JPH03799A - Aqueous detergent composition for flux - Google Patents
Aqueous detergent composition for fluxInfo
- Publication number
- JPH03799A JPH03799A JP13662789A JP13662789A JPH03799A JP H03799 A JPH03799 A JP H03799A JP 13662789 A JP13662789 A JP 13662789A JP 13662789 A JP13662789 A JP 13662789A JP H03799 A JPH03799 A JP H03799A
- Authority
- JP
- Japan
- Prior art keywords
- flux
- diazabicyclo
- cleaning
- compound
- diaza
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 10
- 230000004907 flux Effects 0.000 title claims description 30
- 239000003599 detergent Substances 0.000 title 1
- 150000001875 compounds Chemical class 0.000 claims abstract description 20
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 claims abstract 2
- 238000004140 cleaning Methods 0.000 claims description 22
- 239000000470 constituent Substances 0.000 abstract 1
- 239000012459 cleaning agent Substances 0.000 description 14
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- 239000007864 aqueous solution Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- -1 aliphatic amines Chemical class 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 6
- 239000004094 surface-active agent Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- BOSAWIQFTJIYIS-UHFFFAOYSA-N 1,1,1-trichloro-2,2,2-trifluoroethane Chemical compound FC(F)(F)C(Cl)(Cl)Cl BOSAWIQFTJIYIS-UHFFFAOYSA-N 0.000 description 2
- AJDIZQLSFPQPEY-UHFFFAOYSA-N 1,1,2-Trichlorotrifluoroethane Chemical compound FC(F)(Cl)C(F)(Cl)Cl AJDIZQLSFPQPEY-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- KWIUHFFTVRNATP-UHFFFAOYSA-N Betaine Natural products C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 1
- 101100074328 Caenorhabditis elegans lec-7 gene Proteins 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229960003237 betaine Drugs 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- ABDBNWQRPYOPDF-UHFFFAOYSA-N carbonofluoridic acid Chemical compound OC(F)=O ABDBNWQRPYOPDF-UHFFFAOYSA-N 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 235000020971 citrus fruits Nutrition 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Nitrogen Condensed Heterocyclic Rings (AREA)
- Detergent Compositions (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、半田付けが完了した配線基板に付着したフラ
ックスの残渣を除去するためのフラックス洗浄剤に係り
、特に地球のオゾン層破壊の原因となっているフッ素系
炭化水素化合物(以下「フロンJと略称)を用いずに該
フロンと同程度又はそれ以上の洗浄力を有する画期的な
フラックス洗浄剤に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a flux cleaning agent for removing flux residue adhering to wiring boards after soldering, which is particularly a cause of depletion of the earth's ozone layer. The present invention relates to an epoch-making flux cleaning agent that does not use a fluorine-based hydrocarbon compound (hereinafter abbreviated as ``Freon J'') and has a cleaning power comparable to or greater than that of fluorocarbons.
従来の技術
従来、フロー式の自動半田付は装置においては、予備加
熱に先立って配線基板の半田付は面にフラクサを用いて
フラックスを塗布して後、予備加熱し、その後溶融半田
に半田付は面を接触させて半田付けを行っていたが、半
田付は面には相当量のフラックス残渣が残ることになる
ため、このフラックス残渣を除去しなければならない、
フラックスには、通常ロジン系のものが用いられるが、
該ロジン系のフラックスを除去するには、従来はとんど
の場合フロン系のフラックス洗浄剤を用いていた。フラ
ックス洗浄用フロンは、トリフロロトリクロロエタン(
フロン−113)をベースにして、このちの単体又はこ
れにエタノールを共沸混合物として組み合わせたものが
主として使用されて来ているが、引火性がなく、毒性が
低く、フラックスをよく溶かすという優れた性質を有す
るものとして知られている。Conventional technology Conventionally, flow-type automatic soldering equipment uses flux to apply flux to the surface of the wiring board prior to preheating, preheating, and then soldering to molten solder. Soldering was performed with the surfaces in contact, but since soldering leaves a considerable amount of flux residue on the surfaces, this flux residue must be removed.
Rosin-based flux is usually used, but
Conventionally, a fluorocarbon-based flux cleaning agent has been used in most cases to remove the rosin-based flux. Freon for flux cleaning is trifluorotrichloroethane (
Based on Freon-113), it has been mainly used either alone or in combination with ethanol as an azeotropic mixture, but it is non-flammable, has low toxicity, and has an excellent ability to dissolve flux well. It is known as having properties.
しかし反面このフロンは、高価であると共に、地球の大
気圏の外側に位置し宇宙から地球に降り注ぐ強烈な紫外
線を吸収して穏やかな大気圏を形成するバリアとして存
在するオゾン層にまで達してこれを破壊することが最近
明らかとなり、世界的に大問題となっており、フロンの
全面的な使用の禁止が進行しつつあることは周知のとお
りである。On the other hand, CFCs are expensive, and they also reach the ozone layer, which is located outside the Earth's atmosphere and acts as a barrier to create a calm atmosphere by absorbing the intense ultraviolet rays that fall on the Earth from space, destroying it. It has recently become clear that chlorofluorocarbons are a major problem worldwide, and it is well known that a complete ban on the use of fluorocarbons is in progress.
従って、フロンに代わるフラックス洗浄剤の開発が急務
とされているが、とりあえず1−1−1− )リクロロ
エタンをベースにしてフッ素の入っていない塩素系の溶
剤を使って行こうとする提案、又は柑橘類からの抽出物
であるオイル(B i o a c LEC−7)を用
いるという提案等がなされているが、何れも洗浄力、安
全性の点でフロンを凌駕するような性能を有するものは
なく、フロンに代わり得るフラックス洗浄剤はいまのと
ころ全く提供されていない。Therefore, there is an urgent need to develop a flux cleaning agent to replace CFCs, but for the time being, 1-1-1-) A proposal to use a fluorine-free chlorine solvent based on 1-1-1-) Lichloroethane; There have also been proposals to use oil (Bioac LEC-7), which is an extract from citrus fruits, but all of these have performance that surpasses CFCs in terms of cleaning power and safety. There is no flux cleaning agent that can replace Freon at present.
目 的
本発明は、上記した従来技術の欠点を除くためになされ
たものであって、その目的とするところは、洗浄力がフ
ロンと同程度かそれ以上に優れ、しかも火災に対する安
全性にも優れてフロンにとって代わり得る画期的なフラ
ックス洗浄剤を提供することである。Purpose The present invention has been made in order to eliminate the drawbacks of the prior art described above, and its purpose is to have a cleaning power comparable to or better than that of Freon, and also to have fire safety. An object of the present invention is to provide an epoch-making flux cleaning agent that can excellently replace Freon.
構成
要するに本発明フラックス洗浄剤組成物(請求項1)は
、ジアザ−ビシクロ系化合物を含むことを特徴とするも
のである。Structure In short, the flux cleaning composition of the present invention (claim 1) is characterized in that it contains a diaza-bicyclo compound.
また本発明フラックス洗浄剤組成物(請求項2)は、1
.4−ジアザービシクロ(2,2,2)オクタン、1,
5−ジアザービシクロ(4,3゜0)ノナン−5及び1
.8−ジアザービシクロ(5,4,O)ウンデカン−7
の群より選ばれた1種又はこれらの混合物からなるジア
ザ−ビシクロ系化合物を含むことを特徴とするものであ
る。Further, the flux cleaning composition of the present invention (claim 2) comprises 1
.. 4-Diazabicyclo(2,2,2)octane, 1,
5-Diazabicyclo(4,3゜0)nonane-5 and 1
.. 8-Diazabicyclo(5,4,O)undecane-7
It is characterized by containing a diaza-bicyclo compound consisting of one type selected from the group of , or a mixture thereof.
本願発明者らは、フロンに代わり得るフラックス洗浄剤
を開発すべく、鋭意研究した結果、フラックス洗浄剤と
して強塩基性のジアザ−ビシクロ系化合物を含む水溶液
或いは水性溶液を用いることが最良であることを確認し
、本発明に至ったものである。The inventors of the present application have conducted intensive research to develop a flux cleaning agent that can replace Freon, and have found that it is best to use an aqueous solution or an aqueous solution containing a strongly basic diaza-bicyclo compound as a flux cleaning agent. This has led to the present invention.
従来から、フラックスの一成分であるロジンは無機のア
ルカリである苛性ソーダ(NaOH)や石灰水等と反応
してロジン石鹸を生成して、水に溶解することが知られ
ているが、配線基板等の洗浄にはこのような無機系アル
カリ物質は用いられていなかった。その理由は、無機の
アルカリが配線基板の表面や電子部品の表面に残留する
と、配線基板の信頼性が低下するおそれがあるためと考
えられる。It has been known that rosin, a component of flux, reacts with inorganic alkalis such as caustic soda (NaOH) and lime water to produce rosin soap, which dissolves in water. Such inorganic alkaline substances were not used for cleaning. The reason for this is thought to be that if inorganic alkali remains on the surface of the wiring board or the surface of the electronic component, the reliability of the wiring board may deteriorate.
そこで本願発明者らは信頼性の問題が発生すると考えら
れる無機のアルカリを避けて、有機のアルカリのうちで
フラックスの洗浄剤として使用できるものを探究した。Therefore, the inventors of the present application searched for organic alkalis that can be used as flux cleaning agents, avoiding inorganic alkalis that are thought to cause reliability problems.
その結果、有機アルカリの中でもロジン系フラックス残
渣の除去効果は、強塩基性のジアザ−ビシクロ系化合物
が優れており、脂肪族アミン等は効果がないことを見出
し、本発明を完成させるに至った。As a result, it was discovered that among organic alkalis, strong basic diaza-bicyclo compounds are effective in removing rosin-based flux residues, while aliphatic amines and the like are ineffective, leading to the completion of the present invention. .
強塩基性のジアザ−ビシクロ系化合物としては、1.4
−ジアザービシクロ(2,2,2)オクタン、1.5−
ジアザービシクロ(4,3,0)ノナン−5,1,8−
ジアザービシクロ(5,4,0)ウンデカン−7の3種
が市販されており、何れも本発明に使用することが可能
である。As a strong basic diaza-bicyclo compound, 1.4
-Diazerbicyclo(2,2,2)octane, 1.5-
Diazarbicyclo(4,3,0)nonane-5,1,8-
Three types of diazerbicyclo(5,4,0)undecane-7 are commercially available, and any of them can be used in the present invention.
これらのジアザ−ビシクロ系化合物は、水又は水と可溶
性低級アルコールとの混合物中に0.5乃至10%の範
囲で溶解してフラックス洗浄剤として使用される。These diaza-bicyclo compounds are used as flux cleaning agents by being dissolved in water or a mixture of water and a soluble lower alcohol in a range of 0.5 to 10%.
ここでジアザ−ビシクロ系化合物の濃度の下限(0,5
%)は、これより低濃度であると、洗浄濃度を上げても
実用洗浄時間(10分程度)以内で十分な洗浄効果が得
られないことによる。また上限(10%)は、これらの
化合物の価格が高いので、余り濃くすると、経済的でな
いこと及び洗浄力が飽和して来ることから決められる。Here, the lower limit of the concentration of the diaza-bicyclo compound (0,5
%) is because if the concentration is lower than this, a sufficient cleaning effect cannot be obtained within the practical cleaning time (about 10 minutes) even if the cleaning concentration is increased. The upper limit (10%) was determined because these compounds are expensive, and if the concentration is too high, it would be uneconomical and the detergency would become saturated.
水溶性低級アルコールとしては、メタノール、エタノー
ル、プロパツール等が好ましく、これと水との混合比は
、任意であるが、アルコール分が多くなると引火性の問
題が生ずるので、注意を要する。As the water-soluble lower alcohol, methanol, ethanol, propatool, etc. are preferable, and the mixing ratio of this and water is arbitrary, but care must be taken because if the alcohol content increases, flammability problems will occur.
なお、ジアザ−ビシクロ系化合物を含む水性フラックス
洗浄剤の表面張力を低下させて濡れ性を向上させるため
に、界面活性剤を配合することも可能である。Incidentally, in order to lower the surface tension and improve the wettability of the aqueous flux cleaning agent containing the diaza-bicyclo compound, it is also possible to blend a surfactant.
この界面活性剤は、ジアザ−ビシクロ系化合物の水性溶
液に添加して、耐アルカリ性があること、表面張力を低
下させること、02つの要件を満たすものでなければな
らない。そこで本発明では、例えば以下のものを用いる
。This surfactant, when added to an aqueous solution of a diaza-bicyclo compound, must meet two requirements: alkali resistance and a reduction in surface tension. Therefore, in the present invention, for example, the following is used.
パーフルオロアルキルスルフォンMLパーフルオロカル
ボン酸塩、パーフルオロアルキルリン酸塩、パーフルオ
ロアルキルポリオキシエチレンエタノール、フッ素化ア
ルキルエステル、パーフルオロアルキルベタイン等の含
フッ素系界面活性剤、
或いは、
(CH,CH20)L H
[R−N−(CH,CH,O) 。 Hコ 0 ・
OH(cHz CHz o) lI Hで示され
るアルキルトリオキシエチレンアンモニウムハイドロオ
キサイド等。Fluorine-containing surfactants such as perfluoroalkyl sulfone ML perfluorocarboxylate, perfluoroalkyl phosphate, perfluoroalkyl polyoxyethylene ethanol, fluorinated alkyl ester, perfluoroalkyl betaine, or (CH, CH20 ) L H [R-N-(CH,CH,O). H co 0 ・
Alkyltrioxyethylene ammonium hydroxide, etc., represented by OH (cHz CHz o) lI H.
このフラックス洗浄剤によれば、界面活性剤の作用によ
り、従来使用されて来たメタノール、イソプロピルアル
コール(IPA)又はトリフルオロトリクロロエタン(
フロン−113)等の洗浄液と同程度の表面張力となり
、極めて優れた洗浄力を発揮することが判明した。そし
てジアザ−ビシクロ系化合物を含む水性溶液に界面活性
剤を添加することによって、被洗浄物と洗浄液の濡れ性
が向上し、洗浄液が狭い隙間に浸入して行く能力が向上
することが判明した。According to this flux cleaning agent, due to the action of surfactants, conventionally used methanol, isopropyl alcohol (IPA) or trifluorotrichloroethane (
It was found that the surface tension was comparable to that of cleaning liquids such as Freon-113), and that it exhibited extremely excellent cleaning power. It has also been found that by adding a surfactant to an aqueous solution containing a diaza-bicyclo compound, the wettability between the object to be cleaned and the cleaning liquid is improved, and the ability of the cleaning liquid to penetrate into narrow gaps is improved.
効果
本発明は、上記のように洗浄力がフロンと同程度又はそ
れ以上に優れ、しかも火災に対する安全性にも優れてフ
ロンにとって代わり得る画期的なフラックス洗浄剤を提
供し得る効果がある。Effects As described above, the present invention has the effect of providing an innovative flux cleaning agent that has a cleaning power as good as or better than that of Freon, has excellent fire safety, and can replace Freon.
実施例1
プリント配線基板に市販のロジン系フラックス(スピー
デイフラックス AGF−200−J 3、■アサヒ化
学研究所製品)を塗布し、予備加熱の後、260°Cで
5秒間半田付けを行った。これを第1表に示す各種の洗
浄液に各々1分間浸漬した後、水洗、乾燥して、目視に
よりフランクス残渣の洗浄性を評価した。Example 1 A commercially available rosin flux (Speedy Flux AGF-200-J 3, manufactured by Asahi Chemical Research Institute) was applied to a printed wiring board, and after preheating, soldering was performed at 260°C for 5 seconds. This was immersed for 1 minute in each of the various cleaning solutions shown in Table 1, washed with water, dried, and visually evaluated for cleaning properties of Franks residue.
目視による洗浄率は、最良の100%(◎)、良好の9
5〜99%(O)、効果ありの90〜94%(Δ)、不
良の50〜89%(×)及び最悪の50%以下(××)
の各ランクで判定し、その結果を比較例と共に第1表に
示す。The cleaning rate by visual inspection is 100% (◎), which is the best, and 9, which is good.
5-99% (O), effective 90-94% (Δ), defective 50-89% (×), and worst 50% or less (XX)
The results are shown in Table 1 along with comparative examples.
なお第1表中、各化合物は以下の通りである。In Table 1, each compound is as follows.
化合物(1):l、8−ジアザービシクロ(5゜4.0
)ウンデカン−7
化合物(II): 1,5−ジアザービシクロ(4゜3
.0)ノナン−5
化合物(III) 71. 4−ジアザービシクロ(
2゜2.2)オクタン
実施例2
1、 8−ジアザービシクロ(5,4,O)ウンデカン
−7の2gを、以下の水性溶液98g中に溶解してフラ
ックス洗浄剤とした。Compound (1): l,8-diazabicyclo (5°4.0
) undecane-7 Compound (II): 1,5-diazabicyclo(4゜3
.. 0) Nonane-5 Compound (III) 71. 4-Diazerbicyclo(
2゜2.2) Octane Example 2 2 g of 1,8-diazabicyclo(5,4,O)undecane-7 was dissolved in 98 g of the following aqueous solution to prepare a flux cleaning agent.
(1)水
(2)水/メタノール−70/30
(3)フッソ系界面活性剤(サーフロンS−121、パ
ーフルオロアルキル第4級アンモニウム塩、旭硝子製品
)(30%水溶液)03%を含む水溶液
これらを用いて、実施例1と同様の洗浄テストを行った
(但し、洗浄液温度 20℃、時間1分)したところ、
何れも洗浄率は最良の100%であった。(1) Water (2) Water/methanol - 70/30 (3) Fluorosurfactant (Surflon S-121, perfluoroalkyl quaternary ammonium salt, Asahi Glass product) (30% aqueous solution) Aqueous solution containing 0.3% Using these, a cleaning test similar to that in Example 1 was conducted (however, the cleaning liquid temperature was 20°C and the time was 1 minute).
In both cases, the cleaning rate was the best, 100%.
Claims (1)
水性フラックス洗浄剤組成物。 2 1,4−ジアザービシクロ(2,2,2)オクタン
、1,5−ジアザービシクロ(4,3,0)ノナン−5
及び1.8−ジアザービシクロ(5,4,0)ウンデカ
ン−7の群より選ばれた1種又はこれらの混合物からな
るジアザービシクロ系化合物を含むことを特徴とする水
性フラックス洗浄剤組成物。[Scope of Claims] 1. An aqueous flux cleaning composition characterized by containing a diazabicyclo compound. 2 1,4-diazabicyclo(2,2,2)octane, 1,5-diazabicyclo(4,3,0)nonane-5
and 1.8-diazabicyclo(5,4,0)undecane-7, or a mixture thereof. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13662789A JPH03799A (en) | 1989-05-29 | 1989-05-29 | Aqueous detergent composition for flux |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13662789A JPH03799A (en) | 1989-05-29 | 1989-05-29 | Aqueous detergent composition for flux |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03799A true JPH03799A (en) | 1991-01-07 |
Family
ID=15179728
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13662789A Pending JPH03799A (en) | 1989-05-29 | 1989-05-29 | Aqueous detergent composition for flux |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03799A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2710071A1 (en) * | 1993-09-16 | 1995-03-24 | Aix Marseille Iii Universite | Formulation and device which make it possible to prolong and improve the efficiency of degreasing solvents |
WO2006025373A1 (en) * | 2004-08-31 | 2006-03-09 | Sanyo Chemical Industries, Ltd. | Surfactant |
JP2014218459A (en) * | 2013-05-08 | 2014-11-20 | 信越化学工業株式会社 | Quaternary ammonium hydroxide compound and method of producing the same, wafer cleaning composition and wafer cleaning method |
JP2019116634A (en) * | 2013-12-06 | 2019-07-18 | フジフイルム エレクトロニック マテリアルズ ユー.エス.エー., インコーポレイテッド | Preparation for cleaning to remove residue on surface |
US11407966B2 (en) | 2018-03-28 | 2022-08-09 | Fujifilm Electronic Materials U.S.A., Inc. | Cleaning compositions |
-
1989
- 1989-05-29 JP JP13662789A patent/JPH03799A/en active Pending
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2710071A1 (en) * | 1993-09-16 | 1995-03-24 | Aix Marseille Iii Universite | Formulation and device which make it possible to prolong and improve the efficiency of degreasing solvents |
WO2006025373A1 (en) * | 2004-08-31 | 2006-03-09 | Sanyo Chemical Industries, Ltd. | Surfactant |
US7704939B2 (en) | 2004-08-31 | 2010-04-27 | Sanyo Chemical Industries, Ltd. | Surfactant |
TWI384065B (en) * | 2004-08-31 | 2013-02-01 | Sanyo Chemical Ind Ltd | Interfacial active agent |
JP2014218459A (en) * | 2013-05-08 | 2014-11-20 | 信越化学工業株式会社 | Quaternary ammonium hydroxide compound and method of producing the same, wafer cleaning composition and wafer cleaning method |
US10696933B2 (en) | 2013-12-06 | 2020-06-30 | Fujifilm Electronic Materials U.S.A., Inc. | Cleaning formulation for removing residues on surfaces |
JP2019116634A (en) * | 2013-12-06 | 2019-07-18 | フジフイルム エレクトロニック マテリアルズ ユー.エス.エー., インコーポレイテッド | Preparation for cleaning to remove residue on surface |
US10927329B2 (en) | 2013-12-06 | 2021-02-23 | Fujifilm Electronic Materials U.S.A., Inc. | Cleaning formulation for removing residues on surfaces |
US11286444B2 (en) | 2013-12-06 | 2022-03-29 | Fujifilm Electronic Materials U.S.A., Inc. | Cleaning formulation for removing residues on surfaces |
US11401487B2 (en) | 2013-12-06 | 2022-08-02 | Fujifilm Electronics Materials U.S.A., Inc. | Cleaning formulation for removing residues on surfaces |
US11618867B2 (en) | 2013-12-06 | 2023-04-04 | Fujifilm Electronic Materials U.S.A., Inc. | Cleaning formulation for removing residues on surfaces |
US11639487B2 (en) | 2013-12-06 | 2023-05-02 | Fujifilm Electronic Materials U.S.A., Inc. | Cleaning formulation for removing residues on surfaces |
US11407966B2 (en) | 2018-03-28 | 2022-08-09 | Fujifilm Electronic Materials U.S.A., Inc. | Cleaning compositions |
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