JP2007522647A - プラズマ処理装置用のシャワーヘッド電極アセンブリ - Google Patents
プラズマ処理装置用のシャワーヘッド電極アセンブリ Download PDFInfo
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Abstract
Description
Claims (31)
- 半導体基板処理室内のシャワーヘッド電極を支持するための熱制御板であって、
温度制御された上板に取外し自在に取り付けることができるように適合された金属外側部分と、
前記シャワーヘッド電極および前記上板に取外し自在に取り付けることができるように適合された金属内側部分とを備え、前記内側部分は、前記上板とシャワーヘッド電極との間に熱的および電気的な経路を設けることを特徴とする熱制御板。 - 前記外側部分は環状フランジを備え、前記内側部分は成形板(contoured plate)を備え、前記外側部分は、たわみ部分により前記内側部分に接続されることを特徴とする請求項1に記載の熱制御板。
- 前記成形板(contoured plate)は、上面と前記上面上の環状の第1の突起とを備え、前記第1の突起は、熱を前記上板に伝達するように適合された第1の熱伝達表面と、前記上板と前記第1の熱伝達表面との間の任意選択のO−リングを収容するように構成された任意選択の相隔たる環状溝とを備えることを特徴とする請求項2に記載の熱制御板。
- 前記成形板(contoured plate)は、前記第1の突起から放射状に間隔を置いて配置された環状の第2の突起を前記上面に備え、前記第2の突起は、熱を前記上板に伝達するように適合された第2の熱伝達表面と、前記上板と前記第2の熱伝達表面との間の任意選択のO−リングを収容するように構成された任意選択の相隔たる環状溝とを備えることを特徴とする請求項3に記載の熱制御板。
- 前記内側部分は、前記上板とシャワーヘッド電極との間の熱的および電気的な経路を提供する少なくとも1つの熱ブリッジを備えることを特徴とする請求項1に記載の熱制御板。
- 前記外側部分は、前記上板内の位置合せ開口部に合うように適合され、前記熱制御板と前記上板との間で円周方向および放射方向の位置合せを行うための位置合せピンと、前記上板の下端側を貫通して延びるボルトを受けるように適合されたねじを切った開口部と、前記上板と前記熱制御板との間の任意選択のO−リングを収容するように適合された任意選択の溝とを備えることを特徴とする請求項1に記載の熱制御板。
- 前記シャワーヘッド電極に熱を供給することができる少なくとも1つのヒータをさらに備えることを特徴とする請求項1に記載の熱制御板。
- 前記ヒータは、前記成形板の中心領域にある内部ヒータ部と、前記成形板(contoured plate)の前記中心領域の外部にある少なくとも1つの外部ヒータ部とを備え、前記内部ヒータ部および外部ヒータ部は、少なくとも1つの電気コネクタによって相互接続されることを特徴とする請求項7に記載の熱制御板。
- 前記ヒータは、誘電体層間に抵抗性加熱材料を含む薄板(laminate)を備えることを特徴とする請求項7に記載の熱制御板。
- 前記ヒータは、3相ヒータを備えることを特徴とする請求項7に記載の熱制御板。
- 前記ヒータは、第1の位相の交流電流を受け取るように適合された第1の抵抗性加熱導体と、第2の位相の交流電流を受け取るように適合された第2の抵抗性加熱導体と、第3の位相の交流電流を受け取るように適合された第3の抵抗性加熱導体とを含む3つの回路を備え、前記第1、第2および第3の位相は、互いに120°位相がずれていることを特徴とする請求項7に記載の熱制御板。
- 前記内側部分の両側の間に延びるガス流路をさらに備えることを特徴とする請求項1に記載の熱制御板。
- 半導体基板処理装置のシャワーヘッド電極アセンブリであって、
上板と、
シャワーヘッド電極と、
その中心部分が前記上板に対して移動可能であるように、前記シャワーヘッド電極および前記上板に取り付けられた熱制御板と、
前記熱制御板の前記中心部分と前記上板との間の少なくとも1つの熱ブリッジとを備え、前記熱ブリッジは、前記シャワーヘッド電極と前記上板との間に熱的および電気的な経路を提供することを特徴とするシャワーヘッド電極アセンブリ。 - 少なくとも2つの横方向に相隔たる熱ブリッジを備えることを特徴とする請求項13に記載のシャワーヘッド電極アセンブリ。
- 前記熱ブリッジの各々は、前記熱制御板と前記上板との間に熱的および電気的な伝導性をもたらす潤滑材料の層を備え、前記潤滑材料は、任意選択として少なくとも1つのO−リングを備える真空封止内に配置されることを特徴とする請求項14に記載のシャワーヘッド電極アセンブリ。
- 前記潤滑材料の層の各々は、環状構成と約0.75インチから約1.25インチまでの幅とを有することを特徴とする請求項15に記載のシャワーヘッド電極アセンブリ。
- 前記熱制御板を加熱するように適合されたヒータをさらに備えることを特徴とする請求項13に記載のシャワーヘッド電極アセンブリ。
- 前記ヒータは、3相ヒータであることを特徴とする請求項17に記載のシャワーヘッド電極アセンブリ。
- 前記ヒータは、誘電体材料の対向する層の間に抵抗性加熱材料を含む薄板(laminate)を備えることを特徴とする請求項17に記載のシャワーヘッド電極アセンブリ。
- 前記上板は、前記上板の温度を制御するために熱伝達流体が流れる少なくとも1つの流路を備えることを特徴とする請求項13に記載のシャワーヘッド電極アセンブリ。
- 前記熱制御板は、互いに異なる熱膨張に適応し、前記上板と前記熱制御板との間に熱的および電気的な伝導をもたらすように構成されたたわみ部分を備えることを特徴とする請求項13に記載のシャワーヘッド電極アセンブリ。
- 前記シャワーヘッド電極は、エラストマー・ボンドによりシリコン板の上面に接着された裏当て板を備えることを特徴とする請求項13に記載のシャワーヘッド電極アセンブリ。
- 前記裏当て板は、黒鉛裏当て板であることを特徴とする請求項22に記載のシャワーヘッド電極アセンブリ。
- 前記熱制御板は、アルミニウムまたはアルミニウム合金の機械加工してなる片であることを特徴とする請求項13に記載のシャワーヘッド電極アセンブリ。
- 前記上板は、前記上板内の開口部を介して延びる留め具を用いて前記熱制御板に取り付けられ、任意選択として前記上板の上側に取り付けられたカバー板を備え、前記留め具が前記処理装置内の真空圧力に曝されるように前記開口部を封止することを特徴とする請求項13に記載のシャワーヘッド電極アセンブリ。
- 前記上板は、前記上板内の開口部を介して延び、前記少なくとも1つの熱ブリッジ内のねじを切った開口部にねじ込まれる留め具を用いて前記熱制御板に取り付けられ、前記熱ブリッジの各々は、前記留め具が前記処理装置内の大気圧に曝されるように前記熱制御板と前記上板との間を真空封止する少なくとも1つのO−リングを備えることを特徴とする請求項13に記載のシャワーヘッド電極アセンブリ。
- 前記上板は、前記上板内の開口部を介して延びる留め具を用いて前記熱制御板に取り付けられ、前記開口部は、前記上板と前記熱制御板との間の互いに異なる熱膨張に適応するために、前記留め具の直径よりも大きい直径を有することを特徴とする請求項13に記載のシャワーヘッド電極アセンブリ。
- 前記少なくとも1つの熱ブリッジは、前記熱制御板の上に2つの相隔たる環状突起を備え、前記上板は、前記上板内の開口部を介して前記熱ブリッジの各々に延びる留め具を用いて前記熱制御板に取り付けられ、前記熱制御板は、前記突起を介して横方向に延びるガス流路と、前記各熱ブリッジの内外の横方向に配置された前記熱制御板の対向する両表面の間で軸方向に延びるガス流路とを備えることを特徴とする請求項13に記載のシャワーヘッド電極アセンブリ。
- 半導体基板処理室内の半導体基板を処理する方法であって、
a)半導体基板処理装置のプラズマ室内の、下部電極を備える基板支持具上に基板を置く工程と、
b)請求項13に記載のシャワーヘッド電極アセンブリを用いて、プロセス・ガスを前記プラズマ室に供給する工程と、
c)前記シャワーヘッド電極アセンブリと前記基板との間で、前記プラズマ室内の前記プロセス・ガスからプラズマを生成する工程と、
d)前記プラズマを用いて前記基板を処理する工程と、
e)前記プラズマの前記生成を終了する工程と、
f)前記基板を前記プラズマ室から取り出す工程とを含むことを特徴とする方法。 - 前記シャワーヘッド電極アセンブリがヒータをさらに備え、前記シャワーヘッド電極を所望の温度に維持するように前記シャワーヘッド電極に熱を加えるために、e)の後に前記ヒータを作動させる工程をさらに含むことを特徴とする請求項29に記載の方法。
- a)からf)の間、前記シャワーヘッド電極に熱を加えるために前記ヒータを作動させる工程をさらに含むことを特徴とする請求項30に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/743,062 US7645341B2 (en) | 2003-12-23 | 2003-12-23 | Showerhead electrode assembly for plasma processing apparatuses |
US10/743,062 | 2003-12-23 | ||
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Also Published As
Publication number | Publication date |
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US7645341B2 (en) | 2010-01-12 |
JP5497705B2 (ja) | 2014-05-21 |
JP2011254097A (ja) | 2011-12-15 |
BRPI0417991A (pt) | 2007-04-27 |
US20050133160A1 (en) | 2005-06-23 |
TWI390624B (zh) | 2013-03-21 |
WO2005065186A2 (en) | 2005-07-21 |
TW200524038A (en) | 2005-07-16 |
KR101345904B1 (ko) | 2013-12-31 |
KR20060129279A (ko) | 2006-12-15 |
US20100065214A1 (en) | 2010-03-18 |
JP4870575B2 (ja) | 2012-02-08 |
CN1977068A (zh) | 2007-06-06 |
WO2005065186A3 (en) | 2006-05-18 |
US8080107B2 (en) | 2011-12-20 |
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