JPWO2021049330A1 - - Google Patents

Info

Publication number
JPWO2021049330A1
JPWO2021049330A1 JP2021545217A JP2021545217A JPWO2021049330A1 JP WO2021049330 A1 JPWO2021049330 A1 JP WO2021049330A1 JP 2021545217 A JP2021545217 A JP 2021545217A JP 2021545217 A JP2021545217 A JP 2021545217A JP WO2021049330 A1 JPWO2021049330 A1 JP WO2021049330A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021545217A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021049330A1 publication Critical patent/JPWO2021049330A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D17/00—Detergent materials or soaps characterised by their shape or physical properties
    • C11D17/08—Liquid soap, e.g. for dispensers; capsuled
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/34—Organic compounds containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/36—Organic compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/04—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors
    • C23G1/06—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
JP2021545217A 2019-09-11 2020-08-28 Pending JPWO2021049330A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019165317 2019-09-11
PCT/JP2020/032679 WO2021049330A1 (ja) 2019-09-11 2020-08-28 処理液、処理方法

Publications (1)

Publication Number Publication Date
JPWO2021049330A1 true JPWO2021049330A1 (https=) 2021-03-18

Family

ID=74867237

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021545217A Pending JPWO2021049330A1 (https=) 2019-09-11 2020-08-28

Country Status (3)

Country Link
JP (1) JPWO2021049330A1 (https=)
TW (1) TWI896555B (https=)
WO (1) WO2021049330A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025204631A1 (ja) * 2024-03-27 2025-10-02 富士フイルム株式会社 薬液、半導体デバイスの製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002523546A (ja) * 1998-08-18 2002-07-30 アーチ・スペシャルティ・ケミカルズ・インコーポレイテッド 非腐食性のストリッピングおよびクリーニング組成物
JP2005522027A (ja) * 2002-03-25 2005-07-21 アドバンスド．テクノロジー．マテリアルス．インコーポレイテッド 半導体基板洗浄のためのｐｈ緩衝組成物
JP2012084917A (ja) * 2008-10-28 2012-04-26 Avantor Performance Materials Inc 多金属デバイス処理のためのグルコン酸含有フォトレジスト洗浄組成物
JP2013157516A (ja) * 2012-01-31 2013-08-15 Advanced Technology Materials Inc 銅配線半導体用洗浄剤
JP2015122496A (ja) * 2013-12-20 2015-07-02 エア プロダクツ アンド ケミカルズ インコーポレイテッドＡｉｒ Ｐｒｏｄｕｃｔｓ Ａｎｄ Ｃｈｅｍｉｃａｌｓ Ｉｎｃｏｒｐｏｒａｔｅｄ 窒化チタンハードマスク用組成物及びエッチング残渣の除去
WO2017208749A1 (ja) * 2016-06-02 2017-12-07 富士フイルム株式会社 処理液、基板の洗浄方法及びレジストの除去方法
WO2018061670A1 (ja) * 2016-09-29 2018-04-05 富士フイルム株式会社 処理液、および積層体の処理方法
WO2018061582A1 (ja) * 2016-09-29 2018-04-05 富士フイルム株式会社 処理液および積層体の処理方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6139975B2 (ja) * 2013-05-15 2017-05-31 株式会社フジミインコーポレーテッド 研磨用組成物
US11127587B2 (en) * 2014-02-05 2021-09-21 Entegris, Inc. Non-amine post-CMP compositions and method of use
US9957469B2 (en) * 2014-07-14 2018-05-01 Versum Materials Us, Llc Copper corrosion inhibition system

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002523546A (ja) * 1998-08-18 2002-07-30 アーチ・スペシャルティ・ケミカルズ・インコーポレイテッド 非腐食性のストリッピングおよびクリーニング組成物
JP2005522027A (ja) * 2002-03-25 2005-07-21 アドバンスド．テクノロジー．マテリアルス．インコーポレイテッド 半導体基板洗浄のためのｐｈ緩衝組成物
JP2012084917A (ja) * 2008-10-28 2012-04-26 Avantor Performance Materials Inc 多金属デバイス処理のためのグルコン酸含有フォトレジスト洗浄組成物
JP2013157516A (ja) * 2012-01-31 2013-08-15 Advanced Technology Materials Inc 銅配線半導体用洗浄剤
JP2015122496A (ja) * 2013-12-20 2015-07-02 エア プロダクツ アンド ケミカルズ インコーポレイテッドＡｉｒ Ｐｒｏｄｕｃｔｓ Ａｎｄ Ｃｈｅｍｉｃａｌｓ Ｉｎｃｏｒｐｏｒａｔｅｄ 窒化チタンハードマスク用組成物及びエッチング残渣の除去
WO2017208749A1 (ja) * 2016-06-02 2017-12-07 富士フイルム株式会社 処理液、基板の洗浄方法及びレジストの除去方法
WO2018061670A1 (ja) * 2016-09-29 2018-04-05 富士フイルム株式会社 処理液、および積層体の処理方法
WO2018061582A1 (ja) * 2016-09-29 2018-04-05 富士フイルム株式会社 処理液および積層体の処理方法

Also Published As

Publication number Publication date
WO2021049330A1 (ja) 2021-03-18
TWI896555B (zh) 2025-09-11
TW202111104A (zh) 2021-03-16

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