IN187964B - - Google Patents

Info

Publication number
IN187964B
IN187964B IN1613CA1995A IN187964B IN 187964 B IN187964 B IN 187964B IN 1613CA1995 A IN1613CA1995 A IN 1613CA1995A IN 187964 B IN187964 B IN 187964B
Authority
IN
India
Prior art keywords
pads
holes
tarnish
metal
immersion
Prior art date
Application number
Other languages
English (en)
Inventor
Andrew Mcintosh Soutar
Peter Thomas Mcgrath
Original Assignee
Alpha Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=10765791&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=IN187964(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Alpha Metals Ltd filed Critical Alpha Metals Ltd
Publication of IN187964B publication Critical patent/IN187964B/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/244Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/42Coating with noble metals
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Structure Of Printed Boards (AREA)
  • Chemically Coating (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Paper (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Reinforced Plastic Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
IN1613CA1995 1994-12-09 1995-12-11 IN187964B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9425031.3A GB9425031D0 (en) 1994-12-09 1994-12-09 Printed circuit board manufacture

Publications (1)

Publication Number Publication Date
IN187964B true IN187964B (de) 2002-08-03

Family

ID=10765791

Family Applications (1)

Application Number Title Priority Date Filing Date
IN1613CA1995 IN187964B (de) 1994-12-09 1995-12-11

Country Status (14)

Country Link
US (5) US6395329B2 (de)
EP (1) EP0797690B1 (de)
JP (1) JPH08255968A (de)
KR (1) KR100382056B1 (de)
CN (1) CN1071806C (de)
AT (1) ATE183246T1 (de)
AU (1) AU4181996A (de)
DE (2) DE69511434T2 (de)
FI (1) FI972423A (de)
GB (1) GB9425031D0 (de)
HK (1) HK1002869A1 (de)
IN (1) IN187964B (de)
TW (1) TW301844B (de)
WO (1) WO1996017975A1 (de)

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GB9425031D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
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DE797690T1 (de) 1998-02-19
US20010022989A1 (en) 2001-09-20
CN1071806C (zh) 2001-09-26
CN1175285A (zh) 1998-03-04
US20020152925A1 (en) 2002-10-24
EP0797690A1 (de) 1997-10-01
AU4181996A (en) 1996-06-26
WO1996017975A1 (en) 1996-06-13
US9072203B2 (en) 2015-06-30
GB9425031D0 (en) 1995-02-08
KR100382056B1 (ko) 2003-07-10
EP0797690B1 (de) 1999-08-11
US20110192638A1 (en) 2011-08-11
US20020150692A1 (en) 2002-10-17
ATE183246T1 (de) 1999-08-15
HK1002869A1 (en) 1998-09-25
JPH08255968A (ja) 1996-10-01
TW301844B (de) 1997-04-01
US6860925B2 (en) 2005-03-01
FI972423A (fi) 1997-08-06
DE69511434D1 (de) 1999-09-16
FI972423A0 (fi) 1997-06-06
US6395329B2 (en) 2002-05-28
US20110279991A1 (en) 2011-11-17
DE69511434T2 (de) 2000-05-04
US20120052211A2 (en) 2012-03-01

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