KR20050059342A - 유연한 배선 회로기판의 제조방법 - Google Patents

유연한 배선 회로기판의 제조방법 Download PDF

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Publication number
KR20050059342A
KR20050059342A KR1020057009485A KR20057009485A KR20050059342A KR 20050059342 A KR20050059342 A KR 20050059342A KR 1020057009485 A KR1020057009485 A KR 1020057009485A KR 20057009485 A KR20057009485 A KR 20057009485A KR 20050059342 A KR20050059342 A KR 20050059342A
Authority
KR
South Korea
Prior art keywords
wiring circuit
adhesive layer
circuit board
manufacturing
sensitive adhesive
Prior art date
Application number
KR1020057009485A
Other languages
English (en)
Korean (ko)
Inventor
마사나오 와타나베
요리미치 이가리
슈지 쯔치다
Original Assignee
소니 케미카루 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 소니 케미카루 가부시키가이샤 filed Critical 소니 케미카루 가부시키가이샤
Publication of KR20050059342A publication Critical patent/KR20050059342A/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
KR1020057009485A 2002-12-02 2003-11-28 유연한 배선 회로기판의 제조방법 KR20050059342A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2002-00350182 2002-12-02
JP2002350182A JP2004186324A (ja) 2002-12-02 2002-12-02 フレキシブル配線回路基板の製造方法

Publications (1)

Publication Number Publication Date
KR20050059342A true KR20050059342A (ko) 2005-06-17

Family

ID=32463071

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057009485A KR20050059342A (ko) 2002-12-02 2003-11-28 유연한 배선 회로기판의 제조방법

Country Status (5)

Country Link
JP (1) JP2004186324A (zh)
KR (1) KR20050059342A (zh)
CN (1) CN1720766B (zh)
TW (1) TWI235629B (zh)
WO (1) WO2004052061A1 (zh)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7545042B2 (en) 2005-12-22 2009-06-09 Princo Corp. Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure
CN101127343B (zh) * 2006-08-18 2010-12-15 巨擘科技股份有限公司 结合ic整合基板与载板的结构及其制造方法与电子装置的制造方法
TWI354854B (en) 2008-09-15 2011-12-21 Ind Tech Res Inst Substrate structures applied in flexible electrica
US8273439B2 (en) 2008-12-08 2012-09-25 Industrial Technology Research Institute Release layer materials, substrate structures comprising the same and fabrication method thereof
KR20120106923A (ko) * 2009-07-01 2012-09-27 아사히 가라스 가부시키가이샤 미세 요철 구조를 표면에 갖는 물품의 제조 방법 및 와이어 그리드형 편광자의 제조 방법
CN101944477B (zh) * 2009-07-03 2012-06-20 清华大学 柔性半导体器件的制造方法
CN102376590B (zh) * 2010-08-05 2013-11-27 矽品精密工业股份有限公司 芯片尺寸封装件及其制法
TWI422295B (zh) * 2011-04-27 2014-01-01 Kuo Sen Entpr Co Ltd 電子基板之製程與所應用的接著劑
DE102011106104B4 (de) * 2011-06-09 2014-04-10 Otto Bock Healthcare Products Gmbh Verfahren zum Herstellen bestückter Leiterplatten
CN102623471B (zh) * 2012-03-27 2015-09-09 格科微电子（上海）有限公司 图像传感器的封装方法
KR101878163B1 (ko) * 2012-11-28 2018-07-16 주식회사 아모그린텍 디스플레이전극용 회로패턴 형성방법 및 이에 의해 형성된 회로패턴을 구비하는 디스플레이전극
JP2014220348A (ja) * 2013-05-08 2014-11-20 日東電工株式会社 透明回路基板の製造方法
JP6318398B2 (ja) * 2014-02-27 2018-05-09 日東電工株式会社 積層体
CN104063107B (zh) * 2014-06-30 2017-02-22 汕头超声显示器技术有限公司 一种基于塑料薄膜的触感电路层的制造方法
JP6356564B2 (ja) * 2014-09-29 2018-07-11 リンテック株式会社 粘着シート
CN106816387B (zh) * 2015-12-01 2019-06-25 上海和辉光电有限公司 一种半导体结构激光剥离方法
CN105428261A (zh) * 2015-12-23 2016-03-23 南通富士通微电子股份有限公司 使用uv膜固定基板的smt方法
KR20170108322A (ko) * 2016-03-17 2017-09-27 삼성전기주식회사 캐리어 및 캐리어가 접착된 인쇄회로기판
TWI723206B (zh) * 2016-08-18 2021-04-01 日商富士軟片股份有限公司 晶片的製造方法
TWI633822B (zh) * 2017-05-08 2018-08-21 欣興電子股份有限公司 線路板單元與其製作方法
CN108882562B (zh) * 2017-05-10 2020-11-10 欣兴电子股份有限公司 线路板单元与其制作方法
CN107454756B (zh) * 2017-07-12 2019-11-15 维沃移动通信有限公司 一种fpc器件贴片方法、fpc组件及终端
DE102019201281B4 (de) * 2019-01-31 2022-07-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Trägeranordnung und Verfahren zur Herstellung einer Trägeranordnung
CN110524634A (zh) * 2019-08-30 2019-12-03 中国航发动力股份有限公司 一种密封件的加工方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63209195A (ja) * 1987-02-26 1988-08-30 アルプス電気株式会社 フレキシブルプリント配線板の製造方法
JPH06264036A (ja) * 1993-03-15 1994-09-20 Sony Chem Corp マスキングテープ及びそれを用いるプリント基板の製造方法
JPH07202427A (ja) * 1993-12-29 1995-08-04 Nec Corp 有機樹脂多層配線層の製造方法
JPH0818171A (ja) * 1994-07-01 1996-01-19 Shin Etsu Chem Co Ltd フレキシブル印刷回路用基板
JP3378981B2 (ja) * 1998-05-25 2003-02-17 住友重機械工業株式会社 レーザによるプリント配線基板の切断装置及び切断方法
JP3765970B2 (ja) * 2000-07-12 2006-04-12 ソニーケミカル株式会社 エッチング液及びフレキシブル配線板の製造方法

Also Published As

Publication number Publication date
WO2004052061A1 (ja) 2004-06-17
TW200418355A (en) 2004-09-16
JP2004186324A (ja) 2004-07-02
CN1720766A (zh) 2006-01-11
CN1720766B (zh) 2010-11-03
TWI235629B (en) 2005-07-01

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