JP2005522027A - 半導体基板洗浄のためのｐｈ緩衝組成物 - Google Patents

半導体基板洗浄のためのｐｈ緩衝組成物 Download PDF

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Publication number
JP2005522027A
JP2005522027A JP2003580947A JP2003580947A JP2005522027A JP 2005522027 A JP2005522027 A JP 2005522027A JP 2003580947 A JP2003580947 A JP 2003580947A JP 2003580947 A JP2003580947 A JP 2003580947A JP 2005522027 A JP2005522027 A JP 2005522027A
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Prior art keywords
acid
semi
cleaning formulation
water soluble
formulation
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Ceased
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JP2003580947A
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English (en)
Japanese (ja)
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JP2005522027A5 (https=
Inventor
セイジョー，マ．ファティーマ
ウォゼツァック，ウイリアム，エー．
ベルナルド，デービッド
バウム，トーマス，エイチ．
ミンセック，デービッド
Original Assignee
アドバンスド．テクノロジー．マテリアルス．インコーポレイテッド
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Publication of JP2005522027A publication Critical patent/JP2005522027A/ja
Publication of JP2005522027A5 publication Critical patent/JP2005522027A5/ja
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/23—Cleaning during device manufacture during, before or after processing of insulating materials
    • H10P70/234—Cleaning during device manufacture during, before or after processing of insulating materials the processing being the formation of vias or contact holes
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/265—Carboxylic acids or salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/28—Organic compounds containing halogen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/273—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a delineation of conductive layers, e.g. by RIE
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Emergency Medicine (AREA)
  • Health & Medical Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
JP2003580947A 2002-03-25 2003-03-18 半導体基板洗浄のためのｐｈ緩衝組成物 Ceased JP2005522027A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/105,704 US6773873B2 (en) 2002-03-25 2002-03-25 pH buffered compositions useful for cleaning residue from semiconductor substrates
PCT/US2003/008408 WO2003083582A1 (en) 2002-03-25 2003-03-18 Ph buffered compositions for cleaning semiconductor substrates

Publications (2)

Publication Number Publication Date
JP2005522027A true JP2005522027A (ja) 2005-07-21
JP2005522027A5 JP2005522027A5 (https=) 2006-05-11

Family

ID=28040851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003580947A Ceased JP2005522027A (ja) 2002-03-25 2003-03-18 半導体基板洗浄のためのｐｈ緩衝組成物

Country Status (8)

Country Link
US (1) US6773873B2 (https=)
EP (1) EP1488286A4 (https=)
JP (1) JP2005522027A (https=)
KR (1) KR20040104519A (https=)
CN (1) CN1643454A (https=)
AU (1) AU2003218260A1 (https=)
TW (1) TW200306348A (https=)
WO (1) WO2003083582A1 (https=)

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JP2007298930A (ja) * 2006-04-07 2007-11-15 Kao Corp 剥離剤組成物
WO2010125664A1 (ja) * 2009-04-30 2010-11-04 アクアサイエンス株式会社 剥離液及び対象物洗浄方法
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JP2013091727A (ja) * 2011-10-26 2013-05-16 Kaneko Kagaku:Kk 合成樹脂溶解用溶剤組成物
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WO2015095726A1 (en) * 2013-12-20 2015-06-25 Entegris, Inc. Use of non-oxidizing strong acids for the removal of ion-implanted resist
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JP2018511946A (ja) * 2015-03-31 2018-04-26 バーサム マテリアルズ ユーエス，リミティド ライアビリティ カンパニー 洗浄配合
JP2019009439A (ja) * 2017-06-21 2019-01-17 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 緩衝ｃｍｐ研磨溶液
JP2019532504A (ja) * 2016-09-28 2019-11-07 ダウ グローバル テクノロジーズ エルエルシー 電子工業で使用される溶媒
JP2020527851A (ja) * 2017-07-10 2020-09-10 シンマット, インコーポレーテッドSinmat, Inc. 硬質研磨粒子を用いない硬質材料研磨
JP2020173359A (ja) * 2019-04-11 2020-10-22 東京応化工業株式会社 洗浄液、及び金属レジストを備えた支持体の洗浄方法
JPWO2021049330A1 (https=) * 2019-09-11 2021-03-18
WO2026079119A1 (ja) * 2024-10-10 2026-04-16 富士フイルム株式会社 半導体処理液、被処理物の処理方法、電子デバイスの製造方法

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