JP2005043874A - フォトレジスト剥離液組成物及びそれを用いたフォトレジストの剥離方法 - Google Patents
フォトレジスト剥離液組成物及びそれを用いたフォトレジストの剥離方法 Download PDFInfo
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- JP2005043874A JP2005043874A JP2004188301A JP2004188301A JP2005043874A JP 2005043874 A JP2005043874 A JP 2005043874A JP 2004188301 A JP2004188301 A JP 2004188301A JP 2004188301 A JP2004188301 A JP 2004188301A JP 2005043874 A JP2005043874 A JP 2005043874A
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Abstract
【解決手段】脱イオン水、有機アミン化合物、グリコールエーテル化合物、水溶性有機溶剤、及び、腐食防止剤からなるフォトレジスト剥離液組成物。
【選択図】図4
Description
組成物の総量に対し、5〜50重量%の有機アミン化合物、10〜50重量%のグリコールエーテル化合物、0〜30重量%の水溶性有機溶媒、0.1〜10重量%の腐食防止剤及び残量の脱イオン水を含むフォトレジスト剥離液組成物を提供する。
[化1]
R1 3N 化学式1
(式中、それぞれのR1は、相互独立して水素原子、直鎖もしくは分枝鎖C1-10アルキル又はヒドロキシアルキル基、直鎖もしくは分枝鎖C2-10アルケニル又はヒドロキシアルケニル基、又はC5-8シクロアルキル又はヒドロキシシクロアルキル基を表し、3つのR1のうちの一つは、ヒドロキシアルキル、ヒドロキシアルケニル又はヒドロキシシクロアルキル基を表す。)
[化2]
R2−O−[(CHR3)m−(CH2)n]t−OH 化学式2
(式中、R2は、直鎖もしくは分枝鎖C1-10アルキル基、例えば、メチル、エチル、プロピル、イソプロピル、ブチル、イソブチル、ペンチル、ヘキシル、ヘプチル、オクチル基を表し、R3は、水素原子、又は直鎖もしくは分枝鎖C1-6アルキル基を表し、m及びnは、それぞれ0乃至3の整数であり、但し、m+nは、2又は3であり、tは、1乃至5の整数である。)
また、本発明の他の技術的課題は、組成物の総量に対し、5〜50重量%の上記化学式1の有機アミン化合物、10〜50重量%の上記化学式2のグリコールエーテル化合物、0〜30重量%の水溶性有機溶媒、0.1〜10重量%の腐食防止剤及び残量の脱イオン水を含む剥離液組成物を用いる剥離方法により達成される。
CH3CH2CH2CH2-OCH2CH2-OH ;
CH3CH2CH2CH2-OCH2CH2-OCH2CH2-OH ;
CH3CH2CH2CH2-OCH2CH2-OCH2CH2-OCH2CH2-OH ;
CH3CH2CH2CH2-OCH2CH2-OCH2CH2-OCH2CH2-OCH2CH2-OH ;
CH3-OCH2CH2-OH ;
CH3-OCH2CH2-OCH2CH2-OH ;
CH3-OCH2CH2-OCH2CH2-OCH2CH2-OH ;
CH3-OCH2CH2-OCH2CH2-OCH2CH2-OCH2CH2-OH ;
CH3-OCH2CH2CH2-OH ;
CH3-OCH2CH2CH2-OCH2CH2CH2-OH ;
CH3-OCH2CH2CH2-OCH2CH2CH2-OCH2CH2CH2-OH ;
CH3-OCH2CH2CH2-OCH2CH2CH2-OCH2CH2CH2-OCH2CH2CH2-OH ;
特に好ましい化学式2の化合物は、エチレングリコールモノブチルエーテル、ジエチレングリコールモノブチルエーテル、トリエチレングリコールモノブチルエーテル又はこれらの混合物である。
[化3]
R4CO2H 化学式3
(式中、R4は、水素原子、カルボキシル基、直鎖もしくは分枝鎖C1-10アルキル、直鎖もしくは分枝鎖C2-10アルケニル、C5-8シクロアルキル基又はC6-10アリル基を表し、これらは、ハロゲン、ヒドロキシル基、カルボキシル基、及びスルホン基より構成された群から選ばれる置換基で置換されていてもよい。)
本発明における腐食防止剤として用いられる化学式3の有機酸化合物は、金属腐食の原因となる水酸基の発生を制御するだけでなく、ポリマー中の金属物質とキレート反応を起こして除去することにより、これらが再吸着することを防止する。従って、適当量の化学式3の化合物を添加することにより、金属層を腐食等から保護することができるだけでなく、残留物の中の金属イオン汚染物質等を効果的に除去することができる。
◎:良好
△:普通
×:不良
[腐食防止能力]
◎:良好
△:普通
×:不良
MEA:モノエタノールアミン
MIPA:イソプロパノールアミン
NMP:N−メチル−2−ピロリドン
DMSO:ジメチルスルホキシド
THFA:テトラヒドロフルフリルアルコール
BDG:ジエチレングリコールモノブチルエーテル
EGB:エチレングリコールモノブチルエーテル
TEGB:トリエチレングリコールモノブチルエーテル
EG:エチレングリコール
PG:プロピレングリコール
TEG:トリエチレングリコール
BTA: ベンゾトリアゾール
20 金属又は酸化膜層
30 フォトレジスト層
Claims (11)
- 組成物の総量に対し、5〜50重量%の有機アミン化合物、10〜50重量%のグリコールエーテル化合物、0〜30重量%の水溶性有機溶媒、0.1〜10重量%の腐食防止剤及び残量の脱イオン水を含むフォトレジスト剥離液組成物。
- 前記有機アミン化合物が、モノエタノールアミン、ジエタノールアミン、トリエタノールアミン、プロパノールアミン、ジプロパノールアミン、トリプロパノールアミン、イソプロパノールアミン、ジイソプロパノールアミン、トリイソプロパノールアミン、ブタノールアミン、ブチルモノエタノールアミン、N−メチルエタノールアミン、エチルジエタノールアミン又はこれらの混合物であることを特徴とする請求項1に記載のフォトレジスト剥離液組成物。
- 前記有機アミン化合物が、モノエタノールアミン、N−メチルエタノールアミン、イソプロパノールアミン又はこれらの混合物であることを特徴とする請求項2に記載のフォトレジスト剥離液組成物。
- 前記グリコールエーテル化合物が、エチレングリコールモノブチルエーテル、ジエチレングリコールモノブチルエーテル、トリエチレングリコールモノブチルエーテル又はこれらの混合物であることを特徴とする請求項1に記載のフォトレジスト剥離液組成物。
- 前記水溶性有機溶媒が、テトラヒドロフルフリルアルコール、N−メチル−2−ピロリドン、ジメチルスルホキシド又はこれらの混合物であることを特徴とする請求項1に記載のフォトレジスト剥離液組成物。
- 前記腐食防止剤が、直鎖多価アルコール、芳香族ヒドロキシ化合物又はこれらの混合物であることを特徴とする請求項1に記載のフォトレジスト剥離液組成物。
- 前記直鎖多価アルコールが、ソルビトール、マンニトール、トレオゾール、キシリトール又はこれらの混合物であることを特徴とする請求項6に記載のフォトレジスト剥離液組成物。
- 芳香族ヒドロキシ化合物が、8−キノリノール、8−キノリノールN−オキサイド、2−キノリノール、3−キノリノール、1、2、3、4−テトラヒドロ−8−キノリノール又はこれらの混合物であることを特徴とする請求項6に記載のフォトレジスト剥離液組成物。
- 前記組成物が、さらに添加剤として界面活性剤を含むことを特徴とする請求項1に記載のフォトレジスト剥離液組成物。
- ウェットエッチング又はドライエッチング工程の中で発生する変質又は硬化されたフォトレジストを剥離するときに用いられることを特徴とする請求項1乃至請求項9のいずれか一項に記載のフォトレジスト剥離液組成物。
- 請求項1乃至請求項9のいずれか一項に記載の剥離液組成物により、半導体素子又は液晶表示素子の製造工程中に残存するフォトレジスト膜を剥離する段階を含むことを特徴とするフォトレジストの剥離方法。
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2004
- 2004-06-25 JP JP2004188301A patent/JP3953476B2/ja not_active Expired - Fee Related
- 2004-06-25 TW TW093118730A patent/TWI315030B/zh not_active IP Right Cessation
- 2004-06-26 KR KR1020040048621A patent/KR100647516B1/ko not_active IP Right Cessation
- 2004-06-28 CN CNB2004100594595A patent/CN1261827C/zh not_active Expired - Fee Related
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CN1261827C (zh) | 2006-06-28 |
KR100647516B1 (ko) | 2006-11-23 |
CN1577111A (zh) | 2005-02-09 |
TWI315030B (en) | 2009-09-21 |
JP3953476B2 (ja) | 2007-08-08 |
KR20050002573A (ko) | 2005-01-07 |
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