JP2010219501A - 回路基板及びこの回路基板を有する電子装置 - Google Patents
回路基板及びこの回路基板を有する電子装置 Download PDFInfo
- Publication number
- JP2010219501A JP2010219501A JP2010009357A JP2010009357A JP2010219501A JP 2010219501 A JP2010219501 A JP 2010219501A JP 2010009357 A JP2010009357 A JP 2010009357A JP 2010009357 A JP2010009357 A JP 2010009357A JP 2010219501 A JP2010219501 A JP 2010219501A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- layer
- pads
- signal
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0256—Electrical insulation details, e.g. around high voltage areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
- H05K1/0259—Electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
【解決手段】本発明に係る回路基板は、対向設置された第一表面及び第二表面を有し、前記第一表面には、電子部品の複数の信号ピンに接続された複数のパッドが形成されている第一信号層と、前記第一信号層の第二表面に形成され、絶縁基材及び該絶縁基材上に形成された導体を有する電源層と、を備えてなる回路基板であって、前記導体は、前記複数のパッドの下部に位置し、且つ前記複数のパッドに対応する複数の孔を有し、前記パッドのサイズは、対応する孔のサイズよりも小さい。又、本発明は、この回路基板を有する電子装置に関する。
【選択図】図2
Description
11 第一信号層
12 第二信号層
13 電源層
14 接地層
20 電子部品
21 本体
22 信号ピン
100 電子装置
111 パッド
112 第一表面
113 第二表面
131 帯状導体
131a 孔
132 絶縁基材
Claims (4)
- 対向設置された第一表面及び第二表面を有し、前記第一表面には、電子部品の複数の信号ピンに接続された複数のパッドが形成されている第一信号層と、
前記第一信号層の第二表面に形成され、絶縁基材及び該絶縁基材上に形成された導体を有する電源層と、を備えてなる回路基板であって、
前記導体は、前記複数のパッドの下部に位置し、且つ前記複数のパッドに対応する複数の孔を有し、前記パッドのサイズは、対応する孔のサイズよりも小さいことを特徴とする回路基板。 - 前記電源層における前記第一信号層と接する面と対向する表面に形成された接地層をさらに備えることを特徴とする請求項1に記載の回路基板。
- 前記接地層における前記電源層と接する面と対向する表面に形成された第二信号層をさらに備えることを特徴とする請求項2に記載の回路基板。
- 電子部品と、
請求項1〜3のいずれか一項に記載の回路基板と、
を備えることを特徴とする電子装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910300914A CN101841970A (zh) | 2009-03-17 | 2009-03-17 | 印刷电路板及具有该印刷电路板的电子装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2010219501A true JP2010219501A (ja) | 2010-09-30 |
Family
ID=42736505
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010009357A Pending JP2010219501A (ja) | 2009-03-17 | 2010-01-19 | 回路基板及びこの回路基板を有する電子装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8026449B2 (ja) |
JP (1) | JP2010219501A (ja) |
CN (1) | CN101841970A (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102665155A (zh) * | 2012-04-28 | 2012-09-12 | 歌尔声学股份有限公司 | 蓝牙耳机电路板 |
CN104135817B (zh) * | 2014-06-17 | 2017-10-24 | 京东方科技集团股份有限公司 | 柔性电路板及其制作方法以及电容式触摸显示装置 |
CN107529022B (zh) * | 2016-06-21 | 2021-12-07 | 中兴通讯股份有限公司 | Av接口电路及其制造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0529772A (ja) * | 1991-07-19 | 1993-02-05 | Oki Electric Ind Co Ltd | 高速信号伝送用回路基板 |
JP2004273718A (ja) * | 2003-03-07 | 2004-09-30 | Kyocera Corp | 配線基板 |
JP2006074014A (ja) * | 2004-08-06 | 2006-03-16 | Toyota Industries Corp | 多層プリント基板、及びマイクロストリップラインのインピーダンス管理方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5003273A (en) * | 1989-12-04 | 1991-03-26 | Itt Corporation | Multilayer printed circuit board with pseudo-coaxial transmission lines |
US7663064B2 (en) * | 2004-09-25 | 2010-02-16 | Banpil Photonics, Inc. | High-speed flex printed circuit and method of manufacturing |
-
2009
- 2009-03-17 CN CN200910300914A patent/CN101841970A/zh active Pending
- 2009-04-13 US US12/422,298 patent/US8026449B2/en not_active Expired - Fee Related
-
2010
- 2010-01-19 JP JP2010009357A patent/JP2010219501A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0529772A (ja) * | 1991-07-19 | 1993-02-05 | Oki Electric Ind Co Ltd | 高速信号伝送用回路基板 |
JP2004273718A (ja) * | 2003-03-07 | 2004-09-30 | Kyocera Corp | 配線基板 |
JP2006074014A (ja) * | 2004-08-06 | 2006-03-16 | Toyota Industries Corp | 多層プリント基板、及びマイクロストリップラインのインピーダンス管理方法 |
Also Published As
Publication number | Publication date |
---|---|
US20100236818A1 (en) | 2010-09-23 |
US8026449B2 (en) | 2011-09-27 |
CN101841970A (zh) | 2010-09-22 |
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