JP2005524239A5 - - Google Patents

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Publication number
JP2005524239A5
JP2005524239A5 JP2004502330A JP2004502330A JP2005524239A5 JP 2005524239 A5 JP2005524239 A5 JP 2005524239A5 JP 2004502330 A JP2004502330 A JP 2004502330A JP 2004502330 A JP2004502330 A JP 2004502330A JP 2005524239 A5 JP2005524239 A5 JP 2005524239A5
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Japan
Prior art keywords
integrated circuit
substrate
circuit package
die
disposed
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JP2004502330A
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Japanese (ja)
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JP2005524239A (ja
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Priority claimed from PCT/US2003/013524 external-priority patent/WO2003094203A2/en
Publication of JP2005524239A publication Critical patent/JP2005524239A/ja
Publication of JP2005524239A5 publication Critical patent/JP2005524239A5/ja
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JP2004502330A 2002-04-29 2003-04-29 ダイレクト・コネクト形信号システム Withdrawn JP2005524239A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US37648202P 2002-04-29 2002-04-29
US40018002P 2002-07-31 2002-07-31
PCT/US2003/013524 WO2003094203A2 (en) 2002-04-29 2003-04-29 Direct-connect signaling system

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010089212A Division JP5437137B2 (ja) 2002-04-29 2010-04-08 ダイレクト・コネクト形信号システム

Publications (2)

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JP2005524239A JP2005524239A (ja) 2005-08-11
JP2005524239A5 true JP2005524239A5 (enExample) 2006-06-15

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JP2004502330A Withdrawn JP2005524239A (ja) 2002-04-29 2003-04-29 ダイレクト・コネクト形信号システム
JP2010089212A Expired - Fee Related JP5437137B2 (ja) 2002-04-29 2010-04-08 ダイレクト・コネクト形信号システム

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US (2) US7307293B2 (enExample)
EP (1) EP1506568B1 (enExample)
JP (2) JP2005524239A (enExample)
CN (1) CN1659810B (enExample)
AU (1) AU2003223783A1 (enExample)
WO (1) WO2003094203A2 (enExample)

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