JP2005302747A - 半導体発光素子 - Google Patents
半導体発光素子 Download PDFInfo
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- JP2005302747A JP2005302747A JP2004095217A JP2004095217A JP2005302747A JP 2005302747 A JP2005302747 A JP 2005302747A JP 2004095217 A JP2004095217 A JP 2004095217A JP 2004095217 A JP2004095217 A JP 2004095217A JP 2005302747 A JP2005302747 A JP 2005302747A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 95
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 16
- 150000004767 nitrides Chemical class 0.000 claims abstract description 15
- 229910052709 silver Inorganic materials 0.000 claims abstract description 15
- 239000004332 silver Substances 0.000 claims abstract description 13
- 239000000956 alloy Substances 0.000 claims abstract description 5
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 5
- 239000010936 titanium Substances 0.000 claims description 15
- 230000001681 protective effect Effects 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 11
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 238000007667 floating Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- 229910052703 rhodium Inorganic materials 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims description 4
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 4
- 239000002861 polymer material Substances 0.000 claims description 4
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910000449 hafnium oxide Inorganic materials 0.000 claims 2
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims 2
- 229910001936 tantalum oxide Inorganic materials 0.000 claims 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims 2
- 238000013508 migration Methods 0.000 abstract description 18
- 230000005012 migration Effects 0.000 abstract description 18
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 10
- 239000010408 film Substances 0.000 description 163
- 239000010410 layer Substances 0.000 description 145
- 239000000758 substrate Substances 0.000 description 46
- 239000012790 adhesive layer Substances 0.000 description 25
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 18
- 239000010931 gold Substances 0.000 description 17
- 238000005253 cladding Methods 0.000 description 12
- 239000010948 rhodium Substances 0.000 description 12
- 238000004088 simulation Methods 0.000 description 11
- 238000011156 evaluation Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 229910052594 sapphire Inorganic materials 0.000 description 9
- 239000010980 sapphire Substances 0.000 description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000005566 electron beam evaporation Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 238000002310 reflectometry Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Substances [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 229910002704 AlGaN Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000006911 nucleation Effects 0.000 description 2
- 238000010899 nucleation Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 229910001923 silver oxide Inorganic materials 0.000 description 2
- UKHWJBVVWVYFEY-UHFFFAOYSA-M silver;hydroxide Chemical compound [OH-].[Ag+] UKHWJBVVWVYFEY-UHFFFAOYSA-M 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- GEIAQOFPUVMAGM-UHFFFAOYSA-N Oxozirconium Chemical compound [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009791 electrochemical migration reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- -1 nitride compound Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
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- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
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Abstract
【解決手段】発光積層構造が、n型の窒化物半導体からなる第1の層、及び第1の層の上に配置されたp型の窒化物半導体からなる第2の層を含み、第1の層と第2の層との間に発光領域を画定する。第1の層の表面の一部の第1の領域において、第2の層が除去されて第1の層が現われている。第2の層の表面上に、第2の層に電気的に接続されたp側電極が配置されている。絶縁膜がp側電極を覆う。第1の領域に、第1の層に電気的に接続されたn側電極が配置されている。反射膜が、絶縁膜の上からn側電極まで至り、n側電極に電気的に接続されている。反射膜は、銀を含む合金または銀で形成されている。
【選択図】図1(A)
Description
に関する。
最下層のTi層またはNi層の厚さは、例えば0.3〜1nmとする。その上のRh層、Pt層、Au層の各々の厚さは100nmとする。また、繰り返し回数nは1〜5とする。このような多層構造とすることにより、p側パッド電極20に反射膜としての機能を持たせ、光の取り出し効率を高めることができる。
2 初期核形成層
3 n型コンタクト層
4 n型クラッド層
5 発光層
6 p型クラッド層
7 p型コンタクト層
10 p側オーミック電極
10a、16a 接着層
11 n側オーミック電極
15 絶縁膜
16 反射膜
16a 反射パターン
17 保護膜
20 p側パッド電極
21 n側パッド電極
25 第1の領域
28、50 半導体発光素子
30 フレーム
31、41 陰極リード
32、42 陽極リード
35、36、46、47 金線
37 蛍光体
38、48 封止樹脂
40 ステム
43 サブマウント基板
44 陽極配線
45 陰極配線
Claims (17)
- n型の窒化物半導体からなる第1の層、及び該第1の層の上に配置されたp型の窒化物半導体からなる第2の層を含み、該第1の層と第2の層との間に発光領域を画定し、該第1の層の表面の一部の第1の領域において、該第2の層が除去されて該第1の層が現われている発光積層構造と、
前記第2の層の表面上に配置され、該第2の層に電気的に接続されたp側電極と、
前記p側電極を覆う絶縁膜と、
前記第1の領域において、前記第1の層に電気的に接続されたn側電極と、
前記絶縁膜の上に配置され、前記n側電極まで至り、該n側電極に電気的に接続され、銀を含む合金または銀で形成された反射膜と
を有する半導体発光素子。 - 前記p側電極が、前記発光領域の発光波長の光を透過させる請求項1に記載の半導体発光素子。
- 前記p側電極が、Pt、Rh及びPdからなる群より選択された1つの金属で形成されており、その厚さが1nm〜15nmである請求項1または2に記載の半導体発光素子。
- n型の窒化物半導体からなる第1の層、及び該第1の層の上に配置されたp型の窒化物半導体からなる第2の層を含み、該第1の層と第2の層との間に発光領域を画定し、該第1の層の表面の一部の第1の領域において、該第2の層が除去されて該第1の層が現われている発光積層構造と、
前記第2の層の表面上に配置され、該第2の層に電気的に接続され、前記発光領域で発生した光を透過させるp側電極と、
前記p側電極を覆う絶縁膜と、
前記第1の領域において、前記第1の層に電気的に接続されたn側電極と、
前記絶縁膜の上に配置され、前記n側電極まで至り、該n側電極に電気的に接続され、前記発光領域で発生した光を反射する反射膜と
を有する半導体発光素子。 - n型の窒化物半導体からなる第1の層、及び該第1の層の上に配置されたp型の窒化物半導体からなる第2の層を含み、該第1の層と第2の層との間に発光領域を画定し、該第1の層の表面の一部の第1の領域において、該第2の層が除去されて該第1の層が現われている発光積層構造と、
前記第2の層の表面上に配置され、該第2の層に電気的に接続されたp側電極と、
前記p側電極を覆う絶縁膜と、
前記第1の領域において、前記第1の層に電気的に接続されたn側電極と、
前記絶縁膜の上に配置され、銀を含む合金または銀で形成され、前記p側電極及びn側電極のいずれにも接続されておらず電気的にフローティング状態にされた反射膜と
を有する半導体発光素子。 - 前記p側電極が、前記発光領域の発光波長の光を透過させる請求項5に記載の半導体発光素子。
- 前記p側電極が、Pt、Rh及びPdからなる群より選択された1つの金属で形成されており、その厚さが1nm〜15nmである請求項5または6に記載の半導体発光素子。
- n型の窒化物半導体からなる第1の層、及び該第1の層の上に配置されたp型の窒化物半導体からなる第2の層を含み、該第1の層と第2の層との間に発光領域を画定し、該第1の層の表面の一部の第1の領域において、該第2の層が除去されて該第1の層が現われている発光積層構造と、
前記第2の層の表面上に配置され、該第2の層に電気的に接続され、前記発光領域で発生した光を透過させるp側電極と、
前記p側電極を覆う絶縁膜と、
前記第1の領域において、前記第1の層に電気的に接続されたn側電極と、
前記絶縁膜の上に配置され、前記p側電極及びn側電極のいずれにも接続されておらず電気的にフローティング状態にされ、前記発光領域で発生した光を反射する反射膜と
を有する半導体発光素子。 - さらに、前記p側電極と前記絶縁膜との間に、Ti、Ni、W、及びMoからなる群より選択された少なくとも1つの金属からなる中間層が配置されている請求項1〜8のいずれかに記載の半導体発光素子。
- 前記絶縁膜が、前記発光領域の発光波長の光を透過させる請求項1〜9のいずれかに記載の半導体発光素子。
- 前記絶縁膜が、酸化シリコン、酸化チタン、酸化タンタル、アルミナ、酸化ジルコニウム、酸化ハフニウム、及び絶縁性高分子材料からなる群より選択された少なくとも1つの材料で形成されている請求項1〜9のいずれかに記載の半導体発光素子。
- さらに、前記反射膜を覆う絶縁性の保護膜を有する請求項1〜11のいずれかに記載の半導体発光素子。
- 前記保護膜が、酸化シリコン、酸化チタン、酸化タンタル、アルミナ、酸化ジルコニウム、酸化ハフニウム、及び絶縁性高分子材料からなる群より選択された少なくとも1つの材料で形成されている請求項12に記載の半導体発光素子。
- さらに、前記反射膜と前記保護膜との間に、Ti、Ni、Al、W、及びMoからなる群より選択された少なくとも1つの金属からなる中間層が配置されている請求項12または13に記載の半導体発光素子。
- さらに、前記p側電極の表面の一部の領域上に配置されたフリップチップボンディング用のp側パッドと、
前記n側電極の表面の一部の領域上に配置されたフリップチップボンディング用のn側パッドと
を有する請求項1〜14のいずれかに記載の半導体発光素子。 - さらに、前記p側電極の表面の一部の領域上に配置されたフリップチップボンディング用のp側パッドと、
前記反射膜のうち、前記第2の層と重なる部分の表面上に配置されたフリップチップボンディング用のn側パッドと
を有する請求項1〜14のいずれかに記載の半導体発光素子。 - 前記反射膜が、前記発光領域で発光し該反射膜に向かって進行する光を散乱させるような平面形状を有し、
さらに、前記反射膜で散乱された光が入射することにより蛍光を発生する蛍光体を有する請求項1〜14のいずれかに記載の半導体発光素子。
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Also Published As
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TWI262610B (en) | 2006-09-21 |
US7141825B2 (en) | 2006-11-28 |
JP4330476B2 (ja) | 2009-09-16 |
EP1583159A3 (en) | 2008-11-05 |
EP1583159A2 (en) | 2005-10-05 |
TW200535960A (en) | 2005-11-01 |
US20050211989A1 (en) | 2005-09-29 |
EP1583159B1 (en) | 2019-01-30 |
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