KR101222627B1 - 금속으로 관통홀, 특히 구리로 인쇄회로기판의 관통홀을충진하기 위한 갈바닉 공정 - Google Patents

금속으로 관통홀, 특히 구리로 인쇄회로기판의 관통홀을충진하기 위한 갈바닉 공정 Download PDF

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Publication number
KR101222627B1
KR101222627B1 KR1020077007033A KR20077007033A KR101222627B1 KR 101222627 B1 KR101222627 B1 KR 101222627B1 KR 1020077007033 A KR1020077007033 A KR 1020077007033A KR 20077007033 A KR20077007033 A KR 20077007033A KR 101222627 B1 KR101222627 B1 KR 101222627B1
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KR
South Korea
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pulse
workpiece
current
hole
copper
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Expired - Lifetime
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KR1020077007033A
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English (en)
Korean (ko)
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KR20070053304A (ko
Inventor
베르트 린쯔
토마스 프리트
베른드 로엘프스
토시야 후지와라
렌 벤젤
마르쿠스 유카니스
김성수
Original Assignee
아토테크더치랜드게엠베하
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Publication of KR20070053304A publication Critical patent/KR20070053304A/ko
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1492—Periodical treatments, e.g. pulse plating of through-holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020077007033A 2004-09-20 2005-08-30 금속으로 관통홀, 특히 구리로 인쇄회로기판의 관통홀을충진하기 위한 갈바닉 공정 Expired - Lifetime KR101222627B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102004045451.5 2004-09-20
DE102004045451A DE102004045451B4 (de) 2004-09-20 2004-09-20 Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer
PCT/EP2005/009332 WO2006032346A1 (en) 2004-09-20 2005-08-30 Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper

Publications (2)

Publication Number Publication Date
KR20070053304A KR20070053304A (ko) 2007-05-23
KR101222627B1 true KR101222627B1 (ko) 2013-01-16

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Family Applications (1)

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KR1020077007033A Expired - Lifetime KR101222627B1 (ko) 2004-09-20 2005-08-30 금속으로 관통홀, 특히 구리로 인쇄회로기판의 관통홀을충진하기 위한 갈바닉 공정

Country Status (10)

Country Link
US (2) US9445510B2 (enExample)
EP (1) EP1810554B1 (enExample)
JP (1) JP5078142B2 (enExample)
KR (1) KR101222627B1 (enExample)
CN (1) CN101053286B (enExample)
AT (1) ATE417492T1 (enExample)
DE (2) DE102004045451B4 (enExample)
MY (1) MY145344A (enExample)
TW (1) TWI370715B (enExample)
WO (1) WO2006032346A1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10827615B1 (en) 2020-01-06 2020-11-03 Samsung Electro-Mechanics Co., Ltd. Printed circuit board
KR20200137305A (ko) * 2019-05-29 2020-12-09 삼성전기주식회사 인쇄회로기판
WO2021107409A1 (ko) * 2019-11-27 2021-06-03 와이엠티 주식회사 회로기판의 관통홀 충진 방법 및 이를 이용하여 제조된 회로기판
US11096291B2 (en) 2019-06-25 2021-08-17 Samsung Electro-Mechanics Co., Ltd. Method for plating printed circuit board and printed circuit board using the same
KR20220093172A (ko) * 2019-11-05 2022-07-05 맥더미드 엔쏜 인코포레이티드 인쇄 회로 기판 및 다른 기판에서 관통 구멍을 충전하는 단일 단계 전해 방법

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KR100783467B1 (ko) * 2006-02-24 2007-12-07 삼성전기주식회사 내부 관통홀을 가지는 인쇄회로기판 및 그 제조 방법
ATE484943T1 (de) 2006-03-30 2010-10-15 Atotech Deutschland Gmbh Elektrolytisches verfahren zum füllen von löchern und vertiefungen mit metallen
KR100803004B1 (ko) * 2006-09-01 2008-02-14 삼성전기주식회사 관통홀 충진방법
JP6161863B2 (ja) * 2010-12-28 2017-07-12 株式会社荏原製作所 電気めっき方法
EP2518187A1 (en) 2011-04-26 2012-10-31 Atotech Deutschland GmbH Aqueous acidic bath for electrolytic deposition of copper
JP5980735B2 (ja) 2012-08-07 2016-08-31 株式会社荏原製作所 スルーホールの電気めっき方法及び電気めっき装置
KR20140034529A (ko) 2012-09-12 2014-03-20 삼성전기주식회사 전기 동도금 장치
JP6114527B2 (ja) * 2012-10-05 2017-04-12 新光電気工業株式会社 配線基板及びその製造方法
CN102877098B (zh) * 2012-10-29 2015-06-17 东莞市若美电子科技有限公司 一种多波段输出的脉冲电镀方法
CN104053311A (zh) * 2013-03-13 2014-09-17 欣兴电子股份有限公司 导通孔的制作方法
JP2015106653A (ja) 2013-11-29 2015-06-08 イビデン株式会社 プリント配線板の製造方法
CN104159420A (zh) * 2014-09-04 2014-11-19 深圳恒宝士线路板有限公司 带盲孔且具有四层线路的电路板制造方法
EP3029178A1 (en) 2014-12-05 2016-06-08 ATOTECH Deutschland GmbH Method and apparatus for electroplating a metal onto a substrate
EP3570645B1 (en) * 2018-05-17 2023-01-25 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with only partially filled thermal through-hole
US11716819B2 (en) * 2018-06-21 2023-08-01 Averatek Corporation Asymmetrical electrolytic plating for a conductive pattern
CN110306214A (zh) * 2019-07-05 2019-10-08 东莞市斯坦得电子材料有限公司 一种用于高纵横比孔径印制线路板通孔电镀的反向脉冲镀铜工艺
CN114342569A (zh) 2019-08-19 2022-04-12 德国艾托特克有限两合公司 高密度互连印刷电路板的制造顺序及高密度互连印刷电路板
US20230279577A1 (en) * 2022-03-04 2023-09-07 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200137305A (ko) * 2019-05-29 2020-12-09 삼성전기주식회사 인쇄회로기판
KR102662860B1 (ko) 2019-05-29 2024-05-03 삼성전기주식회사 인쇄회로기판
US11096291B2 (en) 2019-06-25 2021-08-17 Samsung Electro-Mechanics Co., Ltd. Method for plating printed circuit board and printed circuit board using the same
KR20220093172A (ko) * 2019-11-05 2022-07-05 맥더미드 엔쏜 인코포레이티드 인쇄 회로 기판 및 다른 기판에서 관통 구멍을 충전하는 단일 단계 전해 방법
KR102860148B1 (ko) * 2019-11-05 2025-09-16 맥더미드 엔쏜 인코포레이티드 인쇄 회로 기판 및 다른 기판에서 관통 구멍을 충전하는 단일 단계 전해 방법
WO2021107409A1 (ko) * 2019-11-27 2021-06-03 와이엠티 주식회사 회로기판의 관통홀 충진 방법 및 이를 이용하여 제조된 회로기판
US10827615B1 (en) 2020-01-06 2020-11-03 Samsung Electro-Mechanics Co., Ltd. Printed circuit board

Also Published As

Publication number Publication date
TW200623995A (en) 2006-07-01
ATE417492T1 (de) 2008-12-15
US20090236230A1 (en) 2009-09-24
EP1810554B1 (en) 2008-12-10
US9445510B2 (en) 2016-09-13
CN101053286B (zh) 2012-01-18
CN101053286A (zh) 2007-10-10
KR20070053304A (ko) 2007-05-23
US9526183B2 (en) 2016-12-20
JP5078142B2 (ja) 2012-11-21
JP2008513985A (ja) 2008-05-01
DE602005011662D1 (de) 2009-01-22
TWI370715B (en) 2012-08-11
DE102004045451A1 (de) 2006-03-30
DE102004045451B4 (de) 2007-05-03
US20160270241A1 (en) 2016-09-15
MY145344A (en) 2012-01-31
WO2006032346A1 (en) 2006-03-30
EP1810554A1 (en) 2007-07-25

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