CN1720766A - 挠性布线电路板的制造方法 - Google Patents
挠性布线电路板的制造方法 Download PDFInfo
- Publication number
- CN1720766A CN1720766A CNA200380104878XA CN200380104878A CN1720766A CN 1720766 A CN1720766 A CN 1720766A CN A200380104878X A CNA200380104878X A CN A200380104878XA CN 200380104878 A CN200380104878 A CN 200380104878A CN 1720766 A CN1720766 A CN 1720766A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- adhesive phase
- transparent hard
- hard substrate
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 63
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 74
- 239000010410 layer Substances 0.000 claims abstract description 49
- 239000000853 adhesive Substances 0.000 claims description 78
- 230000001070 adhesive effect Effects 0.000 claims description 78
- 229920001721 polyimide Polymers 0.000 claims description 47
- 239000004642 Polyimide Substances 0.000 claims description 40
- 239000004020 conductor Substances 0.000 claims description 35
- 238000009413 insulation Methods 0.000 claims description 23
- 239000012790 adhesive layer Substances 0.000 claims description 17
- 239000002243 precursor Substances 0.000 claims description 16
- 238000003698 laser cutting Methods 0.000 claims description 15
- 239000002313 adhesive film Substances 0.000 claims description 11
- 238000003475 lamination Methods 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 7
- 239000002985 plastic film Substances 0.000 claims description 4
- 229920006255 plastic film Polymers 0.000 claims description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 abstract 3
- 238000000059 patterning Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 41
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 26
- 239000011889 copper foil Substances 0.000 description 22
- 239000011521 glass Substances 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 11
- 238000000576 coating method Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 239000010409 thin film Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 150000008065 acid anhydrides Chemical class 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical class OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 150000004985 diamines Chemical class 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 3
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 2
- 238000000280 densification Methods 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- YVNRUPSDZZZUQJ-UHFFFAOYSA-N [O].NC1=CC=CC=C1 Chemical compound [O].NC1=CC=CC=C1 YVNRUPSDZZZUQJ-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 210000002469 basement membrane Anatomy 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Abstract
Description
Claims (8)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP350182/2002 | 2002-12-02 | ||
JP2002350182A JP2004186324A (ja) | 2002-12-02 | 2002-12-02 | フレキシブル配線回路基板の製造方法 |
PCT/JP2003/015240 WO2004052061A1 (ja) | 2002-12-02 | 2003-11-28 | フレキシブル配線回路基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1720766A true CN1720766A (zh) | 2006-01-11 |
CN1720766B CN1720766B (zh) | 2010-11-03 |
Family
ID=32463071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200380104878XA Expired - Fee Related CN1720766B (zh) | 2002-12-02 | 2003-11-28 | 柔性布线电路板的制造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2004186324A (zh) |
KR (1) | KR20050059342A (zh) |
CN (1) | CN1720766B (zh) |
TW (1) | TWI235629B (zh) |
WO (1) | WO2004052061A1 (zh) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101127343B (zh) * | 2006-08-18 | 2010-12-15 | 巨擘科技股份有限公司 | 结合ic整合基板与载板的结构及其制造方法与电子装置的制造方法 |
US7993973B2 (en) | 2005-12-22 | 2011-08-09 | Princo Corp. | Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure |
CN102376590A (zh) * | 2010-08-05 | 2012-03-14 | 矽品精密工业股份有限公司 | 芯片尺寸封装件及其制法 |
CN101944477B (zh) * | 2009-07-03 | 2012-06-20 | 清华大学 | 柔性半导体器件的制造方法 |
CN102623471A (zh) * | 2012-03-27 | 2012-08-01 | 格科微电子(上海)有限公司 | 图像传感器的封装方法 |
CN102740601A (zh) * | 2011-04-27 | 2012-10-17 | 浙江国森精细化工科技有限公司 | 电子基板之制程与所应用的接着剂 |
TWI508639B (zh) * | 2011-06-09 | 2015-11-11 | 奧圖波克保健產品有限公司 | 製造電路板的方法和電路板總成 |
CN105428261A (zh) * | 2015-12-23 | 2016-03-23 | 南通富士通微电子股份有限公司 | 使用uv膜固定基板的smt方法 |
CN104063107B (zh) * | 2014-06-30 | 2017-02-22 | 汕头超声显示器技术有限公司 | 一种基于塑料薄膜的触感电路层的制造方法 |
CN106816387A (zh) * | 2015-12-01 | 2017-06-09 | 上海和辉光电有限公司 | 一种半导体结构激光剥离方法 |
CN107454756A (zh) * | 2017-07-12 | 2017-12-08 | 维沃移动通信有限公司 | 一种fpc器件贴片方法、fpc组件及终端 |
CN108882562A (zh) * | 2017-05-10 | 2018-11-23 | 欣兴电子股份有限公司 | 线路板单元与其制作方法 |
CN109417058A (zh) * | 2016-08-18 | 2019-03-01 | 富士胶片株式会社 | 晶片的制造方法及层叠体 |
CN110524634A (zh) * | 2019-08-30 | 2019-12-03 | 中国航发动力股份有限公司 | 一种密封件的加工方法 |
CN113615324A (zh) * | 2019-01-31 | 2021-11-05 | 弗劳恩霍夫应用研究促进协会 | 承载件布置和用于制备承载件布置的方法 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI354854B (en) | 2008-09-15 | 2011-12-21 | Ind Tech Res Inst | Substrate structures applied in flexible electrica |
US8273439B2 (en) | 2008-12-08 | 2012-09-25 | Industrial Technology Research Institute | Release layer materials, substrate structures comprising the same and fabrication method thereof |
JP5273248B2 (ja) * | 2009-07-01 | 2013-08-28 | 旭硝子株式会社 | 微細凹凸構造を表面に有する物品の製造方法およびワイヤグリッド型偏光子の製造方法 |
KR101878163B1 (ko) * | 2012-11-28 | 2018-07-16 | 주식회사 아모그린텍 | 디스플레이전극용 회로패턴 형성방법 및 이에 의해 형성된 회로패턴을 구비하는 디스플레이전극 |
JP2014220348A (ja) * | 2013-05-08 | 2014-11-20 | 日東電工株式会社 | 透明回路基板の製造方法 |
JP6318398B2 (ja) * | 2014-02-27 | 2018-05-09 | 日東電工株式会社 | 積層体 |
JP6356564B2 (ja) * | 2014-09-29 | 2018-07-11 | リンテック株式会社 | 粘着シート |
KR20170108322A (ko) * | 2016-03-17 | 2017-09-27 | 삼성전기주식회사 | 캐리어 및 캐리어가 접착된 인쇄회로기판 |
TWI633822B (zh) * | 2017-05-08 | 2018-08-21 | 欣興電子股份有限公司 | 線路板單元與其製作方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63209195A (ja) * | 1987-02-26 | 1988-08-30 | アルプス電気株式会社 | フレキシブルプリント配線板の製造方法 |
JPH06264036A (ja) * | 1993-03-15 | 1994-09-20 | Sony Chem Corp | マスキングテープ及びそれを用いるプリント基板の製造方法 |
JPH07202427A (ja) * | 1993-12-29 | 1995-08-04 | Nec Corp | 有機樹脂多層配線層の製造方法 |
JPH0818171A (ja) * | 1994-07-01 | 1996-01-19 | Shin Etsu Chem Co Ltd | フレキシブル印刷回路用基板 |
JP3378981B2 (ja) * | 1998-05-25 | 2003-02-17 | 住友重機械工業株式会社 | レーザによるプリント配線基板の切断装置及び切断方法 |
JP3765970B2 (ja) * | 2000-07-12 | 2006-04-12 | ソニーケミカル株式会社 | エッチング液及びフレキシブル配線板の製造方法 |
-
2002
- 2002-12-02 JP JP2002350182A patent/JP2004186324A/ja active Pending
-
2003
- 2003-11-28 CN CN200380104878XA patent/CN1720766B/zh not_active Expired - Fee Related
- 2003-11-28 WO PCT/JP2003/015240 patent/WO2004052061A1/ja active Application Filing
- 2003-11-28 KR KR1020057009485A patent/KR20050059342A/ko not_active Application Discontinuation
- 2003-12-01 TW TW092133649A patent/TWI235629B/zh not_active IP Right Cessation
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7993973B2 (en) | 2005-12-22 | 2011-08-09 | Princo Corp. | Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure |
CN101127343B (zh) * | 2006-08-18 | 2010-12-15 | 巨擘科技股份有限公司 | 结合ic整合基板与载板的结构及其制造方法与电子装置的制造方法 |
CN101944477B (zh) * | 2009-07-03 | 2012-06-20 | 清华大学 | 柔性半导体器件的制造方法 |
CN102376590A (zh) * | 2010-08-05 | 2012-03-14 | 矽品精密工业股份有限公司 | 芯片尺寸封装件及其制法 |
CN102376590B (zh) * | 2010-08-05 | 2013-11-27 | 矽品精密工业股份有限公司 | 芯片尺寸封装件及其制法 |
CN102740601A (zh) * | 2011-04-27 | 2012-10-17 | 浙江国森精细化工科技有限公司 | 电子基板之制程与所应用的接着剂 |
CN102740601B (zh) * | 2011-04-27 | 2015-01-28 | 浙江国森精细化工科技有限公司 | 电子基板之制程与所应用的接着剂 |
TWI508639B (zh) * | 2011-06-09 | 2015-11-11 | 奧圖波克保健產品有限公司 | 製造電路板的方法和電路板總成 |
CN102623471A (zh) * | 2012-03-27 | 2012-08-01 | 格科微电子(上海)有限公司 | 图像传感器的封装方法 |
CN102623471B (zh) * | 2012-03-27 | 2015-09-09 | 格科微电子(上海)有限公司 | 图像传感器的封装方法 |
CN104063107B (zh) * | 2014-06-30 | 2017-02-22 | 汕头超声显示器技术有限公司 | 一种基于塑料薄膜的触感电路层的制造方法 |
CN106816387A (zh) * | 2015-12-01 | 2017-06-09 | 上海和辉光电有限公司 | 一种半导体结构激光剥离方法 |
CN105428261A (zh) * | 2015-12-23 | 2016-03-23 | 南通富士通微电子股份有限公司 | 使用uv膜固定基板的smt方法 |
CN109417058A (zh) * | 2016-08-18 | 2019-03-01 | 富士胶片株式会社 | 晶片的制造方法及层叠体 |
CN108882562A (zh) * | 2017-05-10 | 2018-11-23 | 欣兴电子股份有限公司 | 线路板单元与其制作方法 |
CN108882562B (zh) * | 2017-05-10 | 2020-11-10 | 欣兴电子股份有限公司 | 线路板单元与其制作方法 |
CN107454756A (zh) * | 2017-07-12 | 2017-12-08 | 维沃移动通信有限公司 | 一种fpc器件贴片方法、fpc组件及终端 |
CN107454756B (zh) * | 2017-07-12 | 2019-11-15 | 维沃移动通信有限公司 | 一种fpc器件贴片方法、fpc组件及终端 |
CN113615324A (zh) * | 2019-01-31 | 2021-11-05 | 弗劳恩霍夫应用研究促进协会 | 承载件布置和用于制备承载件布置的方法 |
CN110524634A (zh) * | 2019-08-30 | 2019-12-03 | 中国航发动力股份有限公司 | 一种密封件的加工方法 |
Also Published As
Publication number | Publication date |
---|---|
TW200418355A (en) | 2004-09-16 |
TWI235629B (en) | 2005-07-01 |
CN1720766B (zh) | 2010-11-03 |
WO2004052061A1 (ja) | 2004-06-17 |
JP2004186324A (ja) | 2004-07-02 |
KR20050059342A (ko) | 2005-06-17 |
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