JP2005524239A - ダイレクト・コネクト形信号システム - Google Patents

ダイレクト・コネクト形信号システム Download PDF

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Publication number
JP2005524239A
JP2005524239A JP2004502330A JP2004502330A JP2005524239A JP 2005524239 A JP2005524239 A JP 2005524239A JP 2004502330 A JP2004502330 A JP 2004502330A JP 2004502330 A JP2004502330 A JP 2004502330A JP 2005524239 A JP2005524239 A JP 2005524239A
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JP
Japan
Prior art keywords
integrated circuit
substrate
circuit package
die
cable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2004502330A
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English (en)
Japanese (ja)
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JP2005524239A5 (enExample
Inventor
フジェルスタッド，ジョセフ・シー
セガラム，パラ・ケイ
ハバ，ベルガセム
Original Assignee
シリコン・パイプ・インコーポレーテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by シリコン・パイプ・インコーポレーテッド filed Critical シリコン・パイプ・インコーポレーテッド
Publication of JP2005524239A publication Critical patent/JP2005524239A/ja
Publication of JP2005524239A5 publication Critical patent/JP2005524239A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10356—Cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2004502330A 2002-04-29 2003-04-29 ダイレクト・コネクト形信号システム Withdrawn JP2005524239A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US37648202P 2002-04-29 2002-04-29
US40018002P 2002-07-31 2002-07-31
PCT/US2003/013524 WO2003094203A2 (en) 2002-04-29 2003-04-29 Direct-connect signaling system

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010089212A Division JP5437137B2 (ja) 2002-04-29 2010-04-08 ダイレクト・コネクト形信号システム

Publications (2)

Publication Number Publication Date
JP2005524239A true JP2005524239A (ja) 2005-08-11
JP2005524239A5 JP2005524239A5 (enExample) 2006-06-15

Family

ID=29406757

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2004502330A Withdrawn JP2005524239A (ja) 2002-04-29 2003-04-29 ダイレクト・コネクト形信号システム
JP2010089212A Expired - Fee Related JP5437137B2 (ja) 2002-04-29 2010-04-08 ダイレクト・コネクト形信号システム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2010089212A Expired - Fee Related JP5437137B2 (ja) 2002-04-29 2010-04-08 ダイレクト・コネクト形信号システム

Country Status (6)

Country Link
US (2) US7307293B2 (enExample)
EP (1) EP1506568B1 (enExample)
JP (2) JP2005524239A (enExample)
CN (1) CN1659810B (enExample)
AU (1) AU2003223783A1 (enExample)
WO (1) WO2003094203A2 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
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JP2011515762A (ja) * 2008-03-21 2011-05-19 ソニー株式会社 Ｈｄｍｉ又は同様のｉ／ｆのためのバスベースの切り替え方式を構築するための革新的方法
JP2012503887A (ja) * 2008-09-29 2012-02-09 インテル コーポレイション マウントされたプロセッサの入出力アーキテクチャ
WO2018124004A1 (ja) * 2016-12-28 2018-07-05 株式会社村田製作所 電子機器
WO2018142884A1 (ja) * 2017-02-03 2018-08-09 株式会社村田製作所 インターポーザおよび電子機器
KR20190044622A (ko) * 2016-09-19 2019-04-30 인텔 코포레이션 긴 호스트 라우팅을 위한 대안적인 회로 장치
JP2022511581A (ja) * 2019-11-15 2022-02-01 バイドゥ ドットコム タイムス テクノロジー （ベイジン） カンパニー リミテッド フレキシブルケーブル接続に基づく分散型ａｉトレーニングトポロジー

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