JP2001516146A5 - - Google Patents

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Publication number
JP2001516146A5
JP2001516146A5 JP2000510165A JP2000510165A JP2001516146A5 JP 2001516146 A5 JP2001516146 A5 JP 2001516146A5 JP 2000510165 A JP2000510165 A JP 2000510165A JP 2000510165 A JP2000510165 A JP 2000510165A JP 2001516146 A5 JP2001516146 A5 JP 2001516146A5
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JP
Japan
Prior art keywords
copper
layer
cvd
barrier layer
conductive metal
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JP2000510165A
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English (en)
Japanese (ja)
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JP4615707B2 (ja
JP2001516146A (ja
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Priority claimed from US08/914,521 external-priority patent/US5989623A/en
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Publication of JP2001516146A publication Critical patent/JP2001516146A/ja
Publication of JP2001516146A5 publication Critical patent/JP2001516146A5/ja
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Publication of JP4615707B2 publication Critical patent/JP4615707B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000510165A 1997-08-19 1998-08-17 デュアルダマシン金属化方法 Expired - Fee Related JP4615707B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/914,521 1997-08-19
US08/914,521 US5989623A (en) 1997-08-19 1997-08-19 Dual damascene metallization
PCT/US1998/017010 WO1999009593A1 (en) 1997-08-19 1998-08-17 Dual damascene metallization

Publications (3)

Publication Number Publication Date
JP2001516146A JP2001516146A (ja) 2001-09-25
JP2001516146A5 true JP2001516146A5 (enExample) 2009-11-19
JP4615707B2 JP4615707B2 (ja) 2011-01-19

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JP2000510165A Expired - Fee Related JP4615707B2 (ja) 1997-08-19 1998-08-17 デュアルダマシン金属化方法

Country Status (6)

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US (2) US5989623A (enExample)
EP (1) EP1021827B1 (enExample)
JP (1) JP4615707B2 (enExample)
KR (1) KR100506139B1 (enExample)
DE (1) DE69837674T2 (enExample)
WO (1) WO1999009593A1 (enExample)

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