GB1347008A
(en)
|
1970-11-13 |
1974-02-13 |
Ciba Geigy Uk Ltd |
Detergent compositions
|
JPH03799A
(en)
|
1989-05-29 |
1991-01-07 |
Asahi Chem Res Lab Ltd |
Aqueous detergent composition for flux
|
US6825156B2
(en)
|
2002-06-06 |
2004-11-30 |
Ekc Technology, Inc. |
Semiconductor process residue removal composition and process
|
JP2731730B2
(en)
|
1993-12-22 |
1998-03-25 |
インターナショナル・ビジネス・マシーンズ・コーポレイション |
How to remove photoresist
|
JP2911792B2
(en)
|
1995-09-29 |
1999-06-23 |
東京応化工業株式会社 |
Stripper composition for resist
|
US20020111024A1
(en)
|
1996-07-25 |
2002-08-15 |
Small Robert J. |
Chemical mechanical polishing compositions
|
US20040134873A1
(en)
|
1996-07-25 |
2004-07-15 |
Li Yao |
Abrasive-free chemical mechanical polishing composition and polishing process containing same
|
US6265781B1
(en)
|
1996-10-19 |
2001-07-24 |
Micron Technology, Inc. |
Methods and solutions for cleaning polished aluminum-containing layers, methods for making metallization structures, and the structures resulting from these methods
|
CA2287404C
(en)
|
1997-04-30 |
2007-10-16 |
David A. Kaisaki |
Method of planarizing the upper surface of a semiconductor wafer
|
US8092707B2
(en)
|
1997-04-30 |
2012-01-10 |
3M Innovative Properties Company |
Compositions and methods for modifying a surface suited for semiconductor fabrication
|
JP3898801B2
(en)
|
1997-06-17 |
2007-03-28 |
株式会社大和化成研究所 |
Silver product discoloration film remover and removal method
|
US6284309B1
(en)
*
|
1997-12-19 |
2001-09-04 |
Atotech Deutschland Gmbh |
Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
|
US7579308B2
(en)
|
1998-07-06 |
2009-08-25 |
Ekc/Dupont Electronics Technologies |
Compositions and processes for photoresist stripping and residue removal in wafer level packaging
|
GB2341092B
(en)
|
1998-09-07 |
2000-12-06 |
Macgregor Keith Martin |
Composition for the removal of biological and organic substances
|
WO2000016782A1
(en)
|
1998-09-18 |
2000-03-30 |
The University Of British Columbia |
Pharmaceutical compositions of vanadium biguanide complexes and their use
|
JP2002528903A
(en)
|
1998-10-23 |
2002-09-03 |
アーチ・スペシャルティ・ケミカルズ・インコーポレイテッド |
Slurry system containing activator solution for chemical mechanical polishing
|
DE19849648A1
(en)
|
1998-10-29 |
2000-05-04 |
Benckiser Nv |
N'-alkyl-N-(3-aminopropyl)-glycine-based cleaning and disinfecting agents obtained more cheaply by addition of nonionic surfactant(s) at specified ratio
|
TW574634B
(en)
|
1998-11-13 |
2004-02-01 |
Kao Corp |
Stripping composition for resist
|
US6303557B1
(en)
|
1999-11-16 |
2001-10-16 |
S. C. Johnson Commercial Markets, Inc. |
Fast acting disinfectant and cleaner containing a polymeric biguanide
|
US6194366B1
(en)
|
1999-11-16 |
2001-02-27 |
Esc, Inc. |
Post chemical-mechanical planarization (CMP) cleaning composition
|
US6417147B2
(en)
|
2000-02-29 |
2002-07-09 |
Showa Denko K.K. |
Cleaning agent composition, method for cleaning and use thereof
|
US7456140B2
(en)
|
2000-07-10 |
2008-11-25 |
Ekc Technology, Inc. |
Compositions for cleaning organic and plasma etched residues for semiconductor devices
|
US6599370B2
(en)
|
2000-10-16 |
2003-07-29 |
Mallinckrodt Inc. |
Stabilized alkaline compositions for cleaning microelectronic substrates
|
US6740589B2
(en)
|
2000-11-30 |
2004-05-25 |
Showa Denko Kabushiki Kaisha |
Composition for polishing semiconductor wafer, semiconductor circuit wafer, and method for producing the same
|
US7754765B2
(en)
|
2000-12-01 |
2010-07-13 |
Radical Vision Therapeutics Inc |
Copper chelators for treating ocular inflammation
|
US6627587B2
(en)
|
2001-04-19 |
2003-09-30 |
Esc Inc. |
Cleaning compositions
|
JP4867092B2
(en)
|
2001-07-04 |
2012-02-01 |
三菱瓦斯化学株式会社 |
Resist stripper composition
|
TWI297102B
(en)
|
2001-08-03 |
2008-05-21 |
Nec Electronics Corp |
Removing composition
|
KR100438015B1
(en)
|
2001-10-10 |
2004-06-30 |
엘지.필립스 엘시디 주식회사 |
Cu-compatible Resist removing composition
|
US7543592B2
(en)
|
2001-12-04 |
2009-06-09 |
Ekc Technology, Inc. |
Compositions and processes for photoresist stripping and residue removal in wafer level packaging
|
US20030119692A1
(en)
|
2001-12-07 |
2003-06-26 |
So Joseph K. |
Copper polishing cleaning solution
|
US6717019B2
(en)
|
2002-01-30 |
2004-04-06 |
Air Products And Chemicals, Inc. |
Glycidyl ether-capped acetylenic diol ethoxylate surfactants
|
US6773873B2
(en)
|
2002-03-25 |
2004-08-10 |
Advanced Technology Materials, Inc. |
pH buffered compositions useful for cleaning residue from semiconductor substrates
|
AU2003225178A1
(en)
|
2002-04-24 |
2003-11-10 |
Ekc Technology, Inc. |
Oxalic acid as a cleaning product for aluminium, copper and dielectric surfaces
|
US8003587B2
(en)
|
2002-06-06 |
2011-08-23 |
Ekc Technology, Inc. |
Semiconductor process residue removal composition and process
|
CN1659480A
(en)
|
2002-06-07 |
2005-08-24 |
马林克罗特贝克公司 |
Cleaning compositions for microelectronic substation
|
JP2004101849A
(en)
|
2002-09-09 |
2004-04-02 |
Mitsubishi Gas Chem Co Inc |
Detergent composition
|
TWI227271B
(en)
|
2002-10-04 |
2005-02-01 |
Merck Kanto Advanced Chemical |
Post chemical mechanical polishing (CMP) cleaning solution
|
US8236485B2
(en)
|
2002-12-20 |
2012-08-07 |
Advanced Technology Materials, Inc. |
Photoresist removal
|
TWI324362B
(en)
|
2003-01-10 |
2010-05-01 |
Kanto Kagaku |
Cleaning solution for semiconductor substrate
|
US6951710B2
(en)
|
2003-05-23 |
2005-10-04 |
Air Products And Chemicals, Inc. |
Compositions suitable for removing photoresist, photoresist byproducts and etching residue, and use thereof
|
TWI315030B
(en)
|
2003-06-26 |
2009-09-21 |
Dongwoo Fine Chem Co Ltd |
Photoresist stripper composition, and exfoliation method of a photoresist using it
|
TWI362415B
(en)
|
2003-10-27 |
2012-04-21 |
Wako Pure Chem Ind Ltd |
Novel detergent and method for cleaning
|
WO2005043245A2
(en)
|
2003-10-29 |
2005-05-12 |
Mallinckrodt Baker Inc. |
Alkaline, post plasma etch/ash residue removers and photoresist stripping compositions containing metal-halide corrosion inhibitors
|
JP2005223030A
(en)
|
2004-02-04 |
2005-08-18 |
Mitsubishi Gas Chem Co Inc |
Cleaner and cleaning method for semiconductor base substance
|
KR100795364B1
(en)
|
2004-02-10 |
2008-01-17 |
삼성전자주식회사 |
Composition for cleaning a semiconductor substrate, method of cleaning and method for manufacturing a conductive structure using the same
|
KR100606187B1
(en)
|
2004-07-14 |
2006-08-01 |
테크노세미켐 주식회사 |
Composition for cleaning a semiconductor substrate, method for cleaning a semiconductor substrate and method for manufacturing a semiconductor device using the same
|
US8178482B2
(en)
|
2004-08-03 |
2012-05-15 |
Avantor Performance Materials, Inc. |
Cleaning compositions for microelectronic substrates
|
US20060073997A1
(en)
|
2004-09-30 |
2006-04-06 |
Lam Research Corporation |
Solutions for cleaning silicon semiconductors or silicon oxides
|
US20060094613A1
(en)
|
2004-10-29 |
2006-05-04 |
Lee Wai M |
Compositions and processes for photoresist stripping and residue removal in wafer level packaging
|
KR101331747B1
(en)
|
2005-01-27 |
2013-11-20 |
어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 |
Compositions for processing of semiconductor substrates
|
JP4988165B2
(en)
|
2005-03-11 |
2012-08-01 |
関東化学株式会社 |
Photoresist stripping composition and method for stripping photoresist
|
US7365045B2
(en)
|
2005-03-30 |
2008-04-29 |
Advanced Tehnology Materials, Inc. |
Aqueous cleaner with low metal etch rate comprising alkanolamine and tetraalkylammonium hydroxide
|
TW200700935A
(en)
|
2005-04-15 |
2007-01-01 |
Advanced Tech Materials |
Formulations for cleaning ion-implanted photoresist layers from microelectronic devices
|
JP2007003617A
(en)
|
2005-06-21 |
2007-01-11 |
Showa Denko Kk |
Stripper composition
|
US7700533B2
(en)
|
2005-06-23 |
2010-04-20 |
Air Products And Chemicals, Inc. |
Composition for removal of residue comprising cationic salts and methods using same
|
TWI339780B
(en)
|
2005-07-28 |
2011-04-01 |
Rohm & Haas Elect Mat |
Stripper
|
WO2007027522A2
(en)
|
2005-08-29 |
2007-03-08 |
Advanced Technology Materials, Inc. |
Composition and method for removing thick film photoresist
|
WO2007120259A2
(en)
|
2005-11-08 |
2007-10-25 |
Advanced Technology Materials, Inc. |
Formulations for removing copper-containing post-etch residue from microelectronic devices
|
JP4773562B2
(en)
|
2006-05-26 |
2011-09-14 |
エルジー・ケム・リミテッド |
Stripper composition for photoresist
|
US7947637B2
(en)
|
2006-06-30 |
2011-05-24 |
Fujifilm Electronic Materials, U.S.A., Inc. |
Cleaning formulation for removing residues on surfaces
|
US20080039356A1
(en)
*
|
2006-07-27 |
2008-02-14 |
Honeywell International Inc. |
Selective removal chemistries for semiconductor applications, methods of production and uses thereof
|
US20080139436A1
(en)
|
2006-09-18 |
2008-06-12 |
Chris Reid |
Two step cleaning process to remove resist, etch residue, and copper oxide from substrates having copper and low-K dielectric material
|
US20080076688A1
(en)
|
2006-09-21 |
2008-03-27 |
Barnes Jeffrey A |
Copper passivating post-chemical mechanical polishing cleaning composition and method of use
|
SG10201610631UA
(en)
|
2006-12-21 |
2017-02-27 |
Entegris Inc |
Liquid cleaner for the removal of post-etch residues
|
KR101341707B1
(en)
|
2007-06-28 |
2013-12-16 |
동우 화인켐 주식회사 |
Photoresist stripper composition and exfoliation method of a photoresist using the same
|
US8062429B2
(en)
|
2007-10-29 |
2011-11-22 |
Ekc Technology, Inc. |
Methods of cleaning semiconductor devices at the back end of line using amidoxime compositions
|
TW200936750A
(en)
|
2007-10-29 |
2009-09-01 |
Ekc Technology Inc |
Amidoxime compounds as chelating agents in semiconductor processes
|
US20090120457A1
(en)
|
2007-11-09 |
2009-05-14 |
Surface Chemistry Discoveries, Inc. |
Compositions and method for removing coatings and preparation of surfaces for use in metal finishing, and manufacturing of electronic and microelectronic devices
|
US8404626B2
(en)
|
2007-12-21 |
2013-03-26 |
Lam Research Corporation |
Post-deposition cleaning methods and formulations for substrates with cap layers
|
US7825079B2
(en)
|
2008-05-12 |
2010-11-02 |
Ekc Technology, Inc. |
Cleaning composition comprising a chelant and quaternary ammonium hydroxide mixture
|
JP5561914B2
(en)
|
2008-05-16 |
2014-07-30 |
関東化学株式会社 |
Semiconductor substrate cleaning liquid composition
|
CN101597548A
(en)
|
2008-06-06 |
2009-12-09 |
安集微电子科技(上海)有限公司 |
A kind of plasma etching residual washing liquid
|
WO2010048139A2
(en)
|
2008-10-21 |
2010-04-29 |
Advanced Technology Materials, Inc. |
Copper cleaning and protection formulations
|
US8361237B2
(en)
|
2008-12-17 |
2013-01-29 |
Air Products And Chemicals, Inc. |
Wet clean compositions for CoWP and porous dielectrics
|
US20120021961A1
(en)
|
2009-01-22 |
2012-01-26 |
Basf Se |
Composition for post chemical-mechanical polishing cleaning
|
KR20110127244A
(en)
|
2009-03-11 |
2011-11-24 |
후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. |
Cleaning formulation for removing residues on surfaces
|
US8518865B2
(en)
|
2009-08-31 |
2013-08-27 |
Air Products And Chemicals, Inc. |
Water-rich stripping and cleaning formulation and method for using same
|
SG178611A1
(en)
*
|
2009-09-02 |
2012-03-29 |
Wako Pure Chem Ind Ltd |
Processing agent composition for semiconductor surface and method for processing semiconductor surface using same
|
JP5857740B2
(en)
|
2009-09-03 |
2016-02-10 |
荒川化学工業株式会社 |
Lead-free solder water-soluble flux removing detergent, removing method and washing method
|
JP5646882B2
(en)
|
2009-09-30 |
2014-12-24 |
富士フイルム株式会社 |
Cleaning composition, cleaning method, and manufacturing method of semiconductor device
|
CN102770524B
(en)
|
2010-01-29 |
2015-04-22 |
高级技术材料公司 |
Cleaning agent for semiconductor provided with metal wiring
|
JP5513196B2
(en)
|
2010-03-25 |
2014-06-04 |
富士フイルム株式会社 |
Cleaning composition and method for manufacturing semiconductor device
|
JP2012021151A
(en)
|
2010-06-16 |
2012-02-02 |
Sanyo Chem Ind Ltd |
Cleaning agent for copper wiring semiconductor
|
JP5508158B2
(en)
|
2010-06-22 |
2014-05-28 |
富士フイルム株式会社 |
Cleaning composition, cleaning method, and manufacturing method of semiconductor device
|
SG187551A1
(en)
|
2010-07-16 |
2013-03-28 |
Advanced Tech Materials |
Aqueous cleaner for the removal of post-etch residues
|
JP5674373B2
(en)
|
2010-07-30 |
2015-02-25 |
富士フイルム株式会社 |
Cleaning composition, cleaning method using the same, and semiconductor device manufacturing method
|
JP2012046685A
(en)
|
2010-08-30 |
2012-03-08 |
Fujifilm Corp |
Cleaning composition, cleaning method using the composition, and method of manufacturing semiconductor device
|
CN102477359B
(en)
|
2010-11-26 |
2015-12-02 |
安集微电子(上海)有限公司 |
A kind of chemically mechanical polishing cleaning liquid
|
WO2012161790A1
(en)
|
2011-02-24 |
2012-11-29 |
John Moore |
Concentrated chemical composition and method for removing photoresist during microelectric fabrication
|
US8889609B2
(en)
|
2011-03-16 |
2014-11-18 |
Air Products And Chemicals, Inc. |
Cleaning formulations and method of using the cleaning formulations
|
JP6030637B2
(en)
|
2011-04-25 |
2016-11-24 |
エア プロダクツ アンド ケミカルズ インコーポレイテッドAir Products And Chemicals Incorporated |
Lead frame cleaning to improve wire bonding.
|
CN105869997A
(en)
|
2011-10-21 |
2016-08-17 |
安格斯公司 |
Amine-free post-CMP composition and using method thereof
|
JP2013104104A
(en)
|
2011-11-14 |
2013-05-30 |
Mec Kk |
Etching solution, replenishment solution, and method for forming copper wiring
|
US9546321B2
(en)
|
2011-12-28 |
2017-01-17 |
Advanced Technology Materials, Inc. |
Compositions and methods for selectively etching titanium nitride
|
US8916429B2
(en)
|
2012-04-30 |
2014-12-23 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Aqueous cleaning techniques and compositions for use in semiconductor device manufacturing
|
EP2847364A4
(en)
*
|
2012-05-11 |
2015-10-28 |
Entegris Inc |
Formulations for wet etching nipt during silicide fabrication
|
US9536730B2
(en)
|
2012-10-23 |
2017-01-03 |
Air Products And Chemicals, Inc. |
Cleaning formulations
|
SG11201509933QA
(en)
|
2013-06-06 |
2016-01-28 |
Advanced Tech Materials |
Compositions and methods for selectively etching titanium nitride
|
CN108485840B
(en)
|
2013-12-06 |
2020-12-29 |
富士胶片电子材料美国有限公司 |
Cleaning formulation for removing residues on surfaces
|
US10073351B2
(en)
|
2014-12-23 |
2018-09-11 |
Versum Materials Us, Llc |
Semi-aqueous photoresist or semiconductor manufacturing residue stripping and cleaning composition with improved silicon passivation
|
WO2017023677A1
(en)
*
|
2015-08-03 |
2017-02-09 |
Fujifilm Electronic Materials U.S.A., Inc. |
Cleaning composition
|
US10533146B2
(en)
|
2016-10-06 |
2020-01-14 |
Fujifilm Electronic Materials U.S.A., Inc. |
Cleaning formulations for removing residues on semiconductor substrates
|
SG11201908616PA
(en)
*
|
2017-03-24 |
2019-10-30 |
Fujifilm Electronic Materials Usa Inc |
Cleaning compositions for removing residues on semiconductor substrates
|
KR20200138742A
(en)
|
2018-03-28 |
2020-12-10 |
후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. |
Cleaning composition
|