JP2004186324A - フレキシブル配線回路基板の製造方法 - Google Patents

フレキシブル配線回路基板の製造方法 Download PDF

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Publication number
JP2004186324A
JP2004186324A JP2002350182A JP2002350182A JP2004186324A JP 2004186324 A JP2004186324 A JP 2004186324A JP 2002350182 A JP2002350182 A JP 2002350182A JP 2002350182 A JP2002350182 A JP 2002350182A JP 2004186324 A JP2004186324 A JP 2004186324A
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JP
Japan
Prior art keywords
adhesive layer
sensitive adhesive
pressure
wiring circuit
support film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002350182A
Other languages
English (en)
Japanese (ja)
Inventor
Masanao Watanabe
正直 渡辺
Yorimichi Igari
順通 猪狩
Shuji Tsuchida
周二 土田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals Corp filed Critical Sony Chemicals Corp
Priority to JP2002350182A priority Critical patent/JP2004186324A/ja
Priority to KR1020057009485A priority patent/KR20050059342A/ko
Priority to CN200380104878XA priority patent/CN1720766B/zh
Priority to PCT/JP2003/015240 priority patent/WO2004052061A1/ja
Priority to TW092133649A priority patent/TWI235629B/zh
Publication of JP2004186324A publication Critical patent/JP2004186324A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structure Of Printed Boards (AREA)
JP2002350182A 2002-12-02 2002-12-02 フレキシブル配線回路基板の製造方法 Pending JP2004186324A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2002350182A JP2004186324A (ja) 2002-12-02 2002-12-02 フレキシブル配線回路基板の製造方法
KR1020057009485A KR20050059342A (ko) 2002-12-02 2003-11-28 유연한 배선 회로기판의 제조방법
CN200380104878XA CN1720766B (zh) 2002-12-02 2003-11-28 柔性布线电路板的制造方法
PCT/JP2003/015240 WO2004052061A1 (ja) 2002-12-02 2003-11-28 フレキシブル配線回路基板の製造方法
TW092133649A TWI235629B (en) 2002-12-02 2003-12-01 Processes for manufacturing flexible wiring circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002350182A JP2004186324A (ja) 2002-12-02 2002-12-02 フレキシブル配線回路基板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007185553A Division JP4577526B2 (ja) 2007-07-17 2007-07-17 フレキシブル配線回路基板の製造方法

Publications (1)

Publication Number Publication Date
JP2004186324A true JP2004186324A (ja) 2004-07-02

Family

ID=32463071

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002350182A Pending JP2004186324A (ja) 2002-12-02 2002-12-02 フレキシブル配線回路基板の製造方法

Country Status (5)

Country Link
JP (1) JP2004186324A (zh)
KR (1) KR20050059342A (zh)
CN (1) CN1720766B (zh)
TW (1) TWI235629B (zh)
WO (1) WO2004052061A1 (zh)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010067957A (ja) * 2008-09-15 2010-03-25 Ind Technol Res Inst フレキシブル電子デバイスに適用される基板構造およびその作製方法
EP2450724A1 (en) * 2009-07-01 2012-05-09 Asahi Glass Company, Limited Method for producing article having fine recessed and projected structure on surface, and method for producing wire grid polarizer
US8273439B2 (en) 2008-12-08 2012-09-25 Industrial Technology Research Institute Release layer materials, substrate structures comprising the same and fabrication method thereof
KR20140070843A (ko) * 2012-11-28 2014-06-11 주식회사 아모그린텍 디스플레이전극용 회로패턴 형성방법 및 이에 의해 형성된 회로패턴을 구비하는 디스플레이전극
JP2014220348A (ja) * 2013-05-08 2014-11-20 日東電工株式会社 透明回路基板の製造方法
JP2015160906A (ja) * 2014-02-27 2015-09-07 日東電工株式会社 積層体
JP2016069474A (ja) * 2014-09-29 2016-05-09 リンテック株式会社 仮固定方法および粘着シート
CN106816387A (zh) * 2015-12-01 2017-06-09 上海和辉光电有限公司 一种半导体结构激光剥离方法
JP2017168835A (ja) * 2016-03-17 2017-09-21 サムソン エレクトロ−メカニックス カンパニーリミテッド． キャリア及びキャリアが付着されたプリント回路基板
WO2018034299A1 (ja) * 2016-08-18 2018-02-22 富士フイルム株式会社 チップの製造方法および積層体

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7545042B2 (en) 2005-12-22 2009-06-09 Princo Corp. Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure
CN101127343B (zh) * 2006-08-18 2010-12-15 巨擘科技股份有限公司 结合ic整合基板与载板的结构及其制造方法与电子装置的制造方法
CN101944477B (zh) * 2009-07-03 2012-06-20 清华大学 柔性半导体器件的制造方法
CN102376590B (zh) * 2010-08-05 2013-11-27 矽品精密工业股份有限公司 芯片尺寸封装件及其制法
TWI422295B (zh) * 2011-04-27 2014-01-01 Kuo Sen Entpr Co Ltd 電子基板之製程與所應用的接著劑
DE102011106104B4 (de) * 2011-06-09 2014-04-10 Otto Bock Healthcare Products Gmbh Verfahren zum Herstellen bestückter Leiterplatten
CN102623471B (zh) * 2012-03-27 2015-09-09 格科微电子（上海）有限公司 图像传感器的封装方法
CN104063107B (zh) * 2014-06-30 2017-02-22 汕头超声显示器技术有限公司 一种基于塑料薄膜的触感电路层的制造方法
CN105428261A (zh) * 2015-12-23 2016-03-23 南通富士通微电子股份有限公司 使用uv膜固定基板的smt方法
TWI633822B (zh) * 2017-05-08 2018-08-21 欣興電子股份有限公司 線路板單元與其製作方法
CN108882562B (zh) * 2017-05-10 2020-11-10 欣兴电子股份有限公司 线路板单元与其制作方法
CN107454756B (zh) * 2017-07-12 2019-11-15 维沃移动通信有限公司 一种fpc器件贴片方法、fpc组件及终端
DE102019201281B4 (de) * 2019-01-31 2022-07-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Trägeranordnung und Verfahren zur Herstellung einer Trägeranordnung
CN110524634A (zh) * 2019-08-30 2019-12-03 中国航发动力股份有限公司 一种密封件的加工方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63209195A (ja) * 1987-02-26 1988-08-30 アルプス電気株式会社 フレキシブルプリント配線板の製造方法
JPH06264036A (ja) * 1993-03-15 1994-09-20 Sony Chem Corp マスキングテープ及びそれを用いるプリント基板の製造方法
JPH07202427A (ja) * 1993-12-29 1995-08-04 Nec Corp 有機樹脂多層配線層の製造方法
JPH0818171A (ja) * 1994-07-01 1996-01-19 Shin Etsu Chem Co Ltd フレキシブル印刷回路用基板
JP3378981B2 (ja) * 1998-05-25 2003-02-17 住友重機械工業株式会社 レーザによるプリント配線基板の切断装置及び切断方法
JP3765970B2 (ja) * 2000-07-12 2006-04-12 ソニーケミカル株式会社 エッチング液及びフレキシブル配線板の製造方法

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8173249B2 (en) 2008-09-15 2012-05-08 Industrial Technology Research Institute Substrate structures applied in flexible electrical devices and fabrication method thereof
US8388779B2 (en) 2008-09-15 2013-03-05 Industrial Technology Research Institute Substrate structures applied in flexible electrical devices and fabrication method thereof
JP2010067957A (ja) * 2008-09-15 2010-03-25 Ind Technol Res Inst フレキシブル電子デバイスに適用される基板構造およびその作製方法
US8273439B2 (en) 2008-12-08 2012-09-25 Industrial Technology Research Institute Release layer materials, substrate structures comprising the same and fabrication method thereof
EP2450724A1 (en) * 2009-07-01 2012-05-09 Asahi Glass Company, Limited Method for producing article having fine recessed and projected structure on surface, and method for producing wire grid polarizer
EP2450724A4 (en) * 2009-07-01 2014-01-08 Asahi Glass Co Ltd METHOD FOR PRODUCING AN ARTICLE HAVING A FINE STRUCTURE WITH SURFACE-SAVING AND SURFACE-AND METHOD FOR PRODUCING A WIRED-GRID POLARIZER
KR101878163B1 (ko) * 2012-11-28 2018-07-16 주식회사 아모그린텍 디스플레이전극용 회로패턴 형성방법 및 이에 의해 형성된 회로패턴을 구비하는 디스플레이전극
KR20140070843A (ko) * 2012-11-28 2014-06-11 주식회사 아모그린텍 디스플레이전극용 회로패턴 형성방법 및 이에 의해 형성된 회로패턴을 구비하는 디스플레이전극
JP2014220348A (ja) * 2013-05-08 2014-11-20 日東電工株式会社 透明回路基板の製造方法
JP2015160906A (ja) * 2014-02-27 2015-09-07 日東電工株式会社 積層体
JP2016069474A (ja) * 2014-09-29 2016-05-09 リンテック株式会社 仮固定方法および粘着シート
CN106816387A (zh) * 2015-12-01 2017-06-09 上海和辉光电有限公司 一种半导体结构激光剥离方法
JP2017168835A (ja) * 2016-03-17 2017-09-21 サムソン エレクトロ−メカニックス カンパニーリミテッド． キャリア及びキャリアが付着されたプリント回路基板
WO2018034299A1 (ja) * 2016-08-18 2018-02-22 富士フイルム株式会社 チップの製造方法および積層体
KR20190022847A (ko) * 2016-08-18 2019-03-06 후지필름 가부시키가이샤 칩의 제조 방법 및 적층체
JPWO2018034299A1 (ja) * 2016-08-18 2019-04-11 富士フイルム株式会社 チップの製造方法および積層体
KR102217046B1 (ko) 2016-08-18 2021-02-22 후지필름 가부시키가이샤 칩의 제조 방법 및 적층체

Also Published As

Publication number Publication date
KR20050059342A (ko) 2005-06-17
WO2004052061A1 (ja) 2004-06-17
TW200418355A (en) 2004-09-16
CN1720766A (zh) 2006-01-11
CN1720766B (zh) 2010-11-03
TWI235629B (en) 2005-07-01

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