GB2133040B - Copper plating bath process and anode therefore - Google Patents

Copper plating bath process and anode therefore

Info

Publication number
GB2133040B
GB2133040B GB08400009A GB8400009A GB2133040B GB 2133040 B GB2133040 B GB 2133040B GB 08400009 A GB08400009 A GB 08400009A GB 8400009 A GB8400009 A GB 8400009A GB 2133040 B GB2133040 B GB 2133040B
Authority
GB
United Kingdom
Prior art keywords
anode
plating bath
copper plating
bath process
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08400009A
Other versions
GB2133040A (en
GB8400009D0 (en
Inventor
Lillie C Tomaszewski
Thaddeus W Tomaszewski
Robert A Tremmel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMI International Corp
Original Assignee
OMI International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/455,353 external-priority patent/US4469569A/en
Priority claimed from US06/551,135 external-priority patent/US4462874A/en
Application filed by OMI International Corp filed Critical OMI International Corp
Publication of GB8400009D0 publication Critical patent/GB8400009D0/en
Publication of GB2133040A publication Critical patent/GB2133040A/en
Application granted granted Critical
Publication of GB2133040B publication Critical patent/GB2133040B/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
GB08400009A 1983-01-03 1984-01-03 Copper plating bath process and anode therefore Expired GB2133040B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/455,353 US4469569A (en) 1983-01-03 1983-01-03 Cyanide-free copper plating process
US06/551,135 US4462874A (en) 1983-11-16 1983-11-16 Cyanide-free copper plating process

Publications (3)

Publication Number Publication Date
GB8400009D0 GB8400009D0 (en) 1984-02-08
GB2133040A GB2133040A (en) 1984-07-18
GB2133040B true GB2133040B (en) 1987-02-04

Family

ID=27037829

Family Applications (2)

Application Number Title Priority Date Filing Date
GB08400009A Expired GB2133040B (en) 1983-01-03 1984-01-03 Copper plating bath process and anode therefore
GB08529856A Expired GB2167447B (en) 1983-01-03 1985-12-04 Cyanide free copper plating process

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB08529856A Expired GB2167447B (en) 1983-01-03 1985-12-04 Cyanide free copper plating process

Country Status (8)

Country Link
AU (1) AU575037B2 (en)
BR (1) BR8400007A (en)
CA (1) CA1225064A (en)
DE (1) DE3347593A1 (en)
ES (2) ES528624A0 (en)
FR (1) FR2538815B1 (en)
GB (2) GB2133040B (en)
MX (1) MX165687B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4933051A (en) * 1989-07-24 1990-06-12 Omi International Corporation Cyanide-free copper plating process
CA2053342A1 (en) * 1990-10-22 1992-04-23 Robert A. Tremmel Nickel electroplating process with reduced nickel ion build up
KR100877923B1 (en) 2001-06-07 2009-01-12 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 Electrolytic copper plating method
CN102605401B (en) * 2012-03-23 2015-11-18 如皋市易达电子有限责任公司 The online tin recovery structure of a kind of surface processing trough
DE102013021502A1 (en) 2013-12-19 2015-06-25 Schlenk Metallfolien Gmbh & Co. Kg Electrically conductive fluids based on metal diphosphonate complexes
CN113652720B (en) * 2021-07-15 2023-06-13 江门市瑞期精细化学工程有限公司 Cyanide-free copper plating bottoming method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB539882A (en) * 1939-09-16 1941-09-26 Mond Nickel Co Ltd Improvements relating to apparatus for electroplating
DE1496917A1 (en) * 1964-09-22 1969-05-22 Monsanto Co Electrolytic baths and processes for the production of galvanic coatings
US3796634A (en) * 1970-03-19 1974-03-12 Us Health Education & Welfare Insolubilized biologically active enzymes
BE791401A (en) * 1971-11-15 1973-05-14 Monsanto Co ELECTROCHEMICAL COMPOSITIONS AND PROCESSES
NL7306732A (en) * 1972-05-17 1973-11-20
US3806429A (en) * 1972-07-03 1974-04-23 Oxy Metal Finishing Corp Electrodeposition of bright nickel-iron deposits,electrolytes therefor and coating an article with a composite nickel-iron,chromium coating
US3833486A (en) * 1973-03-26 1974-09-03 Lea Ronal Inc Cyanide-free electroplating
US3914162A (en) * 1973-06-25 1975-10-21 Monsanto Co Compositions and process for the electrodeposition of metals
US3928147A (en) * 1973-10-09 1975-12-23 Monsanto Co Method for electroplating
US3879270A (en) * 1974-01-10 1975-04-22 Monsanto Co Compositions and process for the electrodeposition of metals
GB1419613A (en) * 1974-06-13 1975-12-31 Lea Ronal Inc Cyanidefree electroplating baths
US3974044A (en) * 1975-03-31 1976-08-10 Oxy Metal Industries Corporation Bath and method for the electrodeposition of bright nickel-iron deposits
US4179343A (en) * 1979-02-12 1979-12-18 Oxy Metal Industries Corporation Electroplating bath and process for producing bright, high-leveling nickel iron electrodeposits
DE3012168A1 (en) * 1980-03-27 1981-10-01 Schering Ag Berlin Und Bergkamen, 1000 Berlin METHOD FOR GALVANIC DEPOSITION OF COPPER DEPOSITS

Also Published As

Publication number Publication date
ES8506112A1 (en) 1985-06-16
DE3347593A1 (en) 1984-07-05
BR8400007A (en) 1984-07-31
GB2133040A (en) 1984-07-18
GB2167447B (en) 1987-03-04
ES8501454A1 (en) 1984-12-01
AU575037B2 (en) 1988-07-21
ES535227A0 (en) 1985-06-16
FR2538815B1 (en) 1990-02-02
AU2305483A (en) 1984-07-05
CA1225064A (en) 1987-08-04
DE3347593C2 (en) 1990-05-31
ES528624A0 (en) 1984-12-01
GB8400009D0 (en) 1984-02-08
GB2167447A (en) 1986-05-29
MX165687B (en) 1992-11-27
GB8529856D0 (en) 1986-01-15
FR2538815A1 (en) 1984-07-06

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20030103