DE102004045451B4 - Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer - Google Patents
Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer Download PDFInfo
- Publication number
- DE102004045451B4 DE102004045451B4 DE102004045451A DE102004045451A DE102004045451B4 DE 102004045451 B4 DE102004045451 B4 DE 102004045451B4 DE 102004045451 A DE102004045451 A DE 102004045451A DE 102004045451 A DE102004045451 A DE 102004045451A DE 102004045451 B4 DE102004045451 B4 DE 102004045451B4
- Authority
- DE
- Germany
- Prior art keywords
- current
- pulse
- workpiece
- holes
- current pulse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 101
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 47
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 44
- 239000010949 copper Substances 0.000 title claims abstract description 44
- 239000002184 metal Substances 0.000 title claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 26
- 150000002739 metals Chemical class 0.000 title claims abstract description 6
- 238000001465 metallisation Methods 0.000 claims description 45
- 239000003792 electrolyte Substances 0.000 claims description 28
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 15
- 238000000151 deposition Methods 0.000 claims description 11
- 230000008021 deposition Effects 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 9
- 239000006259 organic additive Substances 0.000 claims description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 6
- 239000000080 wetting agent Substances 0.000 claims description 4
- 230000002378 acidificating effect Effects 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 238000009713 electroplating Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000010354 integration Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- CWYNVVGOOAEACU-UHFFFAOYSA-N iron (II) ion Substances [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 3
- -1 iron ions Chemical class 0.000 description 3
- 230000010363 phase shift Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 241000209035 Ilex Species 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- LDIJVPMPOSYSMA-UHFFFAOYSA-L S(=O)(=O)(Cl)Cl.S(=O)(=O)([O-])[O-].[Cu+2] Chemical compound S(=O)(=O)(Cl)Cl.S(=O)(=O)([O-])[O-].[Cu+2] LDIJVPMPOSYSMA-UHFFFAOYSA-L 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 150000003951 lactams Chemical class 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 150000003585 thioureas Chemical class 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- BZVJOYBTLHNRDW-UHFFFAOYSA-N triphenylmethanamine Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(N)C1=CC=CC=C1 BZVJOYBTLHNRDW-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 241001295925 Gegenes Species 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000011143 downstream manufacturing Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 150000002605 large molecules Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- FDZZZRQASAIRJF-UHFFFAOYSA-M malachite green Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1C(C=1C=CC=CC=1)=C1C=CC(=[N+](C)C)C=C1 FDZZZRQASAIRJF-UHFFFAOYSA-M 0.000 description 1
- 229940107698 malachite green Drugs 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1492—Periodical treatments, e.g. pulse plating of through-holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Automation & Control Theory (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (12)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102004045451A DE102004045451B4 (de) | 2004-09-20 | 2004-09-20 | Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer |
| TW094128784A TWI370715B (en) | 2004-09-20 | 2005-08-23 | Galvanic process for filling through-holes with metals, in particular of printed citcuit boards with copper |
| AT05775130T ATE417492T1 (de) | 2004-09-20 | 2005-08-30 | Galvanischer prozess zur füllung von durchgangslöchern mit metallen, insbesondere von leiterplatten mit kupfer |
| PCT/EP2005/009332 WO2006032346A1 (en) | 2004-09-20 | 2005-08-30 | Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper |
| EP05775130A EP1810554B1 (en) | 2004-09-20 | 2005-08-30 | Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper |
| US11/661,704 US9445510B2 (en) | 2004-09-20 | 2005-08-30 | Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper |
| CN2005800315049A CN101053286B (zh) | 2004-09-20 | 2005-08-30 | 用金属填充通孔，尤其用铜填充印刷电路板的通孔的电化方法 |
| DE602005011662T DE602005011662D1 (de) | 2004-09-20 | 2005-08-30 | Galvanischer prozess zur füllung von durchgangslöchern mit metallen, insbesondere von leiterplatten mit kupfer |
| KR1020077007033A KR101222627B1 (ko) | 2004-09-20 | 2005-08-30 | 금속으로 관통홀, 특히 구리로 인쇄회로기판의 관통홀을충진하기 위한 갈바닉 공정 |
| JP2007531632A JP5078142B2 (ja) | 2004-09-20 | 2005-08-30 | スルーホールに金属を充填するための電気処理、とりわけプリント基板のスルーホールに銅を充填するための電気処理 |
| MYPI20054306A MY145344A (en) | 2004-09-20 | 2005-09-13 | Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper |
| US15/159,943 US9526183B2 (en) | 2004-09-20 | 2016-05-20 | Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102004045451A DE102004045451B4 (de) | 2004-09-20 | 2004-09-20 | Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE102004045451A1 DE102004045451A1 (de) | 2006-03-30 |
| DE102004045451B4 true DE102004045451B4 (de) | 2007-05-03 |
Family
ID=35447785
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102004045451A Expired - Fee Related DE102004045451B4 (de) | 2004-09-20 | 2004-09-20 | Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer |
| DE602005011662T Expired - Lifetime DE602005011662D1 (de) | 2004-09-20 | 2005-08-30 | Galvanischer prozess zur füllung von durchgangslöchern mit metallen, insbesondere von leiterplatten mit kupfer |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE602005011662T Expired - Lifetime DE602005011662D1 (de) | 2004-09-20 | 2005-08-30 | Galvanischer prozess zur füllung von durchgangslöchern mit metallen, insbesondere von leiterplatten mit kupfer |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US9445510B2 (enExample) |
| EP (1) | EP1810554B1 (enExample) |
| JP (1) | JP5078142B2 (enExample) |
| KR (1) | KR101222627B1 (enExample) |
| CN (1) | CN101053286B (enExample) |
| AT (1) | ATE417492T1 (enExample) |
| DE (2) | DE102004045451B4 (enExample) |
| MY (1) | MY145344A (enExample) |
| TW (1) | TWI370715B (enExample) |
| WO (1) | WO2006032346A1 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100632552B1 (ko) * | 2004-12-30 | 2006-10-11 | 삼성전기주식회사 | 내부 비아홀의 필 도금 구조 및 그 제조 방법 |
| KR100783467B1 (ko) * | 2006-02-24 | 2007-12-07 | 삼성전기주식회사 | 내부 관통홀을 가지는 인쇄회로기판 및 그 제조 방법 |
| US8784634B2 (en) | 2006-03-30 | 2014-07-22 | Atotech Deutschland Gmbh | Electrolytic method for filling holes and cavities with metals |
| KR100803004B1 (ko) * | 2006-09-01 | 2008-02-14 | 삼성전기주식회사 | 관통홀 충진방법 |
| JP6161863B2 (ja) * | 2010-12-28 | 2017-07-12 | 株式会社荏原製作所 | 電気めっき方法 |
| EP2518187A1 (en) | 2011-04-26 | 2012-10-31 | Atotech Deutschland GmbH | Aqueous acidic bath for electrolytic deposition of copper |
| JP5980735B2 (ja) | 2012-08-07 | 2016-08-31 | 株式会社荏原製作所 | スルーホールの電気めっき方法及び電気めっき装置 |
| KR20140034529A (ko) | 2012-09-12 | 2014-03-20 | 삼성전기주식회사 | 전기 동도금 장치 |
| JP6114527B2 (ja) * | 2012-10-05 | 2017-04-12 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
| CN102877098B (zh) * | 2012-10-29 | 2015-06-17 | 东莞市若美电子科技有限公司 | 一种多波段输出的脉冲电镀方法 |
| CN104053311A (zh) * | 2013-03-13 | 2014-09-17 | 欣兴电子股份有限公司 | 导通孔的制作方法 |
| JP2015106653A (ja) * | 2013-11-29 | 2015-06-08 | イビデン株式会社 | プリント配線板の製造方法 |
| CN104159420A (zh) * | 2014-09-04 | 2014-11-19 | 深圳恒宝士线路板有限公司 | 带盲孔且具有四层线路的电路板制造方法 |
| EP3029178A1 (en) | 2014-12-05 | 2016-06-08 | ATOTECH Deutschland GmbH | Method and apparatus for electroplating a metal onto a substrate |
| EP3570645B1 (en) * | 2018-05-17 | 2023-01-25 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with only partially filled thermal through-hole |
| US11716819B2 (en) * | 2018-06-21 | 2023-08-01 | Averatek Corporation | Asymmetrical electrolytic plating for a conductive pattern |
| KR102662860B1 (ko) * | 2019-05-29 | 2024-05-03 | 삼성전기주식회사 | 인쇄회로기판 |
| KR102748951B1 (ko) * | 2019-06-25 | 2025-01-02 | 삼성전기주식회사 | 인쇄회로기판 도금 방법 및 인쇄회로기판 |
| CN110306214A (zh) * | 2019-07-05 | 2019-10-08 | 东莞市斯坦得电子材料有限公司 | 一种用于高纵横比孔径印制线路板通孔电镀的反向脉冲镀铜工艺 |
| US12063751B2 (en) | 2019-08-19 | 2024-08-13 | Atotech Deutschland GmbH & Co. KG | Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board |
| US11746433B2 (en) * | 2019-11-05 | 2023-09-05 | Macdermid Enthone Inc. | Single step electrolytic method of filling through holes in printed circuit boards and other substrates |
| KR102215846B1 (ko) * | 2019-11-27 | 2021-02-16 | 와이엠티 주식회사 | 회로기판의 관통홀 충진 방법 및 이를 이용하여 제조된 회로기판 |
| KR102776287B1 (ko) | 2020-01-06 | 2025-03-07 | 삼성전기주식회사 | 인쇄회로기판 |
| US20230279577A1 (en) * | 2022-03-04 | 2023-09-07 | Rohm And Haas Electronic Materials Llc | Method of filling through-holes to reduce voids |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2739427A1 (de) * | 1976-09-01 | 1978-03-02 | Inoue Japax Res | Verfahren und vorrichtung fuer galvanischen niederschlag |
| DE4126502C1 (enExample) * | 1991-08-07 | 1993-02-11 | Schering Ag Berlin Und Bergkamen, 1000 Berlin, De | |
| EP0645950B1 (en) * | 1993-09-21 | 1998-09-02 | Matsushita Electric Industrial Co., Ltd. | Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same |
| DE19915146C1 (de) * | 1999-01-21 | 2000-07-06 | Atotech Deutschland Gmbh | Verfahren zum galvanischen Bilden von Leiterstrukturen aus hochreinem Kupfer bei der Herstellung von integrierten Schaltungen |
| DE10113767A1 (de) * | 2000-03-22 | 2001-10-11 | Toyoda Automatic Loom Works | Elektrolytisches Plattierungsverfahren und Vorrichtung für eine Leiterbahnplatine |
| DE4225961C2 (de) * | 1992-08-06 | 2001-11-29 | Hans Hoellmueller Maschb Gmbh | Vorrichtung zur Galvanisierung, insbesondere Verkupferung, flacher platten- oder bogenförmiger Gegenstände |
| EP1194023A1 (en) * | 1999-12-14 | 2002-04-03 | Matsushita Electric Industrial Co., Ltd. | Multilayered printed wiring board and production method therefor |
| EP1219729A1 (en) * | 2000-12-20 | 2002-07-03 | Shipley Co. L.L.C. | Electrolytic copper plating solution and method for controlling the same |
| EP1264918A1 (en) * | 2001-06-07 | 2002-12-11 | Shipley Co. L.L.C. | Electrolytic copper plating method |
| DE10236200A1 (de) * | 2001-08-08 | 2003-05-22 | Toyota Jidoshokki Kariya Kk | Verfahren zum Verkupfern von Durchgangsöffnungen |
| DE10223957A1 (de) * | 2002-05-31 | 2003-12-11 | Advanced Micro Devices Inc | Ein verbessertes Verfahren zum Elektroplattieren von Kupfer auf einer strukturierten dielektrischen Schicht |
| JP2004204351A (ja) * | 2002-12-20 | 2004-07-22 | Rohm & Haas Electronic Materials Llc | 逆パルスめっき組成物および逆パルスメッキ方法 |
| DE10325101A1 (de) * | 2003-06-03 | 2004-12-30 | Atotech Deutschland Gmbh | Verfahren zum Auffüllen von µ-Blind-Vias (µ-BVs) |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4683036A (en) * | 1983-06-10 | 1987-07-28 | Kollmorgen Technologies Corporation | Method for electroplating non-metallic surfaces |
| DE3836521C2 (de) | 1988-10-24 | 1995-04-13 | Atotech Deutschland Gmbh | Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung des Bades |
| DE4229403C2 (de) * | 1992-09-03 | 1995-04-13 | Hoellmueller Maschbau H | Vorrichtung zum Galvanisieren dünner, ein- oder beidseits mit einer leitfähigen Beschichtung versehener Kunststoffolien |
| DE19545231A1 (de) * | 1995-11-21 | 1997-05-22 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung von Metallschichten |
| DE19547948C1 (de) | 1995-12-21 | 1996-11-21 | Atotech Deutschland Gmbh | Verfahren und Schaltungsanordnung zur Erzeugung von Strompulsen zur elektrolytischen Metallabscheidung |
| DE19717512C3 (de) * | 1997-04-25 | 2003-06-18 | Atotech Deutschland Gmbh | Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen |
| US5972192A (en) * | 1997-07-23 | 1999-10-26 | Advanced Micro Devices, Inc. | Pulse electroplating copper or copper alloys |
| US6071398A (en) * | 1997-10-06 | 2000-06-06 | Learonal, Inc. | Programmed pulse electroplating process |
| JP2000173949A (ja) * | 1998-12-09 | 2000-06-23 | Fujitsu Ltd | 半導体装置及びその製造方法並びにめっき方法及び装置 |
| US6793795B1 (en) | 1999-01-21 | 2004-09-21 | Atotech Deutschland Gmbh | Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits |
| US6652727B2 (en) | 1999-10-15 | 2003-11-25 | Faraday Technology Marketing Group, Llc | Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes |
| EP1132500A3 (en) | 2000-03-08 | 2002-01-23 | Applied Materials, Inc. | Method for electrochemical deposition of metal using modulated waveforms |
| JP2002004083A (ja) * | 2000-04-18 | 2002-01-09 | Shinko Electric Ind Co Ltd | ヴィアフィリング方法 |
| JP2002016332A (ja) * | 2000-06-28 | 2002-01-18 | Ibiden Co Ltd | スルーホールを有する積層板およびその製造方法 |
| JP2002053993A (ja) | 2000-08-04 | 2002-02-19 | Mitsui Mining & Smelting Co Ltd | 電解銅箔およびその製造方法 |
| US20020015833A1 (en) | 2000-06-29 | 2002-02-07 | Naotomi Takahashi | Manufacturing method of electrodeposited copper foil and electrodeposited copper foil |
| JP2002141440A (ja) | 2000-11-01 | 2002-05-17 | Mitsui High Tec Inc | 基板の製造方法 |
| US6458696B1 (en) * | 2001-04-11 | 2002-10-01 | Agere Systems Guardian Corp | Plated through hole interconnections |
| WO2002086196A1 (en) | 2001-04-19 | 2002-10-31 | Rd Chemical Company | Copper acid baths, system and method for electroplating high aspect ratio substrates |
| JP3941433B2 (ja) | 2001-08-08 | 2007-07-04 | 株式会社豊田自動織機 | ビアホールのスミア除去方法 |
| JP4148895B2 (ja) * | 2001-10-16 | 2008-09-10 | 新光電気工業株式会社 | ホールの銅めっき方法 |
| JP2003168860A (ja) * | 2001-11-30 | 2003-06-13 | Cmk Corp | プリント配線板及びその製造方法 |
| JP3964263B2 (ja) | 2002-05-17 | 2007-08-22 | 株式会社デンソー | ブラインドビアホール充填方法及び貫通電極形成方法 |
| US20040154926A1 (en) * | 2002-12-24 | 2004-08-12 | Zhi-Wen Sun | Multiple chemistry electrochemical plating method |
| JP2004311919A (ja) * | 2003-02-21 | 2004-11-04 | Shinko Electric Ind Co Ltd | スルーホールフィル方法 |
| DE10311575B4 (de) * | 2003-03-10 | 2007-03-22 | Atotech Deutschland Gmbh | Verfahren zum elektrolytischen Metallisieren von Werkstücken mit Bohrungen mit einem hohen Aspektverhältnis |
| JP4248353B2 (ja) * | 2003-09-19 | 2009-04-02 | 新光電気工業株式会社 | スルーホールの充填方法 |
| US20050121214A1 (en) * | 2003-12-04 | 2005-06-09 | Gould Len C. | Active electrical transmission system |
| JP4973829B2 (ja) * | 2004-07-23 | 2012-07-11 | 上村工業株式会社 | 電気銅めっき浴及び電気銅めっき方法 |
-
2004
- 2004-09-20 DE DE102004045451A patent/DE102004045451B4/de not_active Expired - Fee Related
-
2005
- 2005-08-23 TW TW094128784A patent/TWI370715B/zh not_active IP Right Cessation
- 2005-08-30 KR KR1020077007033A patent/KR101222627B1/ko not_active Expired - Lifetime
- 2005-08-30 DE DE602005011662T patent/DE602005011662D1/de not_active Expired - Lifetime
- 2005-08-30 AT AT05775130T patent/ATE417492T1/de active
- 2005-08-30 US US11/661,704 patent/US9445510B2/en active Active
- 2005-08-30 WO PCT/EP2005/009332 patent/WO2006032346A1/en not_active Ceased
- 2005-08-30 EP EP05775130A patent/EP1810554B1/en not_active Expired - Lifetime
- 2005-08-30 JP JP2007531632A patent/JP5078142B2/ja not_active Expired - Lifetime
- 2005-08-30 CN CN2005800315049A patent/CN101053286B/zh not_active Expired - Lifetime
- 2005-09-13 MY MYPI20054306A patent/MY145344A/en unknown
-
2016
- 2016-05-20 US US15/159,943 patent/US9526183B2/en not_active Expired - Lifetime
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2739427A1 (de) * | 1976-09-01 | 1978-03-02 | Inoue Japax Res | Verfahren und vorrichtung fuer galvanischen niederschlag |
| DE4126502C1 (enExample) * | 1991-08-07 | 1993-02-11 | Schering Ag Berlin Und Bergkamen, 1000 Berlin, De | |
| DE4225961C2 (de) * | 1992-08-06 | 2001-11-29 | Hans Hoellmueller Maschb Gmbh | Vorrichtung zur Galvanisierung, insbesondere Verkupferung, flacher platten- oder bogenförmiger Gegenstände |
| EP0645950B1 (en) * | 1993-09-21 | 1998-09-02 | Matsushita Electric Industrial Co., Ltd. | Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same |
| DE19915146C1 (de) * | 1999-01-21 | 2000-07-06 | Atotech Deutschland Gmbh | Verfahren zum galvanischen Bilden von Leiterstrukturen aus hochreinem Kupfer bei der Herstellung von integrierten Schaltungen |
| EP1194023A1 (en) * | 1999-12-14 | 2002-04-03 | Matsushita Electric Industrial Co., Ltd. | Multilayered printed wiring board and production method therefor |
| DE10113767A1 (de) * | 2000-03-22 | 2001-10-11 | Toyoda Automatic Loom Works | Elektrolytisches Plattierungsverfahren und Vorrichtung für eine Leiterbahnplatine |
| EP1219729A1 (en) * | 2000-12-20 | 2002-07-03 | Shipley Co. L.L.C. | Electrolytic copper plating solution and method for controlling the same |
| EP1264918A1 (en) * | 2001-06-07 | 2002-12-11 | Shipley Co. L.L.C. | Electrolytic copper plating method |
| DE10236200A1 (de) * | 2001-08-08 | 2003-05-22 | Toyota Jidoshokki Kariya Kk | Verfahren zum Verkupfern von Durchgangsöffnungen |
| DE10223957A1 (de) * | 2002-05-31 | 2003-12-11 | Advanced Micro Devices Inc | Ein verbessertes Verfahren zum Elektroplattieren von Kupfer auf einer strukturierten dielektrischen Schicht |
| JP2004204351A (ja) * | 2002-12-20 | 2004-07-22 | Rohm & Haas Electronic Materials Llc | 逆パルスめっき組成物および逆パルスメッキ方法 |
| EP1475463A2 (en) * | 2002-12-20 | 2004-11-10 | Shipley Company, L.L.C. | Reverse pulse plating composition and method |
| DE10325101A1 (de) * | 2003-06-03 | 2004-12-30 | Atotech Deutschland Gmbh | Verfahren zum Auffüllen von µ-Blind-Vias (µ-BVs) |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20070053304A (ko) | 2007-05-23 |
| MY145344A (en) | 2012-01-31 |
| JP2008513985A (ja) | 2008-05-01 |
| DE602005011662D1 (de) | 2009-01-22 |
| EP1810554A1 (en) | 2007-07-25 |
| US20090236230A1 (en) | 2009-09-24 |
| TWI370715B (en) | 2012-08-11 |
| US20160270241A1 (en) | 2016-09-15 |
| DE102004045451A1 (de) | 2006-03-30 |
| ATE417492T1 (de) | 2008-12-15 |
| KR101222627B1 (ko) | 2013-01-16 |
| CN101053286B (zh) | 2012-01-18 |
| TW200623995A (en) | 2006-07-01 |
| CN101053286A (zh) | 2007-10-10 |
| EP1810554B1 (en) | 2008-12-10 |
| WO2006032346A1 (en) | 2006-03-30 |
| US9445510B2 (en) | 2016-09-13 |
| JP5078142B2 (ja) | 2012-11-21 |
| US9526183B2 (en) | 2016-12-20 |
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