금 방법 및 인쇄회로기판
CN110306214A (zh) * 2019-07-05 2019-10-08 东莞市斯坦得电子材料有限公司 一种用于高纵横比孔径印制线路板通孔电镀的反向脉冲镀铜工艺
CN114342569A (zh) 2019-08-19 2022-04-12 德国艾托特克有限两合公司 高密度互连印刷电路板的制造顺序及高密度互连印刷电路板
US11746433B2 (en) 2019-11-05 2023-09-05 Macdermid Enthone Inc. Single step electrolytic method of filling through holes in printed circuit boards and other substrates
KR102215846B1 (ko) * 2019-11-27 2021-02-16 와이엠티 주식회사 회로기판의 관통홀 충진 방법 및 이를 이용하여 제조된 회로기판
KR102776287B1 (ko) 2020-01-06 2025-03-07 삼성전기주식회사 인쇄회로기판
US20230279577A1 (en) * 2022-03-04 2023-09-07 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids

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